100 Base-X Interface Module ELECTRONICS INC. EPF8019GM • Optimized to work with ML6692/94 PHY chip • • Guaranteed to operate with 8 mA DC bias at 70°C on cable side • • Complies with or exceeds IEEE 802.3, 100 BX Standards • • Robust construction allows for severe soldering processes • Electrical Parameters @ 25° C Insertion Loss (dB Max.) OCL (µH Min.) 1-80 MHz 100 KHz, 0.1 Vrms 8 mA DC Bias @ 70°C 80-100 MHz Xmit Rcv Xmit Cable Side -1 350 Return Loss (dB Min.) -1 Rcv -2 -2 1-30 MHz 30-60 MHz Xmit Rcv Xmit Rcv -18 -12 -18 -12 Common Mode Rejection (dB Min.) 60-100 MHz Xmit -8 1-30 MHz 30-100 MHz Crosstalk (dB Min.) [Between Channels] Rcv Xmit Rcv Xmit Rcv Xmit Rcv -10 -40 -30 -30 -25 -25 -40 1-100 MHz 100-200 MHz -40 Isolation : 1500 Vrms • Cable Impedance : 100 Ω • • Schematic Transmit Channel Receive Channel 1:1:1 2CT:1 Chip Side 16 7 1 Cable Side 2 3 10 15 13 Chip Side 8 Cable Side 9 12 Dimensions Package A N (J) Pin 1 I.D. PCA EPF8019GM Date Code B Pad Layout Q D M E C K L H PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 P F Dim. Min. A B C D E F G H I J K L M N P Q .970 .380 .225 --.010 --.500 .018 .008 --0° .025 (Inches) Max. Nom. .990 .400 .245 --.015 --.520 .022 .012 --8° .045 .980 .390 .235 .700 .013 .100 .510 .020 .010 .140 --.035 .030 .100 .090 .560 (Millimeters) Min. Max. Nom. 24.64 9.65 5.72 --.254 --12.70 .457 .203 --0° .635 25.15 10.16 6.22 --.381 --13.20 .559 .305 --8° 1.14 24.89 9.91 5.97 17.78 .330 2.54 12.95 .508 .254 3.56 --.889 .762 2.54 2.29 14.22 I G CSF8019GMa Rev. B 10/20/98 Product performance is limited to specified parameters. Data is subject to change without prior notice. TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com 100 Base-X Interface Module ELECTRONICS INC. EPF8019GM The circuit below is a guideline for interconnecting PCA’s EPF8019GM with ML6692 or ML6694 chip applications. Further details can be obtained from the chip manufacturer application notes. Typical insertion loss of the isolation transformer is 0.5dB. This parameter covers the entire spectrum of the encoded signals in 100 BX protocol. Under terminated conditions, to transmit a 2V pk-pk signal across the cable, you must adjust the chips supporting resistor to get at least 2.12V pk-pk across the transmit pins. Note that in the 100 BX application, you need to use only one half of the RCV side primary winding and terminate it with 50 Ω balanced load as shown. The phantom resistors shown around the connector have been known to suppress unwanted radiation that unused wires pick up from the immediate environment. Their placement and use are to be considered carefully before a design is finalized. It is recommended that there be a neat separation of ground planes in the layout. It is generally accepted practice to limit the plane off at least 0.05 inches away from the chip side pins of EPF8019GM. There need not be any ground plane beyond this plane. For best results, PCB designer should design the outgoing traces preferably to be 50 Ω, balanced and well coupled to achieve minimum radiation from these traces. Typical Application Circuit for UTP ML6692 or ML6694 1 Xmit 2 7 8 200Ω 200Ω 2 3 Rcv 6 10 TX+ 1 TX- 3 RX+ 13 RX- 12 9 RJ45* 50Ω 4 5 50Ω 7 50Ω 50Ω 8 Capacitor EPF8019GM High Voltage Capacitor Chassis Ground Notes : * NIC Side is shown. Hub side connection will swap pins 3-6 with 1-2. PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 CSF8019GMb Rev. B 10/20/98 TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com