PIXART PAS106BBB-283

PAS106BCB-283
PAS106BBB-283
PAS106BCB-283 SINGLE-CHIP CMOS CIF COLOR DIGITAL IMAGE SENSOR
PAS106BBB-283 SINGLE-CHIP CMOS CIF B&W DIGITAL IMAGE SENSOR
General Description
The PAS106BCB-283/PAS106BBB-283 is a highly integrated CMOS active-pixel image sensor that has a CIF
resolution of 356H x 292V. To have an excellent image quality, the PAS106BCB-283/PAS106BBB-283 outputs
10-bit RGB raw data through a parallel data bus. It is available in color or monochrome in 28-pin LCC package.
The PAS106BCB-283/PAS106BBB-283 can be programmed to set the exposure time for different luminance
condition via I2CTM serial control bus. By programming the internal register sets, it performs on-chip frame rate
adjustment, offset correction DAC and programmable gain control.
Features
§ CIF(356 x 292 pixels) resolution, ~1/5” Lens
Key Specification
Supply Voltage
3.3V + 5%
§ On-chip 10-bit pipelined A/D converter
Array formate
356(H) x 292(V)
§ Output formats: 10-bit parallel RGB raw data
Optical format
~1/5 ”
§ On-chip 6-bit (1 sign bit+ 5 magnitude bit)
background compensation DAC
Pixel Size
7.25µm x 7.25µm
Frame rate
30 fps
§ Bayer-RGB color filter array
§ On-chip programmable gain amplifier
q
5-bit color gain amplifier(x4)
q
5-bit global gain amplifier (x5)
§ Continuous variable frame time(1/2sec~1/30sec)
System clock
Max. pixel rate
Up to 48 MHz
4 MHz
§ Continuous variable exposure time
§ I2C Interface
§ Digitally programmable registers
§ Single 3.3V supply voltage
§ 100 mW low power dissipation
Sensitivity
1.0V/lux-sec
PGA gain
31.6 dB ma x.
Color filter
Exposure Time
RGB Bayer Pattern
~ Frame time to 1/ 160000
Scan Mode
Progressive
S/N Ratio
>45dB
Package
28 pin LCC
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
1. Pin Assignment
PIN No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
PIN NAME
VLRST
VSSA
VRB
VRT
VDDA
VDDAY
VSSAY
CSB
PXD<9>
PXD<8>
PXD<7>
PXD<6>
PXD<5>
PXD<4>
VDDQ
VSSQ
PXD<3>
PXD<2>
PXD<1>
PXD<0>
PXCLK
HSYNC
VSYNC
SYSCLK
SCL
SDA
VDDD
VSSD
Type
BIAS
GND
BYPASS
BYPASS
PWR
PWR
GND
IN
OUT
OUT
OUT
OUT
OUT
OUT
PWR
GND
OUT
OUT
OUT
OUT
OUT
OUT
OUT
IN
IN
I/O
PWR
GND
Definition
Fixed bias input voltage, 1.65V
Analog ground
Analog voltage reference
Analog voltage reference
Analog VDD, 3.3V
Analog VDD, 3.3V
Analog ground
Chip select (Low active, chip disabled if high)
Digital data output
Digital data output
Digital data output
Digital data output
Digital data output
Digital data output
Digital VDD, 3.3V
Digital ground
Digital data output
Digital data output
Digital data output
Digital data output
Pixel clock output
Horizontal Synchronization clock
Vertical Synchronization clock
Master clock input
I2C clock
I2C bi-directional data
Digital VDD, 3.3V
Digital ground
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
Row Decoders
2. Block Diagram
6-bit
+/-1V
DAC
Sensor Array
Color gain
B,G1,G2,R
5-bits
X4
CDS ckts
Col. Decoders
Global gain
5-bits
X5
cmd
Timing
&
Digital Control
10-bit
pipelined
ADC
Pxo<9:0>
PXCLK
Vsync
Hsync
Register
sets
SDA
SCL
SysClk
I2C
Interface
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
3. Pixel Array And Pixel Color Pattern
The output image format of PAS106BCB-283/PAS106BBB-283 is CIF (352x288 pixel array). To provide the
co-processor with the extra information it needs for interpolation at the edges of the pixel array, an border of 2
pixels on all 4 sides of the array are available. Fig 3.1. illustrates the pixel array and pixel color pattern.
30 dark pixel
30 dark pixel
20 R pixel
Dark pixel
G2 R G2 R
B G1 B G1
G2 R G2 R
30 dark pixel
20 G pixel
R
30 dark pixel
20 B pixel
G
B
20 pixel
No filter
Row 293
Row 292
Dark pixel
G2 R G2 R
B G1 B G1
G2 R G2 R
Array: 356(column)x 294(row)
B G1 B G1
G2 R G2 R
B G1 B G1
Dark pixel
30 dark pixel
R
G
B
No filter
20 R pixel
20 G pixel
20 B pixel
20 pixel
30 dark pixel
30 dark pixel
294 row lines
B G1 B G1
G2 R G2 R
B G1 B G1
Dark pixel
Row 1
Row 0
30 dark pixel
356 column lines
Fig 3.1. Pixel array and pixel color pattern
Note:
1.
Pixel color pattern does not apply to monochrome sensor.
2.
Pixel read-out proceeds from left to right, and from bottom row to top row.
3.
Pixel array not drawn to scale.
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
4. Output timing:
Fixed pixel clock for each line(row), 444pxclk.
4+4 blank pxclk for each line. ( See Fig 4.1. )
1+1 Dark line for each frame.(See Fig 4.2. )
Dark line output format: Fig 4.3.
line time = 80+4+2+352+2+4 = 444 pxclks
Hsync.
xx x
80 pxclks
x x x x 2+352+2 pixels out
B G1 B G1
Pxclk_a
x xx x
x x x x 2+352+2 pixels out
Note: "x" indicates don't care PXD[9:0]
Fig 4.1. Inter-line timing
Frame time (=294 lines)
Vsync.
80
Pxclks
Hsync.
Dark
80
Pxclks
Dark
B,G1,B,G1...
Dark
G2,R,G2,R...
Dark
Valid frame data (292 lines)
Fig 4.2. Inter-frame timing
4+356+4=364 pxclks
Hsync
Hsync
80
pxclks
80
pxclks
xxx x
28 dark pixels
R
G
B
No
filfter
20 R pixels
20 G pixels
20 B pixels
20 pixels
30 dark pixels
30 dark pixels
xxx x
30 dark pixels
Note: "x" indicates don't care.
Fig 4.3. Dark line output format
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
5. I2C Bus
PAS106BCB-283/PAS106BBB-283 supports I2C-bus transfer protocol and is acting as slave device. The 7
bits unique slave address is 1000000 and supports receiving / transmitting speed up to 400kHz.
5.1 I2C bus overview
§ Only two wires SDA (serial data) and SCL (serial clock) carry information between the devices connected
to the I2C bus. Normally both SDA and SCL lines are open collector structure and pull high by external
pull-up resistors.
§ Only the master can initiates a transfer (start), generates clock signals, and terminates a transfer (stop).
§ Start and stop condition: A high to low transition of the SDA line while SCL is high defines a start
condition. A low to high transition of the SDA line while SCL is high defines a stop condition. Please
refer to Fig 5.1.
§ Valid data: The data on the SDA line must be stable during the high period of the SCL clock. Within each
byte, MSB is always transferred first. Read/write control bit is the LSB of the first byte. Please refer to
Fig 5.2.
§ Both the master and slave can transmit and receive data from the bus.
§ Acknowledge: The receiving device should pull down the SDA line during high period of the SCL clock
line when a complete byte was transferred by transmitter. In the case of a master received data from a
slave, the master does not generate an acknowledgment on the last byte to indicate the end of a master
read cycle.
SDA
SCL
S
P
Start
Condition
Stop
Condition
Fig 5.1 Start and Stop Conditions
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
SDA
DATA
CHANGE
ALLOWED
DATA
STABLE
SCL
Fig 5.2 Valid Data
5.2 Data Transfer Format
5.2.1 Master transmits data to slave (write cycle)
§
S : Start
§
A : Acknowledge by slave
§
P : Stop
§
RW : The LSB of 1ST byte to decide whether current cycle is read or write cycle.
RW=1 read cycle, RW=0 write cycle.
§
SUBADDRESS : The address values of PAS106BCB-283/PAS106BBB-283 internal control
registers
(Please refer to PAS106BCB-283/PAS106BBB-283
register description)
1ST BYTE
S
SLAVE ID (7 BIT)
MSB
2ND BYTE
RW
A
n BYTEs + A
SUBADDRESS (8 BIT)
A
DATA
A
DATA
A
P
LSB=0
During write cycle, the master generates start condition and then places the 1st byte data that are combined
slave
address
(7
bits)
with
a
read/write
control
bit
to
SDA
line.
After
slave(PAS106BCB-283/PAS106BBB-283) issues acknowledgment, the master places 2nd byte (sub-address)
data on SDA line. Again follow the PAS106BCB-283/PAS106BBB-283 acknowledgment, the master places
the 8 bits data on SDA line and transmit to PAS106BCB-283/PAS106BBB-283 control register (address was
assigned by 2nd byte). After PAS106BCB-283/PAS106BBB-283 issue acknowledgment, the master can
generate a stop condition to end of this write cycle. In the condition of multi-byte write, the
PAS106BCB-283/PAS106BBB-283 sub-address is automatically increment after each DATA byte transferred.
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
The data and A cycles is repeat until last byte write. Every control registers value inside
PAS106BCB-283/PAS106BBB-283 can be programming via this way. (Please refer to Fig 5.3.)
5.2.2 Slave transmits data to master (read cycle)
§ The sub-address was taken from previous write cycle
§ The sub-address is automatically increment after each byte read
§ Am : Acknowledge by master
§ Note there is no acknowledgment from master after last byte read
1ST BYTE
S
SLAVE ADDRESS
(7 BITS)
2ND BYTE
RW
A
DATA (8 BIT)
n BYTE
Am
DATA
Am
DATA
1
P
NO ACK IN LAST
BYTE
During read cycle, the master generates start condition and then place the 1st byte data that are combined
slave address (7 bits) with a read/write control bit to SDA line. After issue acknowledgment, 8 bits DATA was
also placed on SDA line by PAS106BCB-283/PAS106BBB-283. The 8 bit data was read from
PAS106BCB-283/PAS106BBB-283 internal control register that address was assigned by previous write cycle.
Follow the master acknowledgment, the PAS106BCB-283/PAS106BBB-283 place the next 8 bits data (address
is increment automatically) on SDA line and then transmit to master serially. The DATA and Am cycles is repeat
until the last byte read. After last byte read, Am is no longer generated by master but instead by keep SDA line
high. The slave (PAS106BCB-283/PAS106BBB-283) must releases SDA line to master to generate STOP
condition. (Please refer to Fig 5.3.)
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
SDA
SCL
1-7
8
9
1-7
8
9
1-7
8
9
P
S
Start
Condition
Address
R/W
ACK
from
Receiver
Data
ACK
from
Receiver
Data
ACK
Stop
from
Condition
Receiver
Fig 5.3 Data Trans fer Format
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PAS106BCB -283/PAS106BBB-283
CMOS Image Sensor IC
5.3 I2C Bus Timing
SDA
tf
tHD;STA
tf
tLOW
tr
tBUF
tr
tSP
tSU;DAT
SCL
S
tHD;STA
t HD;DAT
tHIGH
tSU;STA
tSU;STO
Sr
P
S
5.4 I2C Bus Timing Specification
STANDARD-MODE
PARAMETER
SCL clock frequency
Hold time (repeated) START condition.
After this period, the first clock pulse is generated.
Low period of the SCL clock
HIGH period of the SCL clock
Set-up time for a repeated START condition
Data hold time. For I2C-bus device
Data set-up time
Rise time of both SDA and SCL signals
Fall time of both SDA and SCL signals
Set-up time for STOP condition
Bus free time between a STOP and START
Capacitive load for each bus line
Noise margin at the LOW level for each connected
device (including hysteresis)
Noise margin at the HIGH level for each
connected device (including hysteresis)
SYMBOL
UNIT
MIN.
MAX.
fscl
tHD:STA
10
4.0
400
-
kHz
us
tLOW
tHIGH
tSU;STA
tHD;DAT
tSU;DAT
tr
tf
tSU;STO
tBUF
Cb
VnL
4.7
0.75
4.7
0
250
30
30
4.0
4.7
1
0.1 VDD
3.45
N.D.
N.D.
15
-
us
us
us
us
ns
ns(note1)
ns(note1)
us
us
pF
V
VnH
0.2 VDD
-
V
Note1: It depends on the "high" period time of SCL.
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CMOS Image Sensor IC
6. Specifications
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Vdd
DC supply voltage
-0.5
3.8
V
Vin
DC input voltage
0.5
Vdd+0.5
V
Vout
DC output voltage
-0.5
Vdd+0.5
V
Tstg
Storage temperature
0
70
℃
DC Electrical Characteristics (VDD=3.3V±5%, Ta=0°C~40°C )
Symbol
Parameter
Min.
Typ.
3.15
3.3
Max.
Unit
Type :PWR
VDD
Analog and digital operating voltage
IDD
Operating Current
Type :IN & I/O Reset and SYSCLK
3.45
V
35
mA
VIH
Input voltage HIGH
2.0
VDD
V
VIL
Input voltage LOW
0
0.8
V
Cin
Input capacitor
10
pF
Ilkg
Input leakage current
1.0
uA
Type : OUT & I/O for PXD0:9, PXCLK, H/VSYNC & SDA, load 10pf, 1.2kΩ, 3.3 volts
VOH
Output voltage HIGH
VOL
Output voltage LOW
Vdd-0.2
V
0.2
V
Max.
Unit
48
MHz
4
MHz
AC Operating Condition
Symbol
Parameter
fsysclk
Master clock frequency
fpxclk
Pixel clock output frequency
Min.
Typ.
8
Sensor Characteristics (To be determined)
Parameter
Photo response non-uniformity
Symbol
Min.
Typ.
Max.
Unit
PRNU
1.02
%
Saturation output voltage
Vsat.
1.4
V
Dark output voltage
Vdark
52
mV/sec
Dark signal non-uniformity
DSNU
1.9
Lsb
Sensitivity ( Red channel )
R
1.2
V/Lux-sec
Sensitivity ( Green channel )
G
1.0
V/Lux-sec
Sensitivity ( Blue channel )
B
0.8
V/Lux-sec
Note
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CMOS Image Sensor IC
7. Package Information
HSYNC
VSYNC
SYSCLK
SCL
20
PXCLK
19
PXD<0>
PXD<1>
7.1. Pin Connection Diagram
21
22
23
24
25
PXD<2>
18
26
SDA
PXD<3>
17
27
VDDD
VSSQ
16
28
VSSD
VDDQ
15
PXD<4>
14
2
VSSA
PXD<5>
13
3
VRB
PXD<6>
12
4
VRT
6
5
VDDA
7
VDDAY
8
VSSAY
PXD<8>
9
CSB
10
PXD<9>
11
PXD<7>
1
VLRST
-- Bottom View --
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7.2. Package Outline
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7.3. Sensor center and Die&Package center bias
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8. Referencing Circuit Schematic
C3
CSB
PXO<9>
PXO<8>
PXO<7>
C1
C8
0.1uF 0.1uF
VDDA
10uF
18
6
5
VDDA
7
VSSAY
VDDAY
9
10
8
CSB
PXD<9>
PXD<3>
19
PXD<2>
VDDD
SDA
SCL
PXO<2>
VSSQ
C5
C6
1uF
1uF
4
3
R2
300k
2
R3
1
VDDA
28
300k
27
C7
26
0.1uF
R4 4.7K
25
17
SYSCLK
PXO<3>
VSYNC
0.1uF
300k
24
16
PAS106BCB-283 VLRST
PAS106BBB-283 VSSD
23
R1
VDDQ
VSSX
HSYNC
C2
PXD<4>
22
15
VRB
PXCLK
CSB
VRT
PXD<5>
21
14
PXD<8>
PXO<4>
PXD<6>
PXD<0>
13
PXD<1>
12
PXO<5>
20
S1
VDDD
PXO<6>
PXD<7>
11
U1
R5 4.7K
VDDD
PXO<1>
PXO<0>
PXCLK
HSYNC
VSYNC
SYSCLK
SCL
SDA
3.3V
L1
3.3UH
VDDD
VDDA
C9
C8
C11
C10
1uF
10uF
10uF
1uF
L2
DGND
3.3UH
AGND
NOTES on capacitors:
1.The 0.1uF caps for power pins
lengths LESS than 5mm.
MUST have trace
Title
2.C4,C5 and C6 for pins 2,3 and 4 MUST have
trace lengths LESS than 5mm.
pas106-283 Application circuit
Size
A4
Date:
Document Number
Jeffery
Rev
1.2
Thursday, May 16, 2002
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