PLL PL660-09

Analog Frequency Multiplier
PL660 and PL663 XO Families
DESCRIPTION
FEATURES
TM
PhaseLink’s Analog Frequency Multipliers
(AFMs) are the industry’s first “Balanced Oscillator”
utilizing analog multiplication of the fundamental
frequency (at double or quadruple frequency),
combined with an attenuation of the fundamental of
the reference crystal, without using a phase-locked
loop (PLL), in CMOS technology.
•
•
•
•
PhaseLink’s patent pending PL66x family of AFM
products can achieve up to 800 MHz differential
PECL, LVDS, or single-ended CMOS output with
little jitter or phase noise deterioration.
•
PL66x-xx family of products utilize a low-power
CMOS technology and are housed in GREEN/
RoHS compliant 16-pin TSSOP and 3x3 QFN
packages.
•
•
•
•
•
•
Non-PLL frequency multiplication
Input frequency from 30-200 MHz
Output frequency from 60-800 MHz
Low phase noise and jitter (equivalent to fundamental
at the output frequency)
Ultra-low jitter
o RMS phase jitter < 0.25 ps (12 kHz to 20 MHz)
o RMS period jitter < 2.5 ps typ.
Low phase noise
o -145 dBc/Hz @ 100 kHz offset from 155.52 MHz
o -150 dBc/Hz @ 10 MHz offset from 155.52 MHz
Low input frequency eliminates the need for expensive
crystals
Differential PECL/LVDS, or single-ended CMOS output
Single 2.5V or 3.3V +/- 10% power supply
Optional industrial temperature range (-40°C to +85°C)
Available in 16-pin GREEN/RoHS compliant TSSOP, and
16-pin 3x3 QFN packages.
rd
Figure 1: 2X AFM Phase Noise at 212.5 MHz (106.25 MHz 3 overtone crystal)
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
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Rev. 3/20/07 Page 1
Analog Frequency Multiplier
PL660 and PL663 XO Families
L2X
OE
X IN
R
O s c illa t o r
A m p lif ie r
XOUT
QBAR
F re q u e n c y
X2
F re q u e n c y
X4
Q
O n ly r e q u ir e d in x 4 d e s ig n s
L4X
Figure 2: Block Diagram of AFM XO
Figure 3 shows the period jitter histogram of the 2x Analog Frequency Multiplier at 212.5 MHz, while
Figure 4 shows the very low levels of sub-harmonics that correspond to the exceptional performance (i.e.
low jitter).
Figure 3: Period Jitter Histogram at 212.5MHz
Figure 4: Spectrum Analysis at 212.5MHz
Analog Frequency Multiplier (2x),
with 106.25 MHz crystal
Analog Frequency Multiplier (2x),
with sub-harmonics below –69 dBc
OE LOGIC SELECTION
OUTPUT
OESEL
0 (Default)
PECL
1
0 (Default)
LVDS or CMOS
1
OE
Output State
0 (Default)
1
0
1 (Default)
0
1 (Default)
0 (Default)
1
Enabled
Tri-state
Tri-state
Enabled
Tri-state
Enabled
Enabled
Tri-state
OESEL and OE: Connect to VDD to set to “1”, connect to GND to set to “0”. [The ‘Default’ state is set by internal pull up/down resistor.]
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
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Rev. 3/20/07 Page 2
Analog Frequency Multiplier
PL660 and PL663 XO Families
PRODUCT SELECTOR GUIDE
FREQUENCY VERSUS PHASE NOISE PERFORMANCE
Phase Noise at Frequency Offset From Carrier (dBc/Hz)
Input
Frequency
Range
(MHz)
Analog
Frequency
Multiplication
Factor
Output
Frequency
Range
(MHz)
Output
Type
PL660-08
30 - 80
4
120 - 320
PL660-09
30 - 80
4
PL663-07
30 - 80
PL663-08
Part
Number
Carrier
Freq.
(MHz)
10 Hz
100
Hz
1 KHz
10
KHz
100
KHz
1
MHz
10
MHz
PECL
155.52
-72
-100
-125
-132
-142
-147
-149
120 - 320
LVDS
155.52
-72
-100
-125
-132
-142
-147
-149
2
60 - 160
CMOS
156.25
-75
-105
-130
-140
-145
-150
-150
30 - 80
2
60 - 160
PECL
156.25
-75
-105
-130
-140
-145
-150
-150
PL663-09
30 - 80
2
60 - 160
LVDS
156.25
-75
-105
-130
-140
-145
-150
-150
PL663-17
75 - 140
2
150 - 280
CMOS
212.5
-70
-100
-130
-140
-145
-148
-148
PL663-18
75 - 140
2
150 - 280
PECL
212.5
-70
-100
-130
-140
-145
-148
-148
PL663-19
75 - 140
2
150 - 280
LVDS
212.5
-70
-100
-130
-140
-145
-148
-148
PL663-28
140 - 160
2
280 - 320
PECL
311.04
-60
-92
-122
-140
-142
-146
-146
PL663-29
140 - 160
2
280 - 320
LVDS
311.04
-60
-92
-122
-140
-142
-146
-148
FREQUENCY VERSUS JITTER, AND SUB-HARMONIC PERFORMANCE
Part
Number
Output
Freq.
(MHz)
RMS Period
Jitter
(ps)
Peak to Peak
Period Jitter
(ps)
RMS
Accumulated
(L.T.) Jitter (ps)
Min. Typ. Max. Min. Typ. Max. Min. Typ.
Max.
Phase Jitter
(12 KHz-20MHz)
(ps)
Min.
Typ.
Max.
Spectral Specifications / Sub-harmonic Content
(dBc)
Frequency (MHz)
Carrier
Freq.
MHz
(Fc)
@
-75%
(Fc)
@
-50%
(Fc)
@
-25%
(Fc)
@
+25%
(Fc)
@
+50%
(Fc)
@
+75%
(Fc)
PL660-08
155.52
3
5
21
30
5
0.25
155.52
-66
-61
-67
-70
PL660-09
155.52
3
5
21
30
5
0.25
155.52
-66
-61
-67
-70
PL663-07
156.25
2
3
18
20
3
0.24
156.25
-70
-75
PL663-08
156.25
2
3
18
20
3
0.24
156.25
-70
-75
PL663-09
156.25
2
3
18
20
3
0.24
156.25
-70
-75
PL663-17
212.50
2.5
4
18
20
4
0.19
212.50
-70
-75
PL663-18
212.50
2.5
4
18
20
4
0.19
212.50
-70
-75
PL663-19
212.50
2.5
4
18
20
4
0.19
212.50
-70
-75
PL663-28
311.04
2.5
4
18
20
4
0.16
311.04
-65
-70
PL663-29
311.04
2.5
4
18
20
4
0.16
311.04
-65
-70
Note: Wavecrest data 10,000 hits. No Filtering was used in Jitter Calculations.
Agilent E5500 was used for phase jitter measurements.
Spectral specifications were obtained using Agilent E7401A.
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
www.phaselink.com
Rev. 3/20/07 Page 3
Analog Frequency Multiplier
PL660 and PL663 XO Families
BOARD LAYOUT CONSIDERATIONS AND CRYSTAL SPECIFICATIONS
BOARD LAYOUT CONSIDERATIONS
To minimize parasitic effects and improve performance, do the following:
• Place the crystal as close as possible to the IC.
• Make the board traces that are connected to the crystal pins symmetrical. The board trace
symmetry is very important, as it reduces the negative parasitic effects to produce clean
frequency multiplication with low jitter.
CRYSTAL SPECIFICATIONS
Crystal
Resonator
Frequency
(FXIN)
Mode
PL660-08
PL660-09
25~75MHz
PL663-07
PL663-08
PL663-09
CL (xtal)
ESR(RE)
C0
C0/C1
Typical
Max.
Max.
Max.
Fundamental or
3rd overtone
5 pF
30 Ω
4.5 pF
N.A.
30~80MHz
Fundamental or
3rd overtone
5 pF
30 Ω
4.5 pF
N.A.
PL663-17
PL663-18
PL663-19
75~140MHz
Fundamental or
3rd overtone
5 pF
60 Ω
4.0 pF
N.A.
PL663-28
PL663-29
140~200MHz
Fundamental or
3rd overtone
5 pF
60 Ω
4.0 pF
N.A.
Part Number
Note: Non-specified parameters can be chosen as standard values from crystal suppliers.
CL ratings larger than 5pF require a crystal frequency adjustment.
Request detailed crystal specifications from PhaseLink.
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Rev. 3/20/07 Page 4
Analog Frequency Multiplier
PL660 and PL663 XO Families
EXTERNAL COMPONENT VALUES
INDUCTOR VALUE OPTIMIZATION
The required inductor value(s) for the best performance depends on the operating frequency, and the board layout
specifications. The listed values in this datasheet are based on the calculated parasitic values from PhaseLink’s
evaluation board design. These inductor values provide the user with a starting point to determine the optimum
inductor values. Additional fine-tuning may be required to determine the optimal solution.
To assist with the inductor value optimization, PhaseLink has developed the “AFM Tuning Assistant” software. You
can download this software from PhaseLink’s web site (www.phaselink.com). The software consists of two
worksheets. The first worksheet (named L2) is used to fine-tune the ‘L2’ inductor value, and the second worksheet
(named L4) is used for fine tuning of the ‘L4’ (used in 4x AFMs only) inductor value.
For those designs using PhaseLink’s recommended board layout, you can use the “AFM Tuning Assistant” to
determine the optimum values for the required inductors. This software is developed based on the parasitic
information from PhaseLink’s board layout and can be used to determine the required inductor and parallel
capacitor (see LWB1 and Cstray parameters) values. For those employing a different board layout in their design,
we recommend to use the parasitic information of their board layout to calculate the optimized inductor values.
Please use the following fine tuning procedure:
Figure 5: Diagram Representation of the Related System Inductance and Capacitance
DIE SIDE
- Cinternal = Based on AFM Device
- Cpad = 2.0 pF, Bond pad and its ESD circuitry
- C11 = 0.4 pF, The following amplifier stage
PCB side
- LWB1 = 2 nH, (2 places), Stray inductance
- Cstray = 1.0 pF, Stray capacitance
- L2X (L4X) = 2x or 4x inductor
- C2X (C4X) = range (0.1 to 2.7), Fine tune inductor if
used
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Rev. 3/20/07 Page 5
Analog Frequency Multiplier
PL660 and PL663 XO Families
• There are two default variables that normally will not need to be modified. These are Cpad, and C11 and are
found in cells B22 and B27 of ‘AFM Tuning Assistant’, respectively.
• LWB1 is the combined stray inductance in the layout. The DIE wire bond is ~ 0.6 nH and in the case of a
leaded part an additional 1.0 nH is added. Your layout inductance must be added to these. There are 2 of
these and they are assumed to be approximately symmetrical so you only need to enter this inductance once
in cell B23.
• Enter the stray parasitic capacitance into cell B26. An additional 0.5 pF must be added to this value if a
leaded part is used.
• Enter the appropriate value for Cinternal into B21 based on the device used (see column D). Use the ‘AFM
Tuning Assistant’ software to calculate L2X (and C2X if used) for your resonance frequency.
• For 4X AFMs, repeat the same procedure in the L4X worksheet.
• See the examples below.
DETERMINING STRAY L’s AND C’s IN A LAYOUT
Figure 6: Diagram Representation of PL660-08 Board Layout
Let’s take the PL660-08 (4x XO) for example, as shown in Figure 6. This takes a crystal input range of 30 to 80
MHz and multiplies this to an output of 120 to 320 MHz. To determine the stray L’s and C’s of the layout we will
assemble two test units. One AFM will be tuned to the lower range of the device (120 MHz), and the other to the
upper range of the device (320 MHz).
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Rev. 3/20/07 Page 6
Analog Frequency Multiplier
PL660 and PL663 XO Families
120 MHz AFM Tuning: Using the “AFM Tuning Assistant” find the PL660-0x in the L2X worksheet. Enter the
Cinternal value found next to it into cell B21. In cell B24 enter the closest standard inductor value (see CoilCraft
0603CS series for example) to achieve the closest peak frequency to 60 MHz. Repeat the same procedure for
L4X at 120 MHz.
Results: L2X = 180 nH, L4X = 82 nH.
320 MHz AFM tuning: Repeat the previous procedure for L2X at 120 MHz and L4X at 320 MHz.
Results: L2X = 24 nH, L4X = 10 nH.
Proceed and assemble the test units.
Measuring 120 MHz L2X: Connect the RF generator and scope probe as shown in Figure 6. While power is
applied to the PCB, set the generator output to +12 dBm and the frequency to 30 MHz. Since this is the 2x port,
the scope will show 60 MHz with ~ 3V pk-pk amplitude. Vary the generator above and below 30 MHz until the
amplitude on the scope is maximum and record the generator frequency. For example peak recorded at 29.8x2 or
59.6 MHz.
Measuring 320 MHz L2X: Connect the RF generator and scope probe as shown in Figure 6. While power is
applied to the PCB, set the generator output to +12 dBm and the frequency to 80 MHz. Since this is the 2x port the
scope will show 160 MHz with ~ 3V pk-pk amplitude. Vary the generator above and below 80 MHz until the
amplitude on the scope is maximum and record the generator frequency. For example peak recorded at 78.0 x 2 =
156 MHz
In the AFM Tuning Assistant, add the scope’s probe capacitance to the Cstray cell. For our example 0.5 pF + 1.0
pF = 1.5 pF. With L2X at 24 nH adjust LWB1 (cell B23) until the peak frequency reads 156 MHz. Next replace the
L2X value with 180 nH and see if it peaks at 59.6 MHz. If it does not, adjust the Cstray until 59.4 MHz is achieved.
Again enter 24 nH for L2X and fine tune LWB1 for 156 MHz.
Results: LWB1 = 1.6 nH, Cstray = 2.9 pF-0.5 pF = 2.4 pF (subtract scope probe stray)
Repeat the same steps for the L4X: Set the generator to 80 MHz. The 82 nH peaks at 118 MHz and the 10 nH
peaks at 304 MHz.
Results: LWB1 = 1.8 nH, Cstray = 2.5 pF-0.5 pF = 2.0 pF (subtract scope probe stray)
Internal Capacitor Selection by Device
Device Number
PL660-0X
PL663-0X
PL663-1X
PL663-2X
Cinternal (pF)
2X
34.125
46.500
14.625
14.625
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4X
16.500
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Rev. 3/20/07 Page 7
Analog Frequency Multiplier
PL660 and PL663 XO Families
EXTERNAL COMPONENT VALUES – 3 RD OVERTONE RESISTOR SELECTIONS (R3rd)
This resistor is only required when a third overtone crystal is used. The chart below indicates the calculated and
the nearest “E12” resistor values versus frequency.
PL660-08/09
Freq.
(MHz)
R3rd
(Ω)
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
12,396
11,442
10,625
9,917
9,297
8,750
8,264
7,829
7,438
7,083
6,761
6,467
6,198
5,950
5,721
5,509
5,313
5,129
4,958
4,798
4,648
4,508
4,375
4,250
4,132
4,020
3,914
E12
Pick
KΩ
12
12
10
10
10
8.2
8.2
8.2
6.8
6.8
6.8
6.8
6.8
5.6
5.6
5.6
5.6
4.7
4.7
4.7
4.7
4.7
4.7
3.9
3.9
3.9
3.9
PL663-07/08/09
E12
Freq. R3rd
Pick
(MHz)
(Ω)
KΩ
30
9,917
10
32
9,297
10
34
8,750
8.2
36
8,264
8.2
38
7,829
8.2
40
7,438
6.8
42
7,083
6.8
44
6,761
6.8
46
6,467
6.8
48
6,198
6.8
50
5,950
5.6
52
5,721
5.6
54
5,509
5.6
56
5,313
5.6
58
5,129
4.7
60
4,958
4.7
62
4,798
4.7
64
4,648
4.7
66
4,508
4.7
68
4,375
4.7
70
4,250
3.9
72
4,132
3.9
74
4,020
3.9
76
3,914
3.9
78
3,814
3.9
80
3,719
3.9
PL663-017/18/19
E12
Freq. R3rd
Pick
(MHz)
(Ω)
KΩ
75
2,125
2.2
77.5
2,056
2.2
80
1,992
2.2
82.5
1,932
1.8
85
1,875
1.8
87.5
1,821
1.8
90
1,771
1.8
92.5
1,723
1.8
95
1,678
1.8
97.5
1,635
1.5
100
1,594
1.5
102.5
1,555
1.5
105
1,518
1.5
107.5
1,483
1.5
110
1,449
1.5
112.5
1,417
1.5
115
1,386
1.5
117.5
1,356
1.5
120
1,328
1.2
122.5
1,301
1.2
125
1,275
1.2
127.5
1,250
1.2
130
1,226
1.2
132.5
1,203
1.2
135
1,181
1.2
137.5
1,159
1.2
140
1,138
1.2
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PL663-28/29
Freq.
(MHz)
R3rd
(Ω)
140.0
142.0
144.0
146.0
148.0
150.0
152.0
154.0
156.0
158.0
160.0
162.0
164.0
166.0
168.0
170.0
172.0
174.0
176.0
178.0
180.0
182.0
184.0
186.0
188.0
190.0
192.0
194.0
196.0
198.0
200.0
915
902
890
878
866
854
843
832
821
811
801
790
780
770
759
749
740
730
720
711
701
692
683
674
665
656
647
639
630
622
614
www.phaselink.com
E24
Pick
KΩ
0.91
0.91
0.91
0.91
0.91
0.82
0.82
0.82
0.82
0.82
0.82
0.82
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.68
0.68
0.68
0.68
0.68
0.68
0.68
0.62
0.62
0.62
0.62
0.62
Rev. 3/20/07 Page 8
Analog Frequency Multiplier
PL660 and PL663 XO Families
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETERS
MIN.
SYMBOL
Supply Voltage
V DD
MAX.
UNITS
4.6
V
Input Voltage, DC
VI
GND-0.5
V DD +0.5
V
Output Voltage, DC
VO
GND-0.5
V DD +0.5
V
Storage Temperature
TS
-55
+150
°C
Industrial Ambient Operating Temperature
T A_I
-40
+85
°C
Commercial Ambient Operating Temperature
T A_C
0
+70
°C
125
°C
260
°C
Junction Temperature
TJ
Lead Temperature (soldering, 10s)
Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permanent damage to the
device and affect product reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other
conditions above the operational limits noted in this specification is not implied.
PECL ELECTRICAL CHARACTERISTICS
PARAMETERS
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Supply Current (with loaded outputs)
IDD
Fout = 212.5 MHz
58
65
75
mA
Operating Supply Voltage
VDD
3.63
V
55
%
Output Clock Duty Cycle
2.25
@ VDD – 1.3V
45
Short Circuit Current
50
mA
±50
Output High Voltage
VOH
RL = 50 Ω to
VDD – 2V
Output Low Voltage
VOL
RL = 50 Ω to VDD – 2V
Clock Rise Time
tr
@20/80%
Clock Fall Time
tf
@80/20%
VDD – 1.025
PECL Levels Test Circuit
OUT
V
VDD –
1.620
V
0.25
0.45
ns
0.25
0.45
ns
PECL Transistion Time Waveform
DUTY CYCLE
VDD
45 - 55%
50Ω
55 - 45%
2.0V
OUT
80%
50Ω
20%
OUT
OUT
tR
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tF
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Rev. 3/20/07 Page 9
Analog Frequency Multiplier
PL660 and PL663 XO Families
LVDS ELECTRICAL CHARACTERISTICS
PARAMETERS
Supply Current (with loaded outputs)
SYMBOL
IDD
Operating Supply Voltage
CONDITIONS
Fout = 212.5 MHz
MIN.
VDD
2.25
Output Clock Duty Cycle
@ 1.25V
Output Differential Voltage
VDD Magnitude Change
TYP.
55
MAX.
60
UNITS
mA
3.63
V
45
50
55
%
VOD
247
355
454
mV
∆VOD
-50
50
mV
1.6
V
Output High Voltage
VOH
Output Low Voltage
VOL
Offset Voltage
1.4
RL = 100 Ω
(see figure)
0.9
1.1
VOS
1.125
1.2
1.375
V
Offset Magnitude Change
∆VOS
0
3
25
mV
Power-off Leakage
IOXD
±1
±10
µA
Output Short Circuit Current
IOSD
-5.7
-8
mA
0.2
0.5
0.7
ns
0.2
0.5
0.7
ns
Differential Clock Rise Time
tr
Differential Clock Fall Time
tf
Vout = VDD or GND
VDD = 0V
RL = 100 Ω
CL = 10 pF
(see figure)
V
LVDS Transistion Time Waveform
LVDS Levels Test Circuit
LVDS Switching Test Circuit
OUT
OUT
0V (Differential)
OUT
CL = 10pF
50Ω
VOD
OUT
VOS
VDIFF
RL = 100Ω
80%
VDIFF
80%
0V
50Ω
CL = 10pF
OUT
20%
20%
OUT
tR
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tF
Rev. 3/20/07 Page 10
Analog Frequency Multiplier
PL660 and PL663 XO Families
CMOS ELECTRICAL CHARACTERISTICS
PARAMETERS
SYMBOL
Supply Current, Dynamic, with
Loaded Outputs
I DD
Operating Supply Voltage
V DD
CONDITIONS
MIN.
At 100MHz, load=15pF
TYP.
MAX.
UNITS
32
40
mA
3.63
V
2.25
Output High Voltage (LVTTL)
V OH3.3
I OH = -8.5mA, 3.3V Supplies
2.4
V
Output Low Voltage (LVTTL)
V OL3.3
I OL = 8.5mA, 3.3V Supplies
Output High Voltage (LVCMOS)
V OHC3.3
I OH = -4mA, 3.3V Supplies
V DD – 0.4
V
Output High Voltage
V OH2.5
I OH = 1mA, 2.5V Supplies
V DD – 0.2
V
Output Low Voltage
V OL2.5
I OL = 1mA, 2.5V Supplies
0.4
V
0.2
V
Output drive current
I OSD
V OL = 0.4V, V OH = 2.4V
(per output)
8.5
Output Clock Rise/Fall Time
Tr/Tf
10% ~ 90% VDD with 10 pF
load
1.2
1.6
ns
50
55
%
Output Clock Duty Cycle
Short Circuit Current
Measured @ 50% VDD
45
IS
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
mA
±50
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Rev. 3/20/07 Page 11
mA
Analog Frequency Multiplier
PL660 and PL663 XO Families
BOARD DESIGN AND LAYOUT CONSIDERATIONS
L2X and L4X: Reduce the PCB trace inductance to a
minimum by placing L2X and L4X as physically close to
their respective pins as possible. Also be sure to bypass
each VDD connection especially taking care to place a 0.01
uF bypass at the VDD side of L2X and L4X (see
recommended layout).
Crystal Connections: Be sure to keep the ground plane
under the crystal connections continuous so that the stray
capacitace is consistent on both crystal connections. Also
be sure to keep the crystal connections symmetrical with
respect to one another and the crystal connection pins of
the IC. If you chose to use a series capacitance and/or
inductor to fine tune the crystal frequency, be sure to put
symmetrical pads for this cap on both crystal pins (see
Cadj in recommended layout), even if one of the capacitors
will be a 0.01 uF and the other is used to tune the
frequency. To further maintain a symmetrical balance on a
crystal that may have more internal Cstray on one pin or
the other, place capacitor pads (Cbal) on each crystal lead
to ground (see recommended layout). R3rd is only
required if a 3rd overtone crystal is used.
PL660 (4x AFM) TSSOP Layout
VDD and GND: Bypass VDDANA and VDDBUF with
separate bypass capacitors and if a VDD plane is used, feed
each bypass cap with its own via. Be sure to connect any
ground pin including the bypass caps with short via
connection to the ground plane.
OESEL: J1 is recommended so the same PCB layout can
be used for both OESEL settings.
PL663 (2x AFM) TSSOP Layout
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
www.phaselink.com
Rev. 3/20/07 Page 12
Analog Frequency Multiplier
PL660 and PL663 XO Families
13
OESEL
XOUT
5
OE
6
DNC
GNDANA
12
VDDBUF
11
QBAR
7
10
Q
8
9
VDDANA
VDDOSC
L2X
GNDBUF
VDDOSC
DNC
3
14
OESEL
DNC
6
OE
XIN
4
13
VDDANA
VDDOSC
XOUT
5
12
VDDBUF
L2X
OE
6
11
QBAR
L4X
7
10
VDDOSC
8
9
XOUT
2x AFM Package Pin Out
VDDANA
OESEL
Q
GNDBUF
GNDBUF
Q
QBAR
VDDBUF
L2X
15
GNDANA
7
5
16
2
1
1
1
9
12
1
0
3
1
4
1 PL660-XX
5
1
61
2
3
4
8
VDDOSC
7
L4X
6
OE
5
XOUT
XIN
4
8
1
GNDOSC
DNC
XIN
OESEL
OSCOFFSEL
OSCOFF
SEL
GNDOSC
VDDANA
Q
14
GNDBUF
3
XIN
DNC
1
1
1
9
12
1
0
3
1
4
1 PL663-XX
5
1
61
2
3
4
DNC
VDDOSC
DNC
L2X
15
GNDOSC
16
2
PL660-XX
1
PL663-XX
DNC
GNDOSC
QBAR
VDDBUF
PACKAGE PIN DESCRIPTION AND ASSIGNMENT
4x AFM Package Pin Out
PIN ASSIGNMENTS
Name
Pin #
Type
1
I
GNDOSC
2
P
2X & 4X
GND connection for oscillator.
DNC
3
I
2X & 4X
Do Not Connect.
XIN
4
I
XOUT
5
O
2X & 4X
OE
6
I
2X & 4X
DNC
OSCOFFSEL
DNC
Product
Description
2X
Do Not Connect.
Set to “0” (GND) to turn off the oscillator when outputs are disabled (OE). Default (no connect) is
OSC always on.
4X
2X & 4X
2X
L4X
7
I
8
P
GNDANA
4X
2X
Input from crystal oscillator circuitry.
Output from crystal oscillator circuitry.
Output Enable input. See “OE LOGIC SELECTION TABLE”.
Do Not Connect.
External inductor connection. The inductor is recommended to be a high Q small size 0402 or
0603 SMD component, and must be placed between L4X and adjacent VDDOSC. Place inductor
as close to the IC as possible to minimize parasitic effects and to maintain inductor Q. This
inductor is used with 4x AFMs.
GND connection.
GNDBUF
9
P
2X & 4X
VDD connection for oscillator circuitry. VDDOSC should be separately decoupled from other
VDDs whenever possible.
GND connection.
Q
10
O
2X & 4X
PECL/LVDS/CMOS output.
QBAR
11
O
2X & 4X
Complementary PECL/LVDS output or in-phase CMOS.
VDDBUF
12
P
2X & 4X
VDD connection for output buffer circuitry. VDDBUF should be separately decoupled from other
VDDs whenever possible.
VDDOSC
OESEL
VDDANA
4X
13
14
14
13
I
P
2X
4X
2X
4X
VDDOSC
15
P
2X & 4X
L2X
16
I
2X & 4X
Selector input to choose the OE control logic (see “OE SELECTION TABLE”). If no connection
is applied, value will be set to default through internal pull-down resistor.
VDD connection for analog circuitry.VDDANA should be separately decoupled from other VDDs
whenever possible.
VDD connection for oscillator. VDD should be separately decoupled from other VDDs whenever
possible.
External inductor connection. The inductor is recommended to be a high Q small size 0402 or
0603 SMD component, and must be placed between L2X and adjacent VDDOSC. Place inductor
as close to the IC as possible to minimize parasitic effects and to maintain inductor Q.
Note: 663-xx devices are 2x multipliers, and 660-xx devices are 4x multipliers.
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
www.phaselink.com
Rev. 3/20/07 Page 13
Analog Frequency Multiplier
PL660 and PL663 XO Families
PACKAGE INFORMATION
16 PIN TSSOP
16 PIN TSSOP ( mm )
Symbol
A
A1
B
C
D
E
H
L
e
Min.
Max.
1.20
0.05
0.15
0.19
0.30
0.09
0.20
4.90
5.10
4.30
4.50
6.40 BSC
0.45
0.75
0.65 BSC
E
H
D
A
A1
C
e
B
L
16 PIN 3x3 QFN
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
www.phaselink.com
Rev. 3/20/07 Page 14
Analog Frequency Multiplier
PL660 and PL663 XO Families
ORDERING INFORMATION
To order parts, please contact our Sales Department:
47745 Fremont Blvd., Fremont, CA 94538, USA
Tel: (510) 492-0990 Fax: (510) 492-0991
PART NUMBER
The order number for this device is a combination of the following:
Device number, Package type and Operating temperature range
PL66X-XX X X X X
NONE= TUBE
R= TAPE AND REEL
PART NUMBER
NONE= NORMAL PACKAGE
L= GREEN PACKAGE
PACKAGE TYPE
O=TSSOP
Q= QFN 3x3
Order Number
PL66X-XXOC
PL66X-XXOC-R
PL66X-XXOCL
PL66X-XXOCL-R
PL66X-XXQC
PL66X-XXQC-R
PL66X-XXQCL
PL66X-XXQCL-R
TEMPERATURE
C=COMMERCIAL
I=INDUSTRIAL
Marking
P66X-XX
P66X-XX
P66X-XX
P66X-XX
P66X-XX
P66X-XX
P66X-XX
P66X-XX
OC
OC
OC
OC
QC
QC
QC
QC
Package Option
TSSOP – Tube
TSSOP – Tape and Reel
TSSOP (GREEN)– Tube
TSSOP (GREEN)– Tape and Reel
QFN – Tube
QFN – Tape and Reel
QFN (GREEN)– Tube
QFN (GREEN)– Tape and Reel
PhaseLink Corporation, reserves the right to make changes in its products or specifications, or both at any time without notice. The information
furnished by Phaselink is believed to be accurate and reliable. However, PhaseLink makes no guarantee or warranty concerning the accuracy of said
information and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon this product.
LIFE SUPPORT POLICY: PhaseLink’s products are not authorized for use as critical components in life support devices or systems without the
express written approval of the President of PhaseLink Corporation.
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990, FAX (510) 492-0991
www.phaselink.com
Rev. 3/20/07 Page 15