MICROSEMI 2N5011

TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
NPN SILICON TRANSISTOR
Qualified per MIL-PRF-19500/727
DEVICES
2N5010
2N5011
2N5012
LEVELS
2N5013
2N5014
2N5015
2N5010S
2N5011S
2N5012S
2N5013S
2N5014S
2N5015S
JAN
JANTX
JANTXV
ABSOLUTE MAXIMUM RATINGS (TC = +25°C unless otherwise noted)
Parameters / Test Conditions
Symbol
Value
Unit
2N5010
500
Vdc
2N5011
600
Vdc
700
Vdc
2N5013
800
Vdc
2N5014
900
Vdc
2N5015
1000
Vdc
2N5010
500
Vdc
2N5011
600
Vdc
700
Vdc
800
Vdc
2N5014
900
Vdc
2N5015
1000
Vdc
VEBO
5
Vdc
Collector Current
IC
200
mAdc
Base Current
IB
20
mAdc
Pt
1.0
7.0
W
RθJC
20
°C/W
Tj, Tstg
-65 to +200
°C
Collector-Emitter Voltage
2N5012
Collector-Base Voltage
VCER
2N5012
2N5013
Emitter-Base Voltage
VCBO
TO-5
2N5010 thru 2N5015
Total Power Dissipation
@ TA = +25°C
@ TC = +25° C
Thermal Resistance, Junction to Case
1/
Operating & Storage Junction Temperature Range
TO-39
2N5010S thru 2N5015S
Note:
1/ See 19500/727 for Thermal Derating Curves.
T4-LDS-0067 Rev. 2 (100293)
Page 1 of 4
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted)
Parameters / Test Conditions
Collector to Base Cutoff Current
VCB = 400V
VCB = 500V
VCB = 580V
VCB = 650V
VCB = 700V
VCB = 760V
VCB = 400V
VCB = 500V
VCB = 588V
VCB = 650V
VCB = 700V
VCB = 760V
Emitter to Base Cutoff Current
VEB = 4V
Collector to Base Breakdown Voltage
IC = 0.1mAdc
IC = 0.1mAdc
IC = 0.1mAdc
IC = 0.2mAdc
IC = 0.2mAdc
IC = 0.2mAdc
Emitter to Base Breakdown Voltage
IC = 0mA
IE = 0.05mA
Collector to Emitter Breakdown Voltage
RBE = 1KΩ
IC = 0.2mA, Pulsed
Forward-Current Transfer Ratio
IC = 25mA
IC = 20mA
VCE = 10V
2N5010
2N5011
2N5012
2N5013
2N5014
2N5015
@ TA = +150°C
2N5010
2N5011
2N5012
2N5013
2N5014
2N5015
T4-LDS-0067 Rev. 2 (100293)
Min.
ICBO1
ICBO2
IEBO
2N5010
2N5011
2N5012
2N5013
2N5014
2N5015
2N5010
2N5011
2N5012
2N5013
2N5014
2N5015
2N5010, 2N5011, 2N5012
2N5013, 2N5014, 2N5015
VCE = 10V
IC = 5mA
VCE = 10V
IC = 20mA
Symbol
@ TA = -55°C
Max.
Unit
10
10
10
10
10
10
nAdc
nAdc
nAdc
nAdc
nAdc
nAdc
10
10
10
10
10
10
uAdc
uAdc
uAdc
uAdc
uAdc
uAdc
20
uAdc
V(BR)CBO
500
600
700
800
900
1000
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
V(BR)EBO
5
Vdc
V(BR)CER
500
600
700
800
900
1000
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
hFE1
30
30
hFE2
10
hFE3
10
180
180
Page 2 of 4
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted) (Cont.)
Parameters / Test Conditions
Base-Emitter Saturation Voltage
IC = 25mA
IC = 20mA
IB = 5mA, Pulsed
2N5010, 2N5011, 2N5012
2N5013, 2N5014, 2N5015
Symbol
Min.
Max.
Unit
VBE(SAT)
1.0
1.0
Vdc
Vdc
VCE(SAT)
1.4
1.5
1.6
1.6
1.6
1.8
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Max.
Unit
Collector-Emitter Saturation Voltage
IC = 25mA
IC = 25mA
IC = 25mA
IC = 20mA
IC = 20mA
IC = 20mA
IB = 5mA, Pulsed
2N5010
2N5011
2N5012
2N5013
2N5014
2N5015
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions
Symbol
Min.
|hfe|
1.0
1.0
Magnitude of small signal short-circuit forward current transfer ratio
VCE = 10Vdc, IC = 25mA, f = 10MHz
VCE = 10Vdc, IC = 20mA, f = 10MHz
2N5010, 2N5011, 2N5012
2N5013, 2N5014, 2N5015
Open circuit output capacitance
VCB = 10V, IE = 0, f = 2MHz
T4-LDS-0067 Rev. 2 (100293)
Cobo
pF
30
Page 3 of 4
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
PACKAGE DIMENSIONS
Symbol
CD
CH
HD
LC
LD
LL
LU
L1
L2
P
Q
TL
TW
r
α
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.305
.335
7.75
8.51
.240
.260
6.10
6.60
.335
.370
8.51
9.40
.200 TP
5.08 TP
.016
.019
0.41
0.48
See note 14
.016
.019
0.41
0.48
.050
1.27
.250
6.35
.100
2.54
.030
0.76
.029
.045
0.74
1.14
.028
.034
0.71
0.86
.010
0.25
45° TP
45° TP
1, 2, 10, 12, 13, 14
Notes
6
7
8,9
8,9
8,9
8,9
7
5
3,4
3
10
7
NOTE:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
Dimensions are in inches.
Millimeters are given for general information only.
Beyond r (radius) maximum, TW shall be held for a minimum length of .011 (0.28 mm).
Dimension TL measured from maximum HD.
Body contour optional within zone defined by HD, CD, and Q.
CD shall not vary more than .010 inch (0.25 mm) in zone P. This zone is controlled for automatic handling.
Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm)
radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be measured
by direct methods or by gauging procedure.
Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled
in and beyond LL minimum.
All three leads.
The collector shall be internally connected to the case.
Dimension r (radius) applies to both inside corners of tab.
In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
Lead 1 = emitter, lead 2 = base, lead 3 = collector.
For non-S-suffix devices (TO-5), dimension LL = 1.5 inches (38.10 mm) min. and 1.75 inches (44.45 mm) max. For Ssuffix types (TO-39), dimension LL = .5 inch (12.70 mm) min. and .750 inch (19.05 mm) max.
T4-LDS-0067 Rev. 2 (100293)
Page 4 of 4