POWERSEM PSII30/06

IGBT Module
IC80
=
VCES
=
VCE(sat)typ. =
PSII 30/06*
Short Circuit SOA Capability
Square RBSOA
29 A
600 V
2.4 V
Preliminary Data Sheet
ECO-TOPTM 1
S15
R15
IGBTs
A15
A7
A9
G15
V12
V13
N15
V9
V10
D1
A1
U1
V1
K1
Q1
G1
N1
typical picture, for pin
configuration see outline
drawing
V6
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Symbol
Conditions
VCES
TVJ = 25°C to 150°C
VGES
V3
Maximum Ratings
600
V
± 20
V
IC25
IC80
TC = 25°C
TC = 80°C
42.5
29
A
A
ICM
VCEK
VGE = ±15 V; RG = 33 Ω; TVJ = 125°C
RBSOA, Clamped inductive load; L = 100 µH
60
VCES
A
tSC
(SCSOA)
VCE = VCES; VGE = ±15 V; RG = 33 Ω; TVJ = 125°C
non-repetitive
10
µs
Ptot
TC = 25°C
130
W
Symbol
Conditions
(TVJ
VCE(sat)
IC = 50 A; VGE = 15 V; TVJ = 25°C
TVJ = 125°C
VGE(th)
IC = 0.7 mA; VGE = VCE
ICES
VCE = VCES;
IGES
VCE = 0 V; VGE = ± 20 V
td(on)
tr
td(off)
tf
Eon
Eoff
Characteristic Values
= 25°C, unless otherwise specified)
min.
typ. max.
2.4
2.9
4.5
VGE = 0 V; TVJ = 25°C
TVJ = 125°C
Inductive load, TVJ = 125°C
VCE = 300 V; IC = 30 A
VGE = 15/0 V; RG = 33 Ω
Cies
VCE = 25 V; VGE = 0 V; f = 1 MHz
RthJC
RthJH
(per IGBT)
with heatsink compound (0.42 K/m.K; 50 µm)
2.9
V
V
6.5
V
0.6
1.7
mA
mA
100
nA
50
50
270
40
1.4
1.0
ns
ns
ns
ns
mJ
mJ
16
nF
1.92
0.96 K/W
K/W
*NTC optional
Features
•
•
•
•
•
•
Package with DCB ceramic
base plate
Isolation voltage 3000 V∼
Planar glass passivated chips
Low forward voltage drop
Leads suitable for PC board
soldering
UL Release applied
Applications
•
•
•
•
AC and DC motor control
AC servo and robot drives
Power supplies
Welding inverters
Advantages
•
•
•
•
•
Easy to mount with four screws
Space and weight savings
Improved temperature and
power cycling capability
High power density
Small and light weight
Caution: These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
Reverse diodes (FRED)
Symbol
Conditions
IF25
IF80
TC = 25°C
TC = 80°C
Symbol
Conditions
VF
IF = 30 A; TVJ = 25°C
TVJ = 125°C
IRM
trr
IF = 15 A; diF/dt = 400 A/µs; TVJ = 125°C
VR = 300 V; VGE = 0 V
RthJC
RthJH
Maximum Ratings
30
19
A
A
Characteristic Values
min.
typ. max.
2.57
1.8
2.84
V
V
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pr dev
with heatsink compound (0.42 K/m.K; 50 µm)
7
50
A
ns
4.6
2.3 K/W
K/W
Temperature Sensor NTC
Symbol
Conditions
Characteristic Values
min. typ. max.
R25
B25/50
T = 25°C
4.75
Module
Symbol
TVJ
Tstg
Conditions
5.0
3375
5.25 kΩ
K
Maximum Ratings
-40...+125
-40...+150
°C
°C
VISOL
IISOL ≤ 1 mA; 50/60 Hz
3000
V~
Md
Mounting torque (M5)
a
Max. allowable acceleration
3
26
50
Nm
lb.in.
m/s 2
Symbol
Conditions
Characteristic Values
min. typ. max.
dS
dA
Creepage distance on surface (Pin to heatsink)
Strike distance in air (Pin to heatsink)
11.2
11.2
Weight
mm
mm
86
g
Package style and outline
Dimensions in mm (1mm = 0.0394“)
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
90
90
A
75
IC
A
75
IC
VGE= 17V
15V
13V
60
TJ = 25°C
11V
45
11V
45
30
30
9V
15
0
VGE = 17 V
15 V
13 V
60
1
9V
15
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25T60
0
TJ = 125°C
2
3
4
5
V
0
6
25T60
0
1
2
3
4
VCE
Fig. 1 Typ. output characteristics
90
Fig. 2 Typ. output characteristics
A
75
IF
VCE = 20V
60
60
45
45
TJ = 125°C
30
TJ = 25°C
30
TJ = 125°C
15
0
6
90
75
A
IC
5 V
VCE
TJ = 25°C
15
25T60
4
6
8
10
12
0
0,0
14 V 16
0,5
1,0
1,5
25T60
V
Fig. 3 Typ. transfer characteristics
Fig. 4 Typ. forward characteristics of
free wheeling diode
50
20
V
2,0
VF
VGE
40
A
15
VGE
120
ns
trr
IRM
TJ = 125°C
VR = 300 V
IF = 30 A
20
5
trr
90
30
10
VCE = 300 V
IC = 30 A
150
60
30
10
IRM
0
25T60
0
40
80
120
QG
Fig. 5 Typ. turn on gate charge
nC
160
0
MUBW3006A7
0
200
400
600
800
A/µs
0
1000
-di/dt
Fig. 6 Typ. turn off characteristics of
free wheeling diode
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
8
VCE = 300V
mJ VGE = ±15V
Eon
tr
R = 33Ω
6 G
TVJ = 125°C
Eon
2
2,0
ns
mJ
60
td(on)
4
80
t
ns
Eoff 1,5
300
t
VCE = 300V
VGE = ±15V
td(off)
1,0 RG = 33Ω
40
400
Eoff
200
TVJ = 125°C
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20
0,5
0
0,0
100
tf
0
25T60
0
20
40
60 A
25T60
0
20
40
60 A
IC
IC
Fig. 7 Typ. turn on energy and switching
4
Eon
td(on)
VCE = 300V
mJ VGE = ±15V
= 30A
I
3 C
TVJ = 125°C
Fig. 8 Typ. turn off energy and switching
times versus collector current times
versus collector current
2,0
80
ns
tr
60
t
Eoff
VCE = 300 V
mJ V = ±15 V
GE
I
= 30 A
1,5 C
TVJ = 125°C
td(off)
400
ns
300
Eoff
Eon
2
0
1,0
200
0,5
100
40
1
0
25T60
0
10
20
30
40
50
60
tf
20
70 Ω 80
0,0
25T60
0
10
20
30
40
RG
0
70Ω 80
60
RG
Fig. 9 Typ. turn on energy and switching
ICM
50
Fig. 10 Typ. turn off energy and switching
times versus gate resistor times
versus gate resistor
80
10
A
K/W
60
ZthJC
diode
1
IGBT
0,1
40
0,01
20
0
0
100
200
single pulse
0,001
RG = 33 Ω
TVJ = 125°C
25T60
300
400
500
600
700 V
0,0001
0,00001 0,0001 0,001
VCE
Fig. 11 Reverse biased safe operating area
VDI...50-06P1
0,01
0,1
1
s 10
t
Fig. 12
Typ. transient thermal impedance
RBSOA
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
t