POWERSEM PSII75-12

IGBT Module
IC80
=
VCES
=
VCE(sat)typ. =
PSII 75/12*
Preliminary Data Sheet
S15
R15
A15
A7
A9
G15
V12
V13
N15
V9
V10
D1
A1
U1
V1
K1
Q1
G1
N1
V3
ECO-TOPTM 1
V6
typical picture, for pin
configuration see outline
drawing
IGBTs
Symbol
VCES
VGES
IC25
IC80
ICM
VCEK
tSC
(SCSOA)
Ptot
Symbol
t
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Conditions
Maximum Ratings
TVJ = 25°C to 150°C
VGE(th)
ICES
IGES
td(on)
tr
td(off)
tf
Eon
Eoff
1200
V
± 20
V
90
60
A
A
100
VCES
A
10
µs
379
W
TC = 25°C
TC = 80°C
VGE = ±15 V; RG = 22 Ω; TVJ = 125°C
RBSOA, Clamped inductive load; L = 100 µH
VCE = VCES; VGE = ±15 V; RG = 22 Ω; TVJ = 125°C
non-repetitive
TC = 25°C
Conditions
(TVJ
VCE(sat)
60 A
1200 V
2.7 V
Characteristic Values
= 25°C, unless otherwise specified)
min.
typ. max.
IC = 75 A; VGE = 15 V; TVJ = 25°C
TVJ = 125°C
IC = 2 mA; VGE = VCE
VCE = VCES;
2.7
3.0
4.5
VGE = 0 V; TVJ = 25°C
TVJ = 125°C
VCE = 0 V; VGE = ± 20 V
Inductive load, TVJ = 125°C
VCE = 600 V; IC = 60 A
VGE = 15/0 V; RG = 22 Ω
Cies
VCE = 25 V; VGE = 0 V; f = 1 MHz
RthJC
RthJH
(per IGBT)
with heatsink compound (0.42 K/m.K; 50 µm)
*NTC optional
Features
•
3.2
V
V
•
•
•
•
6.5
V
•
3.7
12.5
mA
mA
200
nA
100
70
500
70
9.1
6.7
ns
ns
ns
ns
mJ
mJ
3.3
nF
0.66
0.33 K/W
K/W
Package with DCB ceramic
base plate
Isolation voltage 3000 V∼
Planar glass passivated chips
Low forward voltage drop
Leads suitable for PC board
soldering
UL Release applied
Applications
•
•
•
•
AC and DC motor control
AC servo and robot drives
Power supplies
Welding inverters
Advantages
•
•
•
•
•
Easy to mount with four screws
Space and weight savings
Improved temperature and
power cycling capability
High power density
Small and light weight
Caution: These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
Reverse diodes (FRED)
Symbol
Conditions
IF25
IF80
TC = 25°C
TC = 80°C
100
60
Symbol
Conditions
Characteristic Values
min.
typ. max.
VF
IF = 60 A;
IRM
trr
IF = 60 A; diF/dt = 500 A/µs; TVJ = 125°C
VR = 600 V; VGE = 0 V
RthJC
RthJH
Maximum Ratings
TVJ = 25°C
TVJ = 125°C
2.28
1.67
A
A
2.6
V
V
41
200
A
ns
t
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0.66 K/W
K/W
1.32
with heatsink compound (0.42 K/m.K; 50 µm)
Temperature Sensor NTC
Symbol
R25
B25/50
Module
Symbol
TVJ
Tstg
VISOL
Md
a
Conditions
Characteristic Values
min. typ. max.
T = 25°C
4.75
Conditions
5.0
3375
Maximum Ratings
-40...+125
-40...+150
°C
°C
IISOL ≤ 1 mA; 50/60 Hz
3000
V~
Mounting torque (M5)
3
26
50
Nm
lb.in.
m/s 2
Max. allowable acceleration
Symbol
dS
dA
Weight
5.25 kΩ
K
Conditions
Characteristic Values
min. typ. max.
Creepage distance on surface (Pin to heatsink)
Strike distance in air (Pin to heatsink)
11.2
11.2
mm
mm
86
g
Package style and outline
Dimensions in mm (1mm = 0.0394“)
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
120
TJ = 25°C
A
100
IC
120
A TJ = 125°C
100
VGE =17 V
15 V
13 V
80
VGE =17 V
15 V
IC
13 V
80
11 V
11 V
60
60
40
40
9V
9V
20
20
0
0,0
81T120
0,5
81T120
0
t
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1,0
1,5
2,0
2,5
0,0
3,0 V
0,5
1,0
1,5
2,0
2,5
VCE
Fig. 1 Typ. output characteristics
120
VCE = 20 V
A
TJ = 25°C
100
IC
60
180
TJ = 125°C
A
150
TJ = 25°C
120
90
40
60
20
0
3,5 V
Fig. 2 Typ. output characteristics
IF
80
3,0
VCE
30
81T120
5
6
7
8
9
10
DWLP55-12
0
0,5
11 V
1,0
1,5
2,0
2,5
Fig. 3 Typ. transfer characteristics
20
3,0 V
3,5
VF
VGE
Fig. 4 Typ. forward characteristics of
free wheeling diode
120
V
A
VGE
15
IRM
VCE = 600 V
IC = 50 A
300
ns
trr
200
80
trr
10
40
IRM
5
0
81T120
0
50
100
150
200
QG
250 nC
Fig. 5 Typ. turn on gate charge
0
TJ = 125°C
VR = 600 V
IF = 50 A
100
81T120
0
200
400
600
800
A/µs
0
1000
-di/dt
Fig. 6 Typ. turn off characteristics of
free wheeling diode
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
24
mJ
Eon
18
ns
Eoff ns
500
td(off)
10
t
Eoff
RG = 22 Ω
TJ = 125°C
400 t
8
VCE = 600 V
VGE = ±15 V
Eon
6
VCE = 600 V
VGE = ±15 V
300
4
RG = 22 Ω
TJ = 125°C
200
30
2
t
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81T120
0
600
mJ
60
tr
6
0
12
90
td(on)
12
120
20
40
60
80
100 A
0
0
0
20
40
60
VCE = 600 V
td(on)
mJ V = ±15 V
GE
IC = 50 A
TJ = 125°C
Eon 15
10
0
Fig. 8 Typ. turn off energy and switching
times versus collector current times
versus collector current
240
10
ns
mJ VCE = 600 V
180
Eon
t
8
Eoff
VGE = ±15 V
IC = 50 A
TJ = 125°C
60
81T120
0 10 20 30 40 50 60 70 80 90 100 Ω
t
4
600
2
300
0
0
81T120
tf
0 10 20 30 40 50 60 70 80 90 100 Ω
0
RG
Fig. 10 Typ. turn off energy and switching
times versus gate resistor times
versus gate resistor
1
A
K/W
0,1
100
ZthJC
80
diode
0,01
RG = 22 Ω
TJ = 125°C
VCEK < VCES
60
0,0001
20
81T120
0
200
400
600
IGBT
0,001
40
0
1200
Eoff
900
Fig. 9 Typ. turn on energy and switching
ICM
ns
6
RG
120
1500
td(off)
120
tr
5
0
100 A
IC
Fig. 7 Typ. turn on energy and switching
20
81T120
80
IC
100
tf
800 1000 1200 V
single pulse
0,00001
0,00001 0,0001
0,001
0,01
0,1
s
1
t
VCE
Fig. 11 Reverse biased safe operating area
VID...75-12P1
Fig. 12
Typ. transient thermal impedance
RBSOA
 2005 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20