LX8820 3.3V/1.0A Ultra Low Dropout Regulator ® TM P RODUCTION DESCRIPTION KEY FEATURES The low RDSON of the PMOS output stage results in ultra low dropout (typically 0.45V @ 1A). Output voltage overshoot is controlled using slew rate control, as VIN is applied, typically VOUT overshoot < 2% for VIN ≤ 1V/µS ramp. Transient response to a Step Load is fast and controlled, VOUT overshoot remains within 2% of nominal for 400mA step sizes. Thermal Shutdown, Current Limit and Short Circuit Current protection are integrated on-chip for survival during fault conditions. Microsemi’s small 3x3mm body size (MO-229) package enables maximum power dissipation with a minimum surface mount area. Accurate Output Voltage Typical Dropout of 0.7V at 1A and 0.25V at 0.8A Independent Thermal and Current Limit Protection Low Tolerance Load Regulation (0.4%) Wide DC Supply Voltage of 4V to 10V Loop Stability Independent of Output Capacitor Type JEDEC MO-229 surface mount package / RoHS Compliant WWW . Microsemi .C OM The LX8820 is an ultra lowdropout single output positivevoltage linear regulator. The regulator has a precise, fixed output capable of delivering 1.2 amps. The LX8820 output is internally programmed for 3.3V. Regulator stability is maintained with any capacitor ESR, allowing ceramic, tantalum or electrolytic types. Capacitance range is flexible beginning with 2.2µF to large values. The CMOS wafer process increasing regulator efficiency by minimizing operating ground current (typically <200µA). compared to BiPolar technology . DATA SHEET APPLICATIONS/BENEFITS 5V to 3.3V Regulators Hard Disk Drives, CD-ROMs ADSL and Cable Modems Battery Charging Circuits Instrumentation PC Peripherals IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com APPLICATION CIRCUITS 1 VIN 3.8 to 6V 4.7µF 2 3 VIN VIN GND VOUT N.C. VOUT 6 5 VOUT 3.3V @ 1A 4 4.7µF LX8820 LX8820 TJ (°C) PACKAGE ORDER INFO Plastic MLP 6OUTPUT V LM PIN Part Marking RoHS Compliant / Pb-free 0 to 125 3.3V LX8820-33CLM 882J or 8820 Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX8820-33CLM-TR) Copyright © 2004 Rev. 1.1, 2005-02-24 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX8820 3.3V/1.0A Ultra Low Dropout Regulator ® TM P RODUCTION ABSOLUTE MAXIMUM RATINGS DATA SHEET PACKAGE PIN OUT VIN 1 6 VIN GND 2 5 VOUT N.C. 3 4 VOUT LM PACKAGE (Top View) Note: Heatsink must be connected to GND or left floating (see pg 7 for details) Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. . N/C = Not internally connected, don’t care for PCB layout consideration. THERMAL DATA LM WWW . Microsemi .C OM Input Voltage (VIN) ....................................................................................................... 10V Load Current (Internally Limited)................................................................................... 2A Power Dissipation ................................................................................... Internally Limited Short-Circuit Protection ........................................................................................Indefinite Operating Junction Temperature................................................................................ 150°C Storage Temperature Range........................................................................ -65°C to 150°C RoHS / Pb-free Peak Package Solder Reflow Temperature (40 second maximum exposure) ....................................................................260°C (+0,-5) RoHS / Pb-free 100% Matte Tin Lead Finish Plastic MLP 6-Pin 8°C/W THERMAL RESISTANCE-JUNCTION TO TAB, θJT THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA 29-35°C/W (Typical, depending on mounting/pcb layout) Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. θJA can vary significantly depending on mounting technique. (See Application Notes Section: Thermal considerations) FUNCTIONAL PIN DESCRIPTION PIN NAME VIN GND VOUT DESCRIPTION Positive unregulated supply input for the regulator. Bypass to GND with at least 2.2µF of low ESR and ESL capacitance. Common terminal for ground reference. The input and output bypass capacitors should be connected to this pin. Regulator output. It is recommended to bypass to GND with at least 2.2µF. Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a lower ESR capacitor will improve the response to these load steps. PACKAGE DATA RECOMMENDED MAX OPERATING CONDITIONS Parameter Symbol Input Voltage Load Current (with adequate heat sinking) Operating Junction Temperature Copyright © 2004 Rev. 1.1, 2005-02-24 VIN IL TJ Min LX8820-33 Typ 4.5 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Max 10 1200 125 Units V mA °C Page 2 LX8820 3.3V/1.0A Ultra Low Dropout Regulator ® TM P RODUCTION DATA SHEET ELECTRICAL CHARACTERISTICS ` Fixed Output (3.3V) Output Voltage VOUT Line Regulation ∆VOUT(VIN) Load Regulation ∆VOUT(IOUT) Dropout Voltage 5mA < IOUT < 1A, 4.75V < VIN < 5.25V 3.234 3.300 3.366 V 4.5V < VIN < 5.5V, 5mA < IOUT < 1A 4 9 mV 10mA < IOUT < 1A, VIN = 4.75V 2 15 mV ILOAD = 1A, ∆VOUT = -1% VDO 0.45 ILOAD = 1A, VIN = 4.0V 3.0 Transient Response; VOUT Overshoot at Start-Up VOUT VIN step 0V to 5V; tr ≥ 1µs; 10mA < IOUT < 1A Note 2 Transient Response; VOUT Droop to Step Load VOUT VIN = 5V; tr ≥ 1µs; 10mA < IOUT < 1A Note 2 3.0 VIN < 5.5V 1.0 Current Limit IOUT (MAX) Minimum Load Current IL Quiescent Current Ripple Rejection RMS Output Noise (% of VOUT) Thermal Shutdown 3.383 3.63 Note 1 IQ 3.3 V 1.5 A 0 0.1 205 300 IOUT =1000mA, VIN < 7V 550 650 PSRR f=120Hz, VIN = 5V 10Hz < f < 10kHz 50 TJSD 140 V V IOUT =5mA VOUT (RMS) WWW . Microsemi .C OM Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 125°C except where otherwise noted and the following test conditions: VIN = 5V, IOUT = 10mA, C1= 4.7µF (ceramic), C2= 4.7µF (ceramic), & TJ = TA using low duty cycling methods. LX8820-33 Parameter Symbol Test Conditions Units Min Typ Max mA µA 75 dB 0.003 %/V 160 °C Note 1: Minimum load current is defined as the amount of output current required to maintain regulation. Note 2: Guaranteed by design. BLOCK DIAGRAM VIN VOUT C2 10µF C1 10µF Bias + - ELECTRICALS 1.25V VREF LX8820 GND Figure 1 – Fixed Output Note: Application Circuit above using ceramic capacitors Copyright © 2004 Rev. 1.1, 2005-02-24 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX8820 ® TM 3.3V/1.0A Ultra Low Dropout Regulator P RODUCTION DATA SHEET CHARACTERISTIC CURVES Vo VOLT 3.304 3.302 3.300 3.298 3.296 3.294 3.292 3.290 3.288 3.286 3.284 3.282 3.280 WWW . Microsemi .C OM STEP LOAD STABILITY LX8820 TEMP STABILITY, Iout=5ma VIN=4.5V VIN=5.25V VIN=7V -50 -25 0 25 50 75 TEMP, °C 100 125 150 CH1: (Blue) VOUT, CH4: ISTEP 200mA/div, CIN = COUT = 4.7µF Ceramic, Load Current, dc =100mA SHORT CIRCUIT AND RECOVERY CH1: VOUT, CH4: ISTEP, CIN = COUT = 10µF Ceramic SUPPLY VOLTAGE, FAST TURN ON (TRISE = 10µS) Copyright © 2004 Rev. 1.1, 2005-02-24 CH3: (Magenta) VOUT, CH4: IOUT 1A/div, CIN = COUT = 10µF Ceramic Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 CHARTS CH1: VIN (Light Blue) CH2: VOUT, CIN = COUT = 10µF Ceramic, Load Current, dc = 1A Page 4 LX8820 ® TM 3.3V/1.0A Ultra Low Dropout Regulator P RODUCTION DATA SHEET APPLICATION INFORMATION Thermal Considerations The LX8820 is part of a family of LDO (Low Drop-Out) linear regulators in the JEDEC MO-229 package that offer maximum power dissipation in a low profile surface mount technology. The LX8820 output is fixed at 3.3V output and can supply up to one amp with a regulator design optimized for system efficiency by consuming minimal ground current and directing quiescent current to the load. Thermal shutdown protects the integrated circuit from thermal overload caused from a rise in junction temperature during power dissipation. This means of protection is intended for fault protection only and not as a means of current or power limiting during normal application usage. Proper thermal evaluation should be done to ensure that the junction temperature dose not exceed it’s maximum rating. Operating at the maximum TJ of 150°C can impact reliability . Due to variation in individual device electrical characteristics and thermal resistance , the built in thermal overload protection may be activated at power levels slightly above or below the rated dissipation. Also peak output power should be considered for each individual output. Input Capacitor To improve load transient response and noise rejection an input bypass capacitor of at least 2.2µF is required. Generally we recommend a 4.7µF ceramic or tantalum or 22µF electrolytic capacitor. Output Capacitor The regulator requires an output capacitor connected between VOUT to GND to stabilize the internal control loop. Many types of capacitors are available, with different capacitance values tolerances, temperature coefficients and equivalent series resistance. We recommend a minimum of 4.7µF. To ensure good transient response from the power supply system under rapidly changing current load conditions, designers generally use additional output capacitors connected in parallel. Such an arrangement serves to minimize the effects of the parasitic resistance (ESR) and inductance (ESL) that are present in all capacitors. The regulator has been tested stable with capacitor ESR’s in the range of 0.01 to 2 ohms. We have found it best to use the same type of capacitor for both input and output bypass. WWW . Microsemi .C OM Description Power dissipation for the regulator can be calculated using the following equation: PD = (VIN(MAX) - VOUT ) • IOUT (Note: power dissipation resulting from quiescent (ground) current is negligible) Junction temperature of the integrated circuit can be calculated using: TJUNCTION = TJUNCTION-TAB RISE + TTAB-AMB RISE + TAMB TTAB = PD MAX • Θ JT TTAB-AMB = PD REG • ΘPCB An example: Given conditions: TA = 70°C, VIN= 5.0V, Vout= 3.3V, Iout= 200mA. Minimum Load Requirement The LX8820 has a minimum load requirement for proper output regulation specified at 0.1mA. Calculated values: Temperature Protection TJ-TAB REG = (5V - 3.3V) • (200mA) • 8°C/W The thermal protection shuts the LX8820 down when the junction temperature exceeds 140°C. Exposure to absolute maximum rated conditions for extended periods may affect device reliability (see Thermal Considerations below). Current Limit Protection The LX8820 includes over current protection. When the output load current exceeds typically 1.5A, the circuit forces the regulator output to decrease. = (340mW) • 8°C/W = 2.7°C TTAB-AMB RISE = (340mW) • 32°C/W = 10.9°C TJUNCTION = 2.7°C + 10.9°C + 70°C = 83.6°C It is important to note that although each output of the regulator will produce up to 1.5A in current, the total power dissipation may limit the useful total current draw. The junction temperature should be calculated to insure the maximum junction temperature is not exceeded. APPLICATIONS Copyright © 2004 Rev. 1.1, 2005-02-24 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX8820 3.3V/1.0A Ultra Low Dropout Regulator ® TM P RODUCTION DATA SHEET MECHANICAL DRAWINGS JEDEC – MO229 Dim L2 L D2 E K L2 E2 e b Θ A1 A A3 Internally Connected together, but isolated from all other terminals A A1 A3 b D E e D2 E2 K L L2 Θ MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.30 0.45 2.90 3.10 2.90 3.10 0.95 BSC 1.90 2.25 1.15 1.65 0.20 0.30 0.45 0.10 0° 12° WWW . Microsemi .C OM D 6-Pin Plastic Micro Lead Package INCHES MIN MAX 0.032 0.040 0 0.002 0.008 REF 0.012 0.018 0.114 0.122 0.114 0.122 0.037 BSC 0.075 0.086 0.045 0.065 0.008 0.012 0.018 0.004 0° 12° NOTES MECHANICALS PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2004 Rev. 1.1, 2005-02-24 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6