Surface Mount PPTC FSMD 0805 Series FEATURES RoHS ü AGENCY RECOGNITION •UL (Pending) •C-UL (Pending) •TÜV (Pending) • 0805 size Surface Mount •Application: All high-density boards •Operation Current: 100mA ~ 350mA •Maximum Voltage: 6V ~ 15V •Temperature Range: -40°C to 85°C •RoHS Compliant ELECTRICAL CHARACTERISTICS (23°C) Part Number Hold Current Trip Current Rated Voltage Maximum Current Typical Power Max Time to Trip Current Time Resistance Tolerance RMIN R1MAX IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec OHMS OHMS FSMD010-0805 0.10 0.30 15 100 0.5 0.50 1.500 0.70 6.000 FSMD020-0805 0.20 0.50 9 100 0.5 8.00 0.02 0.40 3.500 FSMD035-0805 0.35 0.75 6 100 0.5 8.00 0.10 0.25 1.200 IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: solder-plated copper FSMD PRODUCT DIMENSIONS (MILLIMETERS) B Marking B A D Part A Number B C Min Max Min Max Min D Max Min FSMD010-0805 2.00 2.2 1.20 1.5 0.20 0.55 1.00 FSMD020-0805 2.00 2.2 1.20 1.5 0.20 0.55 1.00 FSMD035-0805 2.00 2.2 1.20 1.5 0.20 0.47 0.75 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED01 2008.1.30 Surface Mount PPTC FSMD 0805 Series RoHS ü THERMAL PRODUCT DIMENSIONS (MILLIMETERS) Thermal Derating Curve, FSMD0805 Series Percent of Rated Hold and Trip Current 200% 150% 100% A= FSMD 075, 100 B= FSMD 014, 020, 035 & 050 50% 0% 4- 0 2- 0 0 20 40 60 80 Ambient Temperature (C) TYPICAL TIME-TO-TRIP AT 23°C A B C 100 Time-to-trip (S) 10 A = FSMD010 - 0805 B = FSMD020 - 0805 C = FSMD035 - 0805 1 0.1 0.01 0.001 0.1 1 10 Fault current (A) PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device NOMINAL PAD DIMENSIONS (MILLIMETERS) SOLDER RELOW Solder Reflow Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for regular. This may cause damage to other components. 1. Recommended maximum past thickness is 0.25mm. 2. Devices can be cleaned by using standard industry methods and solvents. 3. Storage Environment: <30°C / 60% RH solvents. Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED01 2008.1.30