E-pHEMT MMIC AE312 (Preliminary) Product Features Application • Small size • Higher Gain • Higher linearity • SOT89 SMD Type package • Higher productivity • Lower manufacturing cost • -62dBc CSO 135 Channels @ +15dBmV/ch • -74dBc CTB 135 Channels @ +15dBmV/ch • -87dBc XMD 135 Channels @ +15dBmV/ch • Low Noise Amplifier for CATV, Satellite • Cable Modem • FTTH (G-PON, GE-PON) • Optical node Package : SOT-89 Description AE312 is designed as low cost drive amplifiers for many applications including FTTH, CATV System. This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current draw and very low noise. The data in this spec sheet is valid only for 75 ohm application. 50 ohm data is in a separate spec sheet. Specifications PARAMETER UNIT Frequency MHz Gain dB Input Return Loss dB -15 Output Return Loss dB -18 Output IP3 dBm 29 32 At 500MHz/5dBm 2tone 1dB Compression Point dBm 16 19 At 500MHz Noise Figure dB 1 2 dBc -62 -57 135 channel, +15dBmV/ch dBc -74 -69 135 channel, +15dBmV/ch dBc -87 -82 135 channel, +15dBmV/ch mA 50 CSO CTB 30 ~ 870MHz XMOD DC Current MIN TYP MAX Condition 50 ~ 1000 18 20 Vdd = 5.0V NOTE 1. Test conditions unless otherwise noted. Test Freq = 500MHz, T=25℃, Vdd=5V, 75Ω system 2. OIP3 measured with 2 tones at an output power of +5dBm/tone separated by 1MHz, Test Freq = 500MHz Absolute Minimum and Maximum Ratings PARAMETER UNIT Device Voltage VDC Operating Temperature ℃ -40 +85 Storage Temperature ℃ -40 +150 MIN TYP MAX +5 +5.5 ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3 AE312 (Preliminary) E-pHEMT MMIC ◎ Application Circuit: 50MHz ~ 1000MHz, 75ohm System ◎ Typical RF Performance: VDD=5V, IDS=50mA, T=25℃, 75ohm System Noise Figure vs Frequency S-Parameter 20 20 5 10 4 Gain(dB) 15 0 10 -10 S11 5 S22 0 0.0 0.2 0.4 0.6 0.8 1.0 Return Loss(dB) S21 NF(dB) 25 3 2 -20 1 -30 0 1.2 10 200 400 Freq(GHz) 600 800 1000 Freq(MHz) ◎ Multi-Tone Test 135CH_FLAT@Output Power +15dBmV/Ch Level: +15dBmV FRQ 55.25 Tilt: 135CH_FLAT XMD(NCTA) CTB_RAW CTB_COR 88.8 72.8 77.1 N-FLR 73.1 CSU_RAW 72.1 CSU_COR 76.4 CSU_FRQ 56 CSL_RAW 62.2 CSL_COR CSL_FRQ 62.6 54 77.25 88.9 73.1 77.5 73.6 63 63.5 77.99 72.9 77.2 76.55 109.25 87.9 72.9 77.3 73.1 72.6 76.9 110.33 63.3 63.8 107.99 211.25 90.7 72.2 76.5 72.6 70.7 75.1 212.5 64.5 65.1 209.99 331.25 329.99 90.6 71.7 76 71.9 69.2 72.2 332.5 64 64.7 445.25 90 72.6 76.9 72.9 69.3 71.5 446.49 66.3 67.3 444 547.25 91.6 71.5 75.9 71.7 67.5 69.4 548.5 66.3 67.7 545.99 637.25 90 71.3 75.7 71.6 67.1 68.8 638.49 68.3 70.9 635.99 745.25 92.1 71.2 75.5 71.6 66.5 68.2 746.49 70.4 74.7 743.99 859.25 91.6 70 74.3 70.2 65.9 68.1 860.49 69.9 74.3 858.28 Min 87.9 70 74.3 70.2 63 63.5 56 62.2 62.6 54 Max 92.1 73.1 77.5 73.6 72.6 76.9 860.49 72.9 77.2 858.28 ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3 E-pHEMT MMIC AE312 (Preliminary) ESD Protection For a safe use in all situations, it is recommended to have proper ESD control techniques while the device is being handled. Here are some recommended precautions; - Person at a workbench should be earthed via a wrist strap and a resistor. - All mains-powered equipment should be connected to the mains via an earth-leakage switch. - Equipment cases should be grounded. - Relative humidity should be maintained between 40% and 50%. - An ionizer is recommended. - Keep static materials, such as plastic envelopes and plastic trays etc. away from the workbench Dimensions PCB Pad Layout Pin No Function 1 Input 2 Ground 3 Output/Bias 4 Ground Recommended Mounting Configuration Mounting Configuration Notes 1.Ground / thermal via holes are critical for the proper performance of this device. 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink. 4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink. 5. RF trace width depends upon the PCB material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters. RFHIC Corporation (RFHIC) reserves the right to make changes to any products herein or to discontinue any product at any time without notice. RFHIC do not assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential or incidental damages. The product specifications herein expressed have been carefully checked and are assumed to be reliable. However, RFHIC disclaims liability for inaccuracies and strongly recommends buyers to verify that the information they are using is current before placing purchase orders. RFHIC products are not intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or sells such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC and its directors, officers, stockholders, employees, representatives and distributors harmless against any and all claims arising out of such use. RFHIC’s liability under or arising out of damages, claims of whatsoever kind and nature which RFHIC products could cause shall be limited in amount to the net purchase price of the products sold to buyer by RFHIC. ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3