E-pHEMT MMIC AE384 (Preliminary) Product Features Application • 50 ~ 6000MHz • GaAs E-pHEMT MMIC • Higher linearity • Low Noise Figure • High Max input power • SOT-89 SMD Type package • Higher productivity • Lower manufacturing cost • Pb Free / RoHS Standard • Cellular, GSM • PCS, W-CDMA • Wibro, WiMax Package : SOT-89 Description AE384 is a drive or pre-drive amplifier designed in a low cost SOT-89 package. This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current and high IP3. It is designed as driver devices for infrastructure equipment in the 50~6000MHz Wireless technologies such as Cellular, GSM, PCS, W-CDMA, Wibro, WiMax System. The data in this spec sheet is valid only for 50 ohm application. Specifications PARAMETER UNIT MIN TYP Frequency Range MHz 50 ~ 6000 Gain dB 14 Input Return Loss dB -20 Output Return Loss dB -14 Output IP3 dBm 36 39 1dB Compression Point dBm 21 24 W-CDMA Power (4FA) dBm 14 Noise Figure dB 1.4 DC Current mA 100 Supply Voltage V 5 MAX Remark 1.9 NOTE 1. Test conditions unless otherwise noted. Freq=1900~2200MHz, Vdd=+5V, Ta=25℃, 50Ω system 2. OIP3 measured with 2 tones at an output power of +10dBm/tone separated by 1MHz 3. Test Model 1, 64DPCH, 3.84MHz BW, @±5MHz and ±10MHz offset Absolute Minimum and Maximum Ratings PARAMETER UNIT MIN TYP MAX Device Voltage V +5 +6 Operating Temperature ℃ -40 +85 Storage Temperature ℃ -40 +150 ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.2 AE384 (Preliminary) E-pHEMT MMIC ◎ Application Circuit: 1900MHz ~ 2200MHz, 50ohm System +5V 20pF 150ohm 22nH 12nH Input 0ohm 2.5pF 56nH 4.7uF (Tantal) 100nF AE384 1.8nH 3.3pF Output 1.2pF ◎ Typical RF Performance: VDD=5V, IDS=100mA, TA=25℃, 50ohm System S-parameter 30 3.0 20 2.5 10 2.0 S21 S11 S22 0 1.5 -10 1.0 -20 0.5 -30 1.8 1.9 2.0 2.1 freq, GHz Noise Figure vs Frequency 2.2 2.3 0.0 1900 1940 1980 2020 2060 2100 2140 2180 2140 2180 Freq(MHz) OIP3 vs Frequency 42.0 40.0 26.0 38.0 24.0 36.0 22.0 34.0 20.0 32.0 1900 1940 1980 2020 2060 2100 P1dB vs Frequency 28.0 2140 2180 18.0 1900 1940 1980 2020 Freq(MHz) 2060 2100 Freq(MHz) ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.2 AE384 (Preliminary) E-pHEMT MMIC ◎ Application Circuit: 2400MHz ~ 2600MHz, 50ohm System +5V 100nF 150ohm 8.2nH 68nH Input 0ohm 4.7uF (Tantal) 100nF 2.0pF AE384 1.5nH 2.5pF Output ◎ Typical RF Performance: VDD=5V, IDS=100mA, TA=25℃, 50ohm System S-parameter Noise Figure vs Frequench 30 3.0 20 2.5 10 2.0 0 1.5 S21 S11 S22 -10 1.0 -20 0.5 -30 2.3 2.4 2.5 2.6 2.7 0.0 2400 2440 2480 freq, GHz 2600 28.0 40.0 26.0 38.0 24.0 36.0 22.0 34.0 20.0 32.0 2400 2560 P1dB vs Frequency OIP3 vs Frequency 42.0 2520 Freq(MHz) 2440 2480 2520 2560 2600 18.0 2400 2440 2480 Freq(MHz) 2520 2560 Freq(MHz) ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.2 2600 E-pHEMT MMIC AE384 (Preliminary) ESD Protection For a safe use in all situations, it is recommended to have proper ESD control techniques while the device is being handled. Here are some recommended precautions; - Person at a workbench should be earthed via a wrist strap and a resistor. - All mains-powered equipment should be connected to the mains via an earth-leakage switch. - Equipment cases should be grounded. - Relative humidity should be maintained between 40% and 50%. - An ionizer is recommended. - Keep static materials, such as plastic envelopes and plastic trays etc. away from the workbench Dimensions PCB Pad Layout Pin No Function 1 Input 2 Ground 3 Output/Bias 4 Ground Recommended Mounting Configuration Mounting Configuration Notes 1.Ground / thermal via holes are critical for the proper performance of this device. 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink. 4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink. 5. RF trace width depends upon the PCB material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters. RFHIC Corporation (RFHIC) reserves the right to make changes to any products herein or to discontinue any product at any time without notice. RFHIC do not assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential or incidental damages. The product specifications herein expressed have been carefully checked and are assumed to be reliable. However, RFHIC disclaims liability for inaccuracies and strongly recommends buyers to verify that the information they are using is current before placing purchase orders. RFHIC products are not intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or sells such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC and its directors, officers, stockholders, employees, representatives and distributors harmless against any and all claims arising out of such use. RFHIC’s liability under or arising out of damages, claims of whatsoever kind and nature which RFHIC products could cause shall be limited in amount to the net purchase price of the products sold to buyer by RFHIC. ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.2