SAMHOP STG8810

STG8810
Green
Product
S a mHop Microelectronics C orp.
Ver 1.0
Dual N-Channel Enhancement Mode Field Effect Transistor
FEATURES
Super high dense cell design for low R DS(ON).
PRODUCT SUMMARY
V DSS
ID
R DS(ON) (m Ω) Max
Rugged and reliable.
20 @ VGS=4.5V
20V
Suface Mount Package.
7A
28 @ VGS=2.5V
ESD Protected.
D 1/D 2
S1
S1
G1
8
7
6
5
1
2
3
4
D2
D1
T S S OP
D 1/D 2
S2
S2
G2
G1
(T OP V IE W)
G2
S1
S2
ABSOLUTE MAXIMUM RATINGS ( T A=25 °C unless otherwise noted )
Symbol
VDS
VGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
ID
Drain Current-Continuous
IDM
-Pulsed
a
Limit
20
±12
Units
V
V
TA=25°C
7
A
TA=70°C
5.6
A
28
A
1.5
W
1
W
-55 to 150
°C
85
°C/W
b
a
PD
Maximum Power Dissipation
TJ, TSTG
Operating Junction and Storage
Temperature Range
TA=25°C
TA=70°C
THERMAL CHARACTERISTICS
R JA
Thermal Resistance, Junction-to-Ambient
a
Details are subject to change without notice.
Nov,26,2008
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STG8810
Ver 1.0
ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body Leakage Current
IGSS
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(th)
Conditions
Min
VGS=0V , ID=250uA
20
Drain-Source On-State Resistance
gFS
Forward Transconductance
Max
1
±10
VDS=16V , VGS=0V
VGS= ±12V , VDS=0V
Units
V
uA
uA
0.85
1.5
16.5
20
V
m ohm
VGS=4V , ID=6.8A
17
21
m ohm
VGS=3V , ID=6.3A
20
25
m ohm
VGS=2.5V , ID=6A
23
28
m ohm
VDS=5V , ID=7A
12
S
VDS=10V,VGS=0V
f=1.0MHz
815
215
180
pF
pF
pF
28
ns
VDS=VGS , ID=250uA
VGS=4.5V , ID=7A
RDS(ON)
Typ
0.5
c
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
tD(ON)
Turn-On Delay Time
tr
Rise Time
tD(OFF)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
c
VDD=10V
ID=1A
VGS=4.5V
RGEN=10 ohm
VDS=10V,ID=7A,
VGS=4.5V
83
ns
63
ns
41
ns
11.5
nC
2.4
nC
5
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
IS
Maximum Continuous Drain-Source Diode Forward Current
VSD
Diode Forward Voltage
b
VGS=0V,IS=2.0A
0.79
2.0
1.2
A
V
Notes
_ 10sec.
a.Surface Mounted on FR4 Board,t <
_ 2%.
_ 300us, Duty Cycle <
b.Pulse Test:Pulse Width <
c.Guaranteed by design, not subject to production testing.
Nov,26,2008
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STG8810
Ver 1.0
30
15
24
VGS=2.5V
I D, Drain Current(A)
I D, Drain Current(A)
VGS=4.5V
VGS=2V
18
12
6
0
1.5
1
0.5
2.5
2
25 C
Tj=125 C
0.5
3
1.0
1.5
2.0
2.5
3.0
V DS, Drain-to-Source Voltage(V)
V GS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
60
1.8
R DS(on), On-Resistance
Normalized
50
R DS(on)(m Ω)
-55 C
6
0
0
40
30
VG S =2.5V
20
VG S =4.5V
10
1.6
1.4
V G S =4.5V
I D = 7A
1.2
V G S =2.5V
I D =6 A
1.0
0.8
1
6
12
18
24
30
0
25
50
75
100
125
150
T j ( °C )
I D, Drain Current(A)
Tj, Junction Temperature(° C )
Figure 3. On-Resistance vs. Drain Current
and Gate Voltage
Figure 4. On-Resistance Variation with Drain
Current and Temperature
BVDSS, Normalized
Drain-Source Breakdown Voltage
1.6
Vth, Normalized
Gate-Source Threshold Voltage
9
3
VGS=1.5V
0
12
V DS =V G S
I D =250uA
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50
-25
0
25
50
75
100 125 150
Tj, Junction Temperature(° C )
1.20
I D =250uA
1.15
1.10
1.05
1.00
0.95
0.90
-50
-25
0
25
50
75
100 125 150
Tj, Junction Temperature(° C )
Figure 5. Gate Threshold Variation
with Temperature
Figure 6. Breakdown Voltage Variation
with Temperature
Nov,26,2008
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STG8810
Ver 1.0
60
20.0
Is, Source-drain current(A)
I D =7 A
50
RDS(on)(m Ω)
40
30
125 C
20
75 C
10
0
0
2
25 C
2.5
3
3.5
25 C
125 C
75 C
1.0
0
0.4
0.8
1.2
1.6
2.0
V GS, Gate-to-Source Voltage(V)
VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs.
Gate-Source Voltage
Figure 8. Body Diode Forward Voltage
Variation with Source Current
V GS, Gate to Source Voltage(V)
Ciss
750
C, Capacitance(pF)
5.0
4
900
600
450
Coss
300
Crss
150
0
0
10.0
2
4
6
8
10
5
V DS = 10V
I D =7 A
4
3
2
1
0
12
0
2
4
8
6
10
12
14 16
V DS, Drain-to-Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
1000
100
I D, Drain Current(A)
Switching Time(ns)
60
Tr
TD(off)
Tf
TD(on)
10
VDS=10V,ID=1A
VGS=4.0V
1
1
10
(
it
10
1m
1
0.1
100
S
L im
10
0.1
10
RD
)
ON
10
0m
0u
s
s
ms
s
DC
V G S =4.5V
S ingle P ulse
T A =25 C
1
10
30 50
Rg, Gate Resistance(Ω)
V DS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Nov,26,2008
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STG8810
Ver 1.0
VDD
t on
VIN
D
tf
90%
90%
VOUT
VOUT
VGS
RGEN
t off
td(off)
tr
td(on)
RL
10%
INVERTED
10%
G
90%
A
S
V IN
50%
50%
10%
PULSE WIDTH
Figure 14. Switching Waveforms
Figure 13. Switching Test Circuit
Normalized Transient
Thermal Resistance
10
1
0.5
0.2
P DM
0.1
0.1
t1
t2
0.05
0.02
0.01
0.01
0.00001
1.
2.
3.
4.
Single Pulse
0.0001
0.001
0.01
0.1
1
10
R thJ A (t)=r (t) * R thJ A
R thJ A =S ee Datas heet
T J M-T A = P DM* R thJ A (t)
Duty C ycle, D=t1/t2
100
1000
Square Wave Pulse Duration(sec)
Normalized Thermal Transient Impedance Curve
Nov,26,2008
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STG8810
Ver 1.0
PACKAGE OUTLINE DIMENSIONS
DETAIL A
T S S OP -8
DETAIL A
MIN
0.85
0.80
0.19
MAX
MIN
0.033
0.031
0.007
0.30
MAX
0.012
2
2
3
3
Notes: 1. This drawing is for general information only.Refer to JEDEC Drawing MO-153,Variation AA,for
proper dimensions,tolerances,datums,etc.
2. Dimension D does not include mold Flash,protrusions or gate burrs.Mold Flash,protrusions and
gate burrs shall not exceed 0.15 mm (0.006 in) per side.
3. Dimension E does not include inter-lead Flash or protrusions.Inter-lead Flash and protrusions
shall not exceed 0.25mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion.Allowable Dambar protrusion shall be 0.08 mm
total in excess of the b dimension at maximum material condition.Dambar cannot be located on
the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E to be determined at Datum Plane H.
Nov,26,2008
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STG8810
Ver 1.0
TSSOP-8 Tape and Reel Data
TSSOP-8 Carrier Tape
UNIT : р
PACKAGE
TSSOP
8
A0
6.08
B0
4.40
K0
D0
D1
E
E1
E2
1.60
ӿ1.50
+ 0.1
- 0.0
ӿ1.50
+ 0.1
- 0.0
12.00
² 0.3
1.75
5.50
² 0.05
P1
P2
T
8.00
4.00
2.00
²0.05
0.30
²0.05
W
W1
H
16.0
ӿ13.0
+ 0.5
- 0.2
K
S
G
R
10.6
2.0
²0.5
P0
TSSOP-8 Reel
UNIT : р
TAPE SIZE
12 р
REEL SIZE
ӿ330
M
330
N
100
12.5
V
Nov,26,2008
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