Z-Power LED X10490 Technical Data Sheet Specification CFT732-S Preliminary SSC Drawn Approval CUSTOMER Approval Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Colors of CFT732-S 7. Outline Dimension 8. Recommend Circuit 9. Packing 10. Lot Number 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CFT732-S Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. CFT732-S Features • Pb-free Reflow Soldering application • RoHS Compliant • 6-Pin • White colored SMT package and diffused (milky color) • Suitable for all SMT assembly methods • ESD-withstand voltage : up to 1 kV (MIL-STD-883D) • High Reliability (silicone resin) Applications • Indoor and outdoor displays • LCD Backlights etc. • R G B – displays • Automotive • Signage and Channel letter • Indicator Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings (Ta=25ºC) Value Parameter Symbol Unit Red Green Blue Yellow Forward Current IF 30 30 30 30 mA Forward Peak Surge Current *2 IFM 100 100 100 100 mA Reverse Voltage (per die) VR 5 81*3 Power Dissipation Pd 120*3 V 114*3 252*3 mW 263*4 Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 3. Electric & Optical characteristics Parameter Forward Voltage Reverse Current (Ta=25ºC) Symbol Condition Min Typ Max VF IF =20mA (per chip) 1.8 2.2 2.5 3.0 3.2 3.5 IR VR=10V (per die) - - 1 - 700 - - 370 - - 1200 - Blue - 400 - Red - 1.7 - - 1.0 - - 3.0 - - 0.9 - - 632 - - 590 - - 518 - Blue - 453 - Red 620 623 625 586 590 596 520 527 535 Blue 455 460 465 Red - 15 - - 14 - - 33 - - 23 - - 110 - - 0.015 - - 0.01 - - 0.19 - - 0.006 - R, Y G, B R, Y, G, B Red Luminance Intensity *1 Luminance Flux *1 Yellow Green Yellow Green IV ΦV IF =20mA (per chip) IF =20mA (per chip) Blue Red Peak Wavelength Dominant Wavelength Spectral Bandwidth Yellow Green Yellow Green Yellow Green λP λd ∆λ IF =20mA (per chip) IF =20mA (per chip) IF =20mA (per chip) Blue Viewing Angle *3 R, G, B, Y 2θ½ IF =20mA (per die) Red Optical Efficiency Yellow Green Blue ηop IF =20mA (per chip) Unit V µA mcd lm nm nm nm deg. lm/W *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2 ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 100 Y e llo w 50 G re e n B lu e Red 20 10 5 1 1 .6 2 .0 2 .4 2 .8 3 .2 3 .6 4 .0 4 .4 4 .8 F o rw a rd V o lta g e V F [V ] Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 6 RED BLUE GREEN yellow 5 Relative Luminosity (a.u.) Forward Current IFP [mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 4 3 2 1 0 0 20 40 60 80 100 120 Forward Current IFP [mA] Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current Derating Curve : 1 Chip on Forward Current IF[mA] 30 20 10 Red, Yellow, Green, Blue 0 0 20 40 60 80 100 o Ambient Temperature Ta[ C] Forward Current Derating Curve : 4 Chip on 30 Forward Current IF[mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 20 10 Red, Yellow, Green, Blue 0 0 20 40 60 80 100 o Ambient Temperature Ta[ C] Document No. : SSC-QP-7-07-24 (Rev.00) Spectrum (TA=25℃, IF=20mA) 1.0 Intensity Irel [a.u.] 0.8 RED YELLOW GREEN BLUE 0.6 0.4 0.2 0.0 400 500 600 700 Wavelength λ[nm] (TA=25℃, IF=20mA/chip) 1.0 0.8 Intensity Irel [a.u.] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength λ[nm] Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Radiation Diagram (Ta=25 OC ) 90 120 150 180 y-axis x-axis 60 30 0 Document No. : SSC-QP-7-07-24 (Rev.00) Red X 0.69 0.706 0.692 0.678 Green Yellow Y 0.3 0.298 0.312 0.312 X 0.536 0.545 0.575 0.566 Blue A Y 0.445 0.454 0.424 0.415 X 0.166 0.201 0.176 0.137 B Y 0.677 0.687 0.749 0.739 X 0.201 0.236 0.22 0.176 1 Y 0.687 0.685 0.744 0.749 X 0.153 0.164 0.155 0.143 2 Y 0.022 0.039 0.05 0.031 X 0.143 0.155 0.148 0.134 Y 0.031 0.05 0.065 0.044 0.9 0.8 0.7 0.6 0.5 y Z-Power LED X10490 Technical Data Sheet 5. Color & Binning (Standard Binning) 0.4 520 525 515 530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 Green A B Yellow 0.3 490 0.2 Red 610 620 630 830 485 480 0.1 Blue 0.0 0.0 2 1 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x Document No. : SSC-QP-7-07-24 (Rev.00) 0.9 0.8 0.7 0.6 0.5 y Z-Power LED X10490 Technical Data Sheet 5. Color & Binning (Special Binning ) 0.4 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x ◈ Target of Color : Bluish White (Cool White) - Color Coordinates (typ.): x 0.237 , y 0.217 - IF Condition => 10mA for Red / 20mA for Yellow / 20mA for Green / 20mA for Blue - 1 Bin, Cell Size = x 0.0341 , y 0.0217 - 9 Bin, Total Cell Size = x 0.088 , y 0.091 - Color Rank : a, b, c, d, e, f, g, h (8 BIN) Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Colors of CFT732-S (Standard Color) Step Color (20mA per Chip) Color Coordinate(Typ.) Symbol Color Name X Y 1 R Red 0.700 0.300 2 G Green 0.164 0.712 3 B Blue 0.146 0.040 4 Y Yellow 0.562 0.437 5 RG Greenish Yellow 0.445 0.496 6 RB Violet 0.279 0.102 7 RY Redish Orange 0.660 0.340 8 GB Bluish Green 0.150 0.190 9 GY Yellowish Green 0.289 0.625 10 BY Purpleish Blue 0.193 0.084 11 RGB Bulish White 0.258 0.210 12 RGY Greenish Yellow 0.466 0.485 13 RBY Purple 0.304 0.132 14 GBY Greenish Blue 0.188 0.212 15 RGBY Bulish White 0.281 0.227 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Colors of CFT732-S (Standard Color) 0.9 0.8 515 520 525 530 535 540 510 545 2 0.7 550 555 505 9 0.6 560 565 570 500 575 0.5 5 12 580 y 585 4 0.4 590 495 595 600 7610 0.3 0.2 620 1630 830 490 485 8 14 15 11 13 480 0.1 10 475 6 470 3 0.0 0.0 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x Document No. : SSC-QP-7-07-24 (Rev.00) Step Full White Color Balance Current IFbal[mA] Color Coordinates (Typ.) CCT X Y R Y G B 0 Balance White 28000K 0.2778 0.2256 20 20 20 20 1 Bulish White Undefined 0.243 0.218 10 20 20 20 2 Pure White 7400K 0.303 0.298 15 20 20 10 3 Natural White 4000K 0.385 0.387 20 15 20 4 4 Warm White 2800K 0.449 0.412 20 20 14 2 5 Candle Light 2000K 0.547 0.427 20 6 7 0 0.9 BLUISH 7400K 4000K 2800K 2000K Balance white 0.8 0.7 0.6 0.5 y Z-Power LED X10490 Technical Data Sheet 6. Colors of CFT732-S (Special Color ) 0.4 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7.Outline Dimension Package Outlines 6 Package Marking 5 4 1 2 3 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Recommended Solder Pad Circuit Diagram Anode Anode 2 5 1 3 Blue Green Cathode Cathode 4 6 Red Yellow Cathode Cathode * MATERIALS PARTS MATERIALS Package Heat-Resistant Polymer Encapsulating Resin Silicone Resin (Diffused) Electrodes Ag Plating Copper Alloy Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Recommend Circuit Circuit Diagram Anode Anode 2 5 1 3 4 6 Red Yellow Cathode Cathode Blue Green Cathode Cathode Circuit (Led Dot Matrix - Dynamic Drive) S1 Scan Line 6 1 5 2 4 3 S2 S4 S3 Anode Anode Anode Anode Anode Anode Anode Anode 2 5 2 5 2 5 2 5 1 3 Blue Green Cathode Cathode 4 6 Red Yellow Cathode Cathode 1 3 Blue Green Cathode Cathode 4 6 Red Yellow Cathode Cathode 1 3 Blue Green Cathode Cathode 4 6 Red Yellow Cathode Cathode 1 3 Blue Green Cathode Cathode 4 6 Red Yellow Cathode Cathode Data Line D1 D2 D3 D4 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel XXX RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXX RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c XXX RANK: 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : RoHS XXXXXX SEOUL SEMICONDUCTOR CO., LTD. b a Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Lot Number The lot number is composed of the following characters; CFT○□□◎◎ # ~ # CFT –First Part Name ○ – Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# – The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : CFT80426 01 512 PART NUMBER : CFT732-S SEOUL SEMICONDUCTOR CO., LTD. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 o C / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Document No. : SSC-QP-7-07-24 (Rev.00)