SEOUL SUYT801

Z-Power LED
X10490
Technical
Data
Sheet
Specification
SUYT801
SSC
Drawn
Approval
고객명
Approval
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
SUYT801
1. Features
2.
Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. Outline Dimension
6. Packing
7. Soldering
8. Precaution for use
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
SUYT801
SUYT801
Features
Description
This surface-mount LED
comes in PLCC standard
package dimension. It has a
substrate made up of a molded
plastic reflector sitting on top
of a bent lead frame. The die is
attached within the reflector
cavity and the cavity is
encapsulated by epoxy or
silicone
The package design coupled
with careful selection of
component materials allow
these products to perform with
high reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
사진
• Industry Standard
PLCC SMT package
• High brightness
using AlInGaP and
InGaN dice
technologies
• Available in multiple
colors
• High volume, high
reliability
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 09
December 2006
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
1. Features
• Yellow colored SMT package
• Material AlInGaP
• Suitable for all SMT assembly methods
Suitable for all soldering methods
• RoHS Compliant
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
75
mW
Forward Current
IF
30
mA
90
mA
Peak Forward Current
IFM
*2
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40 ~ +100
oC
Storage Temperature
Tstg
-40 ~ +100
oC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage
VF
IF =20mA
1.7
2.1
2.5
V
Reverse Current
IR
VR=5V
-
-
10
µA
Luminance Intensity *1
IV
IF =20mA
250
350
500
mcd
Peak Wavelength
λP
IF =20mA
-
595
-
nm
Dominant Wavelength
λd
IF =20mA
584
589
594
nm
Spectral Bandwidth 50%
∆λ
IF =20mA
-
17
-
nm
½
IF =20mA
-
120
-
deg.
Viewing Angle *2
2θ
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of
the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
10
10
(Ta=25 OC )
2
1
0
1 .8 0
1 .8 5
1 .9 0
1 .9 5
2 .0 0
(Ta=25 OC )
1 .6
Relative Luminous Intensity Iv/Iv [Rel]
10
Forward Current IF [mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
1 .4
1 .2
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
2 .0 5
0
5
10
15
20
25
30
Forward Current IF [mA]
Forward Voltage VF (V)
Forward Current Derating Curve
Radiation Diagram
(Ta=25 OC )
40
Forward Current IF [mA]
0
-30
30
20
-60
30
60
10
-90
90
0
-40
-20
0
20
40
60
80
100
120
Ambient Temperature TA [OC]
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Recommended Solder Pattern
1.9
2.80
2.20
0.80
1.8
0.85
1.6
Cathode
1.8
1.50
3.20
2.40
1.65
Anode
C0.8
2.2
0.50
0.15
ATTENTION MARKING ON LED IS ANODE(+)
( Tolerance: ±0.2, Unit: mm )
6. packing
1 .5 5 ± 0 .0 5
4 .0 ±0 .1
1.75±0.1
2 .0 ±0 .0 5
0 .2 2 ±0 .0 5
3.83±0.1
5°
3.5±0.1
8±0.1
1 .0 ±0 .1
8°
3 .1 ±0 .1
2 .2 2 ±0 .1
11.4 ± 0.1
180 +0
-3
9.0 ± 0.3
LABLE
2.0 ± 0.2
13
30°
10
±0.2
60
Z-Power LED
X10490
Technical
Data
Sheet
5.outline dimension
22
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
b
a
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 o C / sec.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 00
November 2007
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.00)