Z-Power LED X10490 Technical Data Sheet Specification UHPT722 SSC Drawn Approval 고객명 Approval 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Rank of UHPT722 6. Outline Dimension 7. Packing 8. Lot number 9. Soldering 10. Precaution for use 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet UHPT722 Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. UHPT722 Features • Pb-free Reflow Soldering application • RoHS Compliant • Material:AlGaInP/GaP • Suitable for all SMT assembly methods ; Suitable for all soldering methods • White colored SMT package and colorless clear window • Encapsulating Resin : Epoxy Resin Applications • Indoor and outdoor displays • LCD Backlights etc. • Red – displays • Automotive • Signage and Channel letter • Indicator 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation Pd 234 mW Forward Current IF 90 mA 100 mA Peak Forward Current IFM *2 Reverse Voltage (per die) VR 5 V Operating Temperature Topr -30 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric & Optical characteristics Sym bol Condition Min Typ Max Unit Forward Voltage (per die) VF IF =20 mA - 2.2 2.8 V Reverse Current (per die) IR VR=5V - - 10 µA Parameter Luminance Intensity IV IF =60 mA Luminance Flux ΦV IF =60 mA - 3 - lm Dominant Wavelength λd IF =60 mA 618 630 363 nm Peak Wavelength λP IF =60mA - 640 - nm ∆λ IF =60 mA - 20 - nm 2θ½ IF =60 mA - 120 - deg ηopt IF =60 mA - 23 - lm/W *1 Spectral Bandwidth Viewing Angle *2 Optical Efficiency 1000 mcd *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. 서식번호 : SSC-QP-7-07-24 (Rev.00) Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) Forward Current IF[mA] 100 50 20 10 5 1 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 Forward Voltage VF[V] Relative Luminous Intensity vs Forward Current (Ta=25 OC ) Relative Luminous Intensity IV/IV(25 C)[a.u.] 6 5 o Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 4 3 2 1 0 0 30 (10) 60 (20) 90 (30) 120 (40) 150 (50) 180 (60) 210 (70) 240 (80) 270 300 < total (90) (100)< per die Forward Current IF[mA] 서식번호 : SSC-QP-7-07-24 (Rev.00) Ambient Temperature vs. Allowable Forward Current (per die) (Ta=25 OC ) 40 3 Chip ON 30 Foward Current IF[mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 20 10 0 0 20 40 60 80 100 o Ambient Temperature TA[ C] Radiation Diagram 0 -30 -60 -90 30 60 90 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Rank of UHPT722 ▣ Rank Name Table X1 X2 X3 IV λd Vf ▣ Luminous Intensity [mcd] Rank Name MIN MAX N 350 650 O 650 880 P 880 1200 Q 1200 1700 ▣ Dominant Wavelength [nm] Rank Name MIN MAX A 618 624 B 624 630 C 630 636 ▣ Forward Voltage [V] Rank Name MIN MAX 1 1.9 2.2 2 2.2 2.4 3 2.4 2.6 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6.outline dimension Package Outlines 5 6 4 Package Marking (Cathode) 1 2 3 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Recommended Solder Pad Circuit Diagram Red Anode Red Anode Red Anode 6 5 4 R1 R2 R3 1 2 3 Red Cathode Red Cathode Red Cathode * MATERIALS PARTS MATERIALS Package Heat-Resistant Polymer Encapsulating Resin Epoxy Resin Electrodes Ag Plating Copper Alloy 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. packing Package Marking ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel XXX RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXX RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c XXX RANK: 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : RoHS XXXXXX SEOUL SEMICONDUCTOR CO., LTD. b a 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. lot number The lot number is composed of the following characters; UHPT○□□◎◎ # ~ # UHPT –First Part Name ○ – Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# – The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : UHPT70426 01 512 PART NUMBER : UHPT722 SEOUL SEMICONDUCTOR CO., LTD. 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 o C / sec. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. 서식번호 : SSC-QP-7-07-24 (Rev.00)