SEOUL X92050C

Z-Power LED
X10490
Technical
Data
Sheet
X92050C
X92050C
Description
Features
Z-Power series is designed for high
•
current operation and high flux
Super high Flux output
and high Luminance
Designed for high
current operation
Low thermal resistance
SMT solderbility
Lead Free product
RoHS compliant
•
output applications. Furthermore,
•
•
•
•
its thermal Management
characteristic is better than other
LED Solutions.
By package SMD design and good thermal emission
material.
According to these advantages, it enables to apply various
lighting applications and design solution, Automotive
lighting, and large size LCD backlight etc.
Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
Mobile phone flash
Automotive interior /
exterior lighting
Automotive signal
lighting
Automotive forward
lighting
General Torch
Architectural lighting
LCD TV / Monitor
Backlight
Projector light source
Traffic signals
Task lighting
Decorative / Pathway
lighting
Remote / Solar
powered
lighting
Household appliances
*The appearance and specifications of the product may be changed
for improvement without notice.
Rev. 03
1
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
Full Code of Z-Power LED Series
Full code form : X1 X2 X3 X4 X5 X6 X7– X8 X9 – X10 X11 X12 X13 X14
1. Part Number
- X1 : Color
- X2 : Z-Power LED series number
- X3 : LENS type
- X4 : Chip quantity or Watt
- X5 : Package outline size
- X6 : Type of PCB
- X7 : Grade of characteristic code
2. Internal Number
- X8
- X9
3. Code Labeling
- X10 : Luminous flux (or Radiant flux for royal blue)
- X11 X12 X13 : Dominant wavelength (or x, y coordinates rank code)
- X14 : Forward voltage
4. Sticker Diagram on Reel & Aluminum Vinyl Bag
PART NO. : X1 X2 X3 X4 X5 X6 X7 – X8 X9
QUANTITY : ###
LOT NUMBER : ##########
X10 X11 X12 X13 X14
BIN CODE :
For more information about binning and labeling, refer to the Application Note -1
Rev. 03
2
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
Outline Dimension
Notes : Notes :
1. All dimensions are in millimeters. ( Lens tolerance : +0.25 Package tolerance : ±0.2 )
2. Scale : none
3. Slug of package is connected to anode.
Rev. 03
3
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
Characteristics for Z-Power LED
1. Pure White (W92050C)
1-1 Electro-Optical characteristics at IF=150mA, TA=25ºC
Parameter
Luminous Flux
Symbol
[1]
Correlated Color Temperature
[3]
CRI
Forward Voltage
[4]
Value
Unit
Min
Typ
Max
ФV [2]
-
28
-
lm
CCT
-
6300
-
K
Ra
-
70
-
-
VF
-
3.65
-
V
2Θ ½
typ. 123
deg.
Rθ
23
ºC /W
Parameter
Symbol
Value
Unit
Forward Current
IF
0.2
A
Power Dissipation
PD
0.8
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +120
ºC
-
±15,000V HBM
-
View Angle
Thermal resistance
[5]
1-2 Absolute Maximum Ratings
ESD Sensitivity
[6]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5] Rθ is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[6] It is included the zener chip to protect the product from ESD.
* Caution
1. Please do not drive at rated current more than 5 sec. without proper heat sink
Rev. 03
4
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
Characteristics for Z-Power LED
2. Warm White (N92050C)
2-1 Electro-Optical characteristics at IF=150mA, TA=25ºC
Parameter
Luminous Flux
Symbol
[1]
Correlated Color Temperature
[3]
CRI
Forward Voltage
[4]
Value
Unit
Min
Typ
Max
ФV [2]
-
15
-
lm
CCT
-
3000
-
K
Ra
-
80
-
-
VF
-
3.65
-
V
2Θ ½
typ. 120
deg.
Rθ
23
ºC /W
Parameter
Symbol
Value
Unit
Forward Current
IF
0.2
A
Power Dissipation
PD
0.8
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +120
ºC
-
±15,000V HBM
-
View Angle
Thermal resistance
[5]
2-2 Absolute Maximum Ratings
ESD Sensitivity
[6]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5] Rθ is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[6] It is included the zener chip to protect the product from ESD.
* Caution
1. Please do not drive at rated current more than 5 sec. without proper heat sink
Rev. 03
5
May 2008
www.ZLED.com
1. Pure White
1.0
Standard eye response curve
Relative Spectral Power
Distribution
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
700
800
Wavelength (nm)
2. Warm White
1.0
0.8
Relative Spectral Power
Distribution
Z-Power LED
X10490
Technical
Data
Sheet
Color Spectrum
0.6
0.4
0.2
0.0
300
400
500
600
Wavelength (nm)
Rev. 03
6
May 2008
www.ZLED.com
Relative Light Output vs. Junction Temperature at IF=150mA
120
Relative Light Output [%]
Z-Power LED
X10490
Technical
Data
Sheet
Light Output Characteristics
White
100
80
60
40
20
0
25
50
75
100
125
o
Junction Temperature, TJ [ C]
Rev. 03
7
May 2008
www.ZLED.com
1. Forward Voltage vs. Forward Current
Average Forward Current [mA]
200
White
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Forward Voltage [V]
2. Forward Current vs. Normalized Relative Luminous Flux
White
1.4
Relative LuminousFlux(a.U)
Z-Power LED
X10490
Technical
Data
Sheet
Forward Current Characteristics
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
50
100
150
200
Forward Current(mA)
Rev. 03
8
May 2008
www.ZLED.com
1. White (TJMAX = 125 ℃, @150mA)
200
150
Current [mA]
Z-Power LED
X10490
Technical
Data
Sheet
Ambient Temperature vs Allowable Forward Current
100
o
RjaT = 70 C/W
o
RjaT = 50 C/W
o
RjaT = 30 C/W
50
0
0
25
50
75
100
125
150
o
Ambient Temperature [ C]
Rev. 03
9
May 2008
www.ZLED.com
1. Pure White
0
1.0
30
Relative luminous flux
0.8
0.6
60
0.4
0.2
90
0.0
-80
-60
-40
-20
0
Angle(deg.)
2. Warm White
0
1.0
30
0.8
Relative luminous flux
Z-Power LED
X10490
Technical
Data
Sheet
Typical Dome Type Radiation pattern
0.6
60
0.4
0.2
0.0
-80
-60
-40
-20
0
90
Angle(deg.)
Rev. 03
10
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
Recommended Solder Pad
1. Solder pad
3 solder point
PCB
Silk
(t=15um)
Copper
<Footprint & Solder pad>
<Rear view>
2. Solder paste pattern
Paste thickness : 0.2mm
Note :
1. All dimensions are in millimeters (tolerance : ±0.2 )
2. Scale none
3. This drawing without tolerances are for reference only
Rev. 03
11
May 2008
www.ZLED.com
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
180
~
Z-Power LED
X10490
Technical
Data
Sheet
3. Reflow Soldering Conditions / Profile
Pre-heating
Cooling
-5 °C/sec
Rising
5 °C/sec
150
0
Time
[Hr]
4. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Rev. 03
12
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
16
PS
6
EIAJ RRM
06
20
40
60
80
Emitter Type Reel Packaging
D
MARK
Note :
1. The number of loaded products in the reel is 1000ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
Rev. 03
13
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
Precaution for use
• Storage
Avoid the absorption of moisture, we recommended to store Z Power LEDs in a dry box
(or desiccator) with a desiccant . Otherwise, store them in the following environment:
Temperature : 5℃~30℃ Humidity : 50% max.
• Precaution after opening packaging
However LED is correspond SMD, when LED be soldered dip, interfacial separation
may affect the light transmission efficiency, causing the light intensity to drop.
Attention in followed.
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
components should be dried for 10-12hr at 60±5℃
• Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temp. after soldering.
• Avoid quick cooling
• Components should not be mounted on warped direction of PCB.
• Anti radioactive ray design is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication.
These products are dangerous if they are burned or smashed in the process of disposal.
It is also dangerous to drink the liquid or inhale the gas generated by such products
when chemically disposed.
• This device should not be used in any type of fluid such as water, oil, organic solvent
and etc. When washing is required, IPA(Isopropyl Alcohol) should be used.
• When the LEDs are illuminating, operating current should be decided
after considering the package maximum temperature.
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
• The appearance and specifications of the product may be modified for improvement
without notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• Slug polarity is anode.
Rev. 03
14
May 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
Handling of Silicone resin LEDs
Z-Power LED is encapsulated by silicone resin for the highest flux efficiency.
Notes for handling of Silicone resin Z-Power LEDs
• Avoid touching silicone resin parts especially by sharp tools such as pincette
(Tweezers)
• Avoid leaving fingerprints on silicone resin parts.
• Dust sensitivity silicone resin need containers having cover for storage.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on
the surface of the resin must be prevent.
• Please do not force over 3000 gf impact or pressure diagonally on the silicon lens.
It will cause fatal damage of this product
• Please do not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
Rev. 03
15
May 2008
www.ZLED.com