SHOULDER HDF4623

规格书编号
SPEC NO :
产品规格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HD F4623
PREPARED 编 制:
CHECKED 审 核: Houshihong
APPROVED 批 准: CHARLES
D A T E 日 期: 2007-01-25
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
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Fax:0755-82916881
E-mail:[email protected]
Page 1 of 11
HD F4623
SAW FILTER
更改历史记录
History Record
更改日期
Date
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规格书编号
Spec No
产品型号
Part No
客户产品型号
Customer No
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更改内容描述
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备注
Remark
Page 2 of 11
HD F4623
SAW FILTER
1.Features
_ RF bandpass filter for CDMA450 Rx. Part
_ Usable bandwidth 5MHz (460.0 MHz ~ 465.0MHz)
_ High attenuation
_ No matching single-balanced operation ( single 50Ω / balance 100Ω )
_ Ceramic Surface Mounted Device Package ( 3.0 mm × 3.0mm )
_RoHS Compliant
2. ELECTRICAL SPECIFICATION
Parameter
Operating Temperature Range
Storage Temperature Range
Power Handling Capability
Electronic Characteristics
2-1.Typical frequency response
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Rating
-30~85
-40~85
20
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Unit
°C
°C
dBm
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HD F4623
SAW FILTER
2-2 Input / Output VSWR Charts
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HD F4623
SAW FILTER
2-3Input / Output Smith Charts
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HD F4623
SAW FILTER
2-4.Electrical characteristics
Minimum
Center Frequency ( F0 )
MHz
Insertion Loss (F0 +/- 2.5 MHz)
Amplitude Ripple (F0 +/- 2.5 MHz)
dB
dB
VSWR (F0 +/- 2.5 MHz)
Relative Attenuation
0.3 MHz ~ 450.0 MHz
450.0 MHz ~ 455.0 MHz
482.5 MHz ~ 492.5 MHz
492.5 MHz ~ 1200 MHz
1200 MHz ~ 1500 MHz
1500 MHz ~ 2000 MHz
Input/Output Impedance
Typical
Maximum
462.5
-
-
-
2.5
3.0
-
0.5
1.0
-
1.7
2.1
-
dB
Ω
45
30
20
45
40
30
50
35
30
-
Single 50 / balance 100
3. TEST CIRCUIT
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HD F4623
SAW FILTER
4-1. DIMENSION
4-2Marking Configuration
1) Pad Number 1 Index
2) Manufacturer name
3) Marking Number
5.Environmental Performance Characteristics
Item
High
temperature
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Condition
The specimen shall be store at a temperature of
85±2℃ for 96±4h. Then it shall be subjected to
standard atmospheric conditions for 1h, after
which measurement shall be made within 1h.
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Specifications
Page 7 of 11
HD F4623
SAW FILTER
Low
temperature
Humidity
Thermal
shock
Resistance to
Soldering
heat
The specimen shall be store at a temperature of
-30±3℃ for 96±4h. Then it shall be subjected to
standard atmospheric conditions for 1h, after
which measurement shall be made within 1h.
The specimen shall be store at a temperature of
40±2℃ with relative humidity of 90% to 96%
for 96±4h. Then it shall be subjected to standard
atmospheric conditions for 1h, after which
measurement shall be made within 1h.
The specimen shall be subjected to 8 continuous
cycles each as shown below. Then it shall be
subjected to standard atmospheric conditions for
1h, after which measurement shall be made
within 1h.
Temperature
Duration
1
+25℃=>-40℃
0.5h
2
-40℃
4h
3
-40℃=>+85℃
2h
4
+85℃
4h
5
+85℃=>+25℃
0.5h
6
+25℃
1h
Reflow soldering method
Peak: 255 ±5 ℃, 220 ±5℃, 40s
At electrode temperature of the specimen.
Mechanical
characteristics and
specifications
in
electrical
characteristics shall
be satisfied. There
shall
be
no
excessive change in
appearance.
The specimen shall be passed through the reflow
furnace with the condition shown in the above
profile for 1 time.
The specimen shall be stored at standard
atmospheric conditions for 1h, after which the
measurement shall be made. Test board shall be
1.6 mm thick. Base material shall be glass fabric
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Page 8 of 11
HD F4623
SAW FILTER
Solder ability
base epoxy resin.
Immerse the pins melt solder at 260℃+5/-0℃ More then 95% of
for 5 sec.
total area of the
pins should be
covered with solder
6.Mechanical Test
Items
Vibration
Drop
Lead pull
Lead bend
Conditions
600-3300rpm amplitude 1.5mm
3 directions 2 H each
On maple plate from 1m high 3 times
Pull with 1kg force for 30 seconds
90o bending with 500g weigh 2 times
Specifications
There shall be no
damage.
7. REMARK
7.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
7.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the
component.
Please avoid ultrasonic cleaning
7.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
8. Packing
8.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
8.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
8.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
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HD F4623
SAW FILTER
(2) Label
Device Name
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
9. TAPE SPECIFICATIONS
9.1 Tensile Strength of Carrier Tape: 4.4N/mm width
9.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
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Page 10 of 11
HD F4623
SAW FILTER
[Figure 1] Carrier Tape Dimensions
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.0
±0.3
5.5
±0.05
1.75
±0.1
4.0
±0.1
8.0
±0.1
2.0
±0.05
Ø1.5
±0.1
Ø1.0
±0.25
0.3
±0.05
2.10
±0.1
6.40
±0.1
5.20
±0.1
[Figure 2]
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
13
±0.3
3
max.
1.0
max.
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Page 11 of 11