SILAN SC16426

SC16426
64-BIT LED STATIC DRIVER
DESCRIPTION
SC16426 is a LED driver circuit. It features in few communication
ports (4 ports are used for interaction communication with the single-chip
78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43
microcomputer), strong anti-interference capability (automatic error
42
79
41
80
1
correction for communication data), heavy current drive (driving 64 LED
40
2
3
all together at most, each is 22mA), good uniformity of drive current and
39
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
so on.
FEATURES
Chip Topography
* Few communication ports
* Strong anti-interference capability
* 22mA heavy current drive
* Good uniformity of drive current
ORDERING INFORMATIONS
APPLICATIONS
* Peripheral equipment for microcomputers
Device
Package
SC16426
CHIP
* Driver circuit matching with CD system
BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATING (Tamb=25°C, VSS=0V)
Parameter
Symbol
Rating
Unit
Power Supply (pin17)
VDD
6.0
V
Input /Output Voltage
VIN, VOUT
VSS-0.3V~VDD+0.3V
V
Tamb
-20 ~ +75
°C
Tstg
-55~+125
°C
Operating Temperature
Storage Temperature
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SC16426
DC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, Tamb=25°C, VDD=3V)
Parameter
Symbol
Test conditions
Operating Voltage
VDD
Normal working
Quiescent Current
IDS
no load
SEG Output Low Level Current
IOL
VDD=3V, VOL=0.3V
Min.
Typ.
Max.
Unit
2.0
3.0
5.0
V
0.8
1.0
μA
22
--
mA
--
PIN CONFIGURATION
PIN DESCRIPTIONS
Pin no.
Name
1
ERR
2
VDD
3~6
SEG0~3
7
GND
8~15
SEG4~11
16
GND
17~24
SEG12~19
25
GND
26~33
SEG20~27
34
GND
35~38
SEG28~31
Descriptions
Communication checking error, when CEB is at the falling edge, it is high
level, while the rising edge is low level.
Power supply, operating voltage is 2~5V
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
39
GND
Ground
40
DATA
Communication data
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SC16426
Pin no.
Name
Descriptions
41
CEB
Serial enable which is low active
42
GND
Ground
43~46
SEG32~35
47
GND
48~55
SEG36~43
56
GND
57~64
SEG44~51
65
GND
66~73
SEG52~59
74
GND
75~78
SEG60~63
79
CLR
80
CLK
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Ground
Segment drive, drive current is 22mA; When DATA is 0, LED output low
level; when DATA is 1, output is high impedance state
Clear display(do not clear display memory), and low active
Communication clock which is rising edge active (the maximum operating
frequency is 500KHz).
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SC16426
FUNCTION DESCRIPTIONS
64 SEG outputs are divided into 4 groups, and each group includes 16 SEG output ports. The structure of
communication data is 4-bit command code+4-bit b1s complement of command code+16-bit data code+16-bit
b1s complement of data code, as the following figure:
Command code description:
Command code(C3~C0)
Description
0000
Clear display & Clear display memory
0001
Transmit the first data
0010
Transmit the second data
0011
Transmit the third data
0100
Transmit the forth data
1111
Display data
Begin to transmit data when CEB is low level. If the command code is 0000 or 1111, only the former 8-bit code
is transmitted(that is to say no need to check the data code, if the command code is correct, it will be carried out);
If the command code is 0001, 0010, 0011, and 0100, a complete code needs to be transmitted. The ERR is low
at the rising edge of CEB when the command code is wrong (not the above 6 kinds of command) or the checking
is wrong (checking of command code, b1s complement of command code, data code and b1s complement of
data code); When the checking is correct, ERR is high, and carry out the command at the same time: if the data
code is 0, the corresponding SEG outputs low level; while the data code is 1, that outputs high impedance state.
TYPICAL APPLICATION CIRCUIT
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SC16426
CHIP TOPOGRAPHY
Chip size: 4.32x1.51 (mm2)
Note: The substrate is connected with power supply.
PAD COORDINATES
Pad No.
Symbol
X
1
ERR
-2043.10
2
VDD
-2043.10
3
SEG0
-2026.95
4
SEG1
5
Y
Pad No.
Symbol
X
Y
-107.40
41
CEB
2036.05
107.40
-218.40
42
GND
2043.00
218.10
-640.40
43
SEG32
2033.25
640.40
-1911.15
-640.40
44
SEG33
1917.45
640.40
SEG2
-1795.35
-640.40
45
SEG34
1801.65
640.40
6
SEG3
-1679.55
-640.40
46
SEG35
1685.85
640.40
7
GND
-1568.55
-640.40
47
GND
1574.85
640.40
8
SEG4
-1457.55
-640.40
48
SEG36
1463.85
640.40
9
SEG5
-1341.75
-640.40
49
SEG37
1348.05
640.40
10
SEG6
-1225.95
-640.40
50
SEG38
1232.25
640.40
11
SEG7
-1110.15
-640.40
51
SEG39
1116.45
640.40
12
SEG8
-979.65
-640.40
52
SEG40
985.95
640.40
13
SEG9
-863.85
-640.40
53
SEG41
870.15
640.40
14
SEG10
-748.05
-640.40
54
SEG42
754.35
640.40
15
SEG11
-632.25
-640.40
55
SEG43
638.55
640.40
16
GND
-521.25
-640.40
56
GND
527.55
640.40
17
SEG12
-410.25
-640.40
57
SEG44
416.55
640.40
18
SEG13
-294.45
-640.40
58
SEG45
300.75
640.40
19
SEG14
-178.65
-640.40
59
SEG46
184.95
640.40
20
SEG15
-62.85
-640.40
60
SEG47
69.15
640.40
21
SEG16
69.15
-640.40
61
SEG48
-62.85
640.40
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SC16426
Pad No.
Symbol
X
Y
Pad No.
Symbol
X
Y
22
SEG17
184.95
-640.40
62
SEG49
-178.65
640.40
23
SEG18
300.75
-640.40
63
SEG50
-294.45
640.40
24
SEG19
416.55
-640.40
64
SEG51
-410.25
640.40
25
GND
527.55
-640.40
65
GND
-521.25
640.40
26
SEG20
638.55
-640.40
66
SEG52
-632.25
640.40
27
SEG21
754.35
-640.40
67
SEG53
-748.05
640.40
28
SEG22
870.15
-640.40
68
SEG54
-863.85
640.40
29
SEG23
985.95
-640.40
69
SEG55
-979.65
640.40
30
SEG24
1116.45
-640.40
70
SEG56
-1110.15
640.40
31
SEG25
1232.25
-640.40
71
SEG57
-1225.95
640.40
32
SEG26
1348.05
-640.40
72
SEG58
-1341.75
640.40
33
SEG27
1463.85
-640.40
73
SEG59
-1457.55
640.40
34
GND
1574.85
-640.40
74
GND
-1568.55
640.40
35
SEG28
1685.85
-640.40
75
SEG60
-1679.55
640.40
36
SEG29
1801.65
-640.40
76
SEG61
-1795.35
640.40
37
SEG30
1917.45
-640.40
77
SEG62
-1911.15
640.40
38
SEG31
2033.25
-640.40
78
SEG63
-2026.95
640.40
39
GND
2043.00
-218.40
79
CLR
-2044.20
218.40
40
DATA
2036.05
-107.40
80
CLK
-2043.10
44.95
Note: the original point of the coordinate is the die center.
MOS DEVICES OPERATE NOTES:
Electrostatic charges may exist in many things. Please take following preventive measures to prevent effectively
the MOS electric circuit as a result of the damage which is caused by discharge:
z
The operator must put on wrist strap which should be earthed to against electrostatic.
z
Equipment cases should be earthed.
z
All tools used during assembly, including soldering tools and solder baths, must be earthed.
z
MOS devices should be packed in antistatic/conductive containers for transportation.
Note:Silan reserves the right to make changes without notice in this specification for the improvement of the design and performance.
Silan will supply the best possible product for customers.
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http: //www.silan.com.cn
REV:1.1
2008.07.18
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