TI 5962-0923301VPA

UC19432-SP
www.ti.com
SLUS951A – NOVEMBER 2009 – REVISED JULY 2010
Rad-Tolerant Class-V, Precision Analog Controller
Check for Samples: UC19432-SP
FEATURES
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(1)
QML-V Qualified, SMD 5962-09233
Rad Tolerant: 30 kRad(Si) TID (1)
– TID Dose Rate = 10 mRad/sec
Programmable Transconductance for
Optimum Current Drive
Accessible 1.3 V precision Reference
Both Error Amplifier Inputs Available
0.7% Overall Reference Tolerance
0.4% Initial Accuracy
2.4-V to 24-V Operating Supply Voltage and
User Programmable Reference
Reference Accuracy Maintained for Entire
Range of Supply Voltage
Superior Accuracy and Easier Compensation
for Optoisolator Application
Low Quiescent Current (0.5 mA Typ)
JG PACKAGE
(TOP VIEW)
Radiation tolerance is a typical value based upon initial device
qualification. Radiation Lot Acceptance Testing is available contact factory for details.
DESCRIPTION
The UC19432 is an adjustable precision analog controller with 100-mA sink capability if the ISET pin is
grounded. A resistor between ISET and ground will modify the transconductance while decreasing the maximum
current sink. This will add further control in the optocoupler configuration. The trimmed precision reference along
with the non-inverting error amplifier inputs are accessible for custom configuration. A sister device, the UC19431
adjustable shunt regulator, has an on-board resistor network providing six preprogrammed voltage levels, as well
as exernal programming capability.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–55°C to 125°C
CDIP-8
5962-0923301VPA
UC19432-SP
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
UC19432-SP
SLUS951A – NOVEMBER 2009 – REVISED JULY 2010
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
VCC
Supply voltage
24
V
VCOLL
Regulated output
24
V
SENSE,
EA input
EA+
6
V
COMP
EA compensation
6
V
REF
Reference output
6
V
ICOLL
Output sink current (continuous or time average)
125
mA
ISET
Output source current (continuous or time average)
–125
mA
1
W
Storage temperature range
–65 to 150
°C
Junction temperature
–55 to 150
°C
300
°C
Power dissipation at TA ≤ 25°C
Derate 8 mW/°C for TA > 25°C
Lead temperature (soldering, 10 seconds)
(1)
2
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): UC19432-SP
UC19432-SP
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SLUS951A – NOVEMBER 2009 – REVISED JULY 2010
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, COLL output = 2.4 V to 24 V, VCC = 15 V, ICOLL = 10 mA,
TA = TJ = –55°C to 125°C (unless otherwise noted).
MIN
TYP
MAX
UNIT
Reference voltage tolerance
PARAMETER
TA = 25°C, VCOLL = 5 V
TEST CONDITIONS
1.295
1.3
1.305
V
Reference temperature tolerance
VCOLL = 5 V
1.291
1.3
1.309
V
Reference line regulation
VCC = 2.4 V to 24 V,
VCOLL = 5 V
10
38
mV
Reference load regulation
ICOLL = 10 mA TO 50 mA,
VCOLL = 5 V
10
38
mV
10
mA
Reference sink current
Reference source current
-10
EA input bias current
–0.5
EA input offset voltage
mA
–0.2
mA
-4
4
EA+ Operational voltage limitations
0.9
1.6
EA output current sink (internally limited)
16
mV
V
mA
EA output current source
-0.8
mA
Minimum operating current
VCC = 24 V, VCOLL = 5 V
0.5
0.8
mA
Collector current limit (1)
VCOLL = VCC = 24 V, Ref = 1.3 V,
ISET = GND
130
155
mA
Collector saturation
ICOLL = 20 mA
0.7
1.1
1.5
V
Transconductance (gm) (1)
VCC = 2.4 V to 24 V,
VCOLL = 3 V, ISET = GND
–170
–140
–110
Error amplifier AVOL
60
90
dB
Error amplifier GBW
1.5
3
MHz
3
MHz
(2)
Transconductance amplifier GBW
(1)
(2)
mS
Programmed transconductance and collector current limit equations are specified in the ISET pin description.
Measured as ΔICOLL/ΔVCOMP for ICOLL = 5 mA to 20 mA.
PIN DESCRIPTIONS
COLL The collector of the output transistor with a maximum voltage of 24 V. This pin is the output of the
transconducance amplifier. The overall open loop voltage gain of the transconductance amplifier is
gm x RL, where gm is designed to be –140 mS ±30 mS and RL represents the output load.
COMP The output of the error amplifier and the input to the transconductance amplifier. This pin is available to
compensate the high frequency gain of the error amplifier. It is internally voltage limited to approximately 2
V.
EA+
The non-inverting input to the error amplifier.
GND The reference and power ground for the device. The power ground of the output ransistor is isolated on
the chip from the substrate ground used to bias the remainder of the device.
ISET The current set pin for the transconductance amplifier. The transconductance will be –140 mS as specified
in the electrical table if this pin is grounded. If a resistance, RL, is added to the ISET pin, the resulting new
transconductance is calculated using Equation 1. The maximum current will be approximated by
Equation 2.
REF
-0.714
gm = ¾
(5.1 W + RL)
(1)
0.65 V
IMAX = 5.1 W + RL
(2)
The output of the trimmed precision reference. It can source or sink 10 mA and still maintain less than ±1%
output variation.
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Product Folder Link(s): UC19432-SP
3
UC19432-SP
SLUS951A – NOVEMBER 2009 – REVISED JULY 2010
www.ti.com
SENSE The inverting terminal of the error amplifier used as both the voltage sense input to the error amplifier
and its other compensation point. The error amplifier uses the SENSE input to compare against the 1.3-V
on-chip reference.
The SENSE pin is also used as the under-voltage lockout (UVLO). It is intended to keep the
chip from operating until the internal reference is properly biased. The threshold is
approximately 1 V. It is important that once the UVLO is released, the error amplifier can
drive the transconductance amplifier to stabilize the loop. If a capacitor is connected
between the SENSE and COMP pins to create a pole, it will limit the slew rate of the error
amplifier. To increase the bandwidth and ensure startup a low load current, it is
recommended to create a zero along with the pole as shown in he UC19431 shunt regulator
application. The error amplifier must slew 2 V to drive the transconductance amplifier initially
on.
VCC The power connection for the device. The minimum to maximum operating voltage is 2.4 V to 24 V. The
quiescent current is typically 0.5 mA.
OVER-VOLTAGE COMPARATOR APPLICATION
The signal VIN senses the input voltage. As long as the input voltage is less than 5.5 V, the output is equal to the
voltage on VIN. During this region of operation, the diode is reversed biased which keeps the EA+ pin at 1.3 V.
When VIN exceeds the over-voltage threshold of 5.5 V, the output is driven low. This forward biases the diode
and creates hyseresis by changing the threshold to 4.5 V.
Figure 1. 5.5-V Over-Voltage Comparator With Hysteresis
4
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): UC19432-SP
UC19432-SP
www.ti.com
SLUS951A – NOVEMBER 2009 – REVISED JULY 2010
OPTOCOUPLER APPLICATION
The optocoupler application shown in Figure 2 takes advantage of the accessible pins REF and ISET. The ISET
pin has a 33-Ω resistor to ground that protects the optocoupler by limiting the current to about 16 mA. This also
lowers the transconductance to approximately 19 mS. The ability to adjust the transconducance gives the
designer further control of the loop gain. The REF pin is available to satisfy any high precision voltage
requirements.
Figure 2. 5-V Optocoupler Application
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): UC19432-SP
5
PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2012
PACKAGING INFORMATION
Orderable Device
5962-0923301VPA
Status
(1)
Package Type Package
Drawing
ACTIVE
CDIP
JG
Pins
Package Qty
8
1
Eco Plan
TBD
(2)
Lead/
Ball Finish
A42
MSL Peak Temp
(3)
Samples
(Requires Login)
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC19432-SP :
• Catalog: UC19432
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
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• DALLAS, TEXAS 75265
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