SDM-EVAL Product Description The SDM-EVAL connectorized fixture supports test and measurement of the SDM series of LDMOS modules available from Sirenza. The fixture includes convenient SMA female RF connectors along with a DC header to facilitate amplifier characterization, or rapid system prototyping. The test circuit is mounted on an aluminum heatsink that requires forced air cooling to ensure proper device operating temperatures. Test Fixture for Sirenza SDM Module Series Product Features • • • 50 Ohm SMA (F) Interface Integrated Aluminum Heatsink Supports “B” packages Applications • • • Product Test and Evaluation Rapid System Prototyping Product Qualification Basic Bill of Materials Manufacturer Mfg Part # Item Description Qty Panasonic EEV-HB1V220P CAP, 22 UF, 35V, 20%, Lytic 2 Johanson Technology 101R18W104KV4E CAP 0.1 UF,100V,10%,1206,LEAD FREE 4 C11,C12, C3,C4 Johanson Technology 101R18W102KV4E CAP 1000 PF,100V,10%,1206,LEAD FREE 4 C5,C6, C13,C14 Panasonic ECE-V1HA221P CAP, 220 UF, -40 TO 85°C, 50V, ELECT, G 4 C7,C8,C9,C10 Amp 640455-2 CONNECTOR ,MTA,SMD,R/A,2 PIN 2 J1,J2 Amp 640455-5 CONNECTOR MTA POST HEADER, 5PIN, RT ANGLE, POLARIZED, SM. 2 J3,J4 Johnson Comp 142-0751-821 CONNECTOR,SMA END,0.037 JOHNSON COMP 2 J5, J6 Various SCREW, #4-40 PHILLIPS PAN HEAD, 1/4, SS 10 Various WASHER, #4 LOCK, SPLIT, S S 10 Various WASHER, #4 NARROW, .125 ID, .250 OD, .019 T, SS 10 PCB's SDM-EVAL, INPUT and OUTPUT 2 Heatsink - Extruded Aluminum, machined 1 Rogers 4350, er=3.48, 30 mils thick, 1 oz Cu both sides Wakefield Die 10117 Ref Des C1,C2 The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any thrid party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2003 Sirenza Microdevices, Inc. All worldwide rights reserved. 303 S. Technology Court, Broomfield, CO 80021 Phone: (800) SMI-MMIC 1 http://www.sirenza.com EDS-105005 Rev C SDM-EVAL Test Fixture Pin Descriptions Connector Pin # Function J1 1 Gnd DC ground for D package module. Also connected to RF ground. J1 2 VG1 Gate control. Sets the quiecent bias current for the top half of the SDM Module. Typical values 4.0 – 4.5Vdc. J2 1 Gnd J2 2 VG2 Gate control. Sets the quiecent bias current for the bottom half of the SDM Module. Typical values 4.0 – 4.5Vdc. J3 1 Gnd DC ground for D package module. Also connected to RF ground. J3 2 Gnd DC ground for D package module. Also connected to RF ground. J3 3 Gnd DC ground for D package module. Also connected to RF ground. J3 4 VD1 Drain voltage for the top half of the SDM module. Nominally +28Vdc. J3 5 VD1 Drain voltage for the top half of the SDM module. Nominally +28Vdc. J4 1 Gnd DC ground for D package module. Also connected to RF ground. J4 2 Gnd DC ground for D package module. Also connected to RF ground. J4 3 Gnd DC ground for D package module. Also connected to RF ground. J4 4 VD2 Drain voltage for the bottom half of the SDM module. Nominally +28Vdc. J4 5 VD2 Drain voltage for the bottom half of the SDM module. Nominally +28Vdc. J5 Coax RF in J6 Coax RF out Description DC ground for D package module. Also connected to RF ground. RF input to test fixture (50 Ohm system) RF output to test fixture (50 Ohm system) Test Board Layouts 303 S. Technology Court Broomfield, CO 80021 Phone: (800) SMI-MMIC 2 http://www.sirenza.com EDS-105005 Rev C SDM-EVAL Test Fixture Heatsink Drawing 303 S. Technology Court Broomfield, CO 80021 Phone: (800) SMI-MMIC 3 http://www.sirenza.com EDS-105005 Rev C