PRODUCT SUMMARY SKY77601 Multi-Mode, Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets APPLICATIONS DESCRIPTION • Quad-band cellular handsets: - Class 4 GSM850/EGSM900 - Class 1 DCS1800/PCS1900 - Class E2 GSM850/EGSM900 - Class 12 multi-slot EGPRS Skyworks SKY77601 is a hybrid multi-mode, multi-band Power • Multi-band 3G handsets • WCDMA/HSDPA/HSUPA-modulated handsets for bands I, II, V, and VIII Amplifier Module (PAM). The device is intended to support 2.5G and 3G handsets and operates efficiently in GSM, EGPRS, EDGE WCDMA modes. For 2.5G, the SKY77601 supports the GSM850, EGSM900, DCS1800, and PCS1900 bands. The device also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multislot operation and EDGE linear modulation. FEATURES • Hybrid architecture: separate GSM and WCDMA paths For 3G, the PAM uses Load Insensitive Power Amplifier (LIPA®) • Separate single-ended GSM and WCDMA inputs/outputs, all ACcoupled circuitry to support WCDMA, High-Speed Downlink Packet Access • Multiplexed voltage detector for all modes/bands provided to transceiver modulation at a high antenna Voltage Standing-Wave Ratio • Fully programmable serial bus interface • Final VCC stage for 2.5G/3G can be attached to battery or buck DC/DC (HSDPA), and High-Speed Uplink Packet Access (HSUPA) (VSWR). This functionality covers multiple bands for 3GPP including bands I, II, V, and VIII. RF input and output ports are internally matched to 50 Ω to • Driver stage for 3G can be attached to battery or buck DC/DC reduce the number of external components. Extremely low • 2.5G features: - EGPRS Class 12 multi-slot operation - Log power detector - Linear PA with bias optimization for efficiency/linearity tradeoff in 8-PSK mode leakage current maximizes handset standby time. • 3G features: - WCDMA mode supports output power and bandwidth for bands I, II, V, and VIII - Linear detector - Linear balanced with bias optimization and low/high mode gain switch for best efficiency/linearity trade-off • Small footprint, MCM (34-pin, 6 x 8 mm) Pb-free (MSL3, 260 °C per JEDEC J-STD-020) SMT package The InGaP die, the silicon die, and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. The device is mounted in a 34-pin, 6 x 8 mm MCM SurfaceMounted Technology (SMT) package, which allows for a highly manufacturable low-cost solution. A block diagram of the SKY77601 is shown in Figure 1. The device package and pinout for the 34-pin MCM are shown in Figure 2. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201241A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • February 9, 2010 1 PRODUCT SUMMARY SKY77601 MULTI-MODE / MULTI-BAND POWER AMPLIFIER MODULE for NEXT GENERATION GGE AND HSPA HANDSET Figure 1. SKY77601 Functional Block Diagram Figure 2. SKY77601 Pad Configuration – 34-Pin MCM (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 February 9, 2010 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201241A Copyright © 2010 Skyworks Solutions Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions Inc. (“Skyworks”) products or services. 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