PRODUCT SUMMARY SKY77604 Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets Applications Description • Quad-band cellular handsets: - Class 4 GSM850/EGSM900 - Class 1 DCS1800/PCS1900 - Class E2 GSM850/EGSM900/ DCS1800/PCS1900 - Class 12 multi-slot EGPRS Skyworks SKY77604 is a hybrid multi-mode, multi-band Power Amplifier Module (PAM) that supports 2.5G and 3G handsets, and operates efficiently in GSM, EGPRS, EDGE WCDMA modes. • Multi-band 3G handsets • WCDMA/HSDPA/HSUPA-modulated handsets – Bands I, II, V, VIII Features • Hybrid architecture: separate GSM and WCDMA paths • Separate single-ended GSM and WCDMA outputs, combined single-ended GSM and WCDMA inputs, all AC-coupled • Multiplexed voltage detector for GMSK, EDGE modes; coupler output for 3G bands provided to transceiver for power control • Fully programmable serial bus interface • Final VCC stage for 2.5G/3G can attach to battery or buck DC/DC • Driver stage for 3G can attach to battery or buck DC/DC • 2.5G features: - EGPRS Class 12 multi-slot operation - Linear power detector - Linear PA with bias optimization for efficiency/linearity tradeoff in 8-PSK mode • 3G features: - WCDMA mode supports output power and bandwidth for bands I, II, V, VIII - Coupler output - Linear balanced with bias optimization and low/high mode gain switch for best efficiency/linearity trade-off • Small, low profile package: - 6 mm x 8 mm x 0.9 mm - 34-pin configuration The PAM consists of a GSM800/EGSM900 PA block, a DCS1800/PCS1900 PA block, separate WCDMA blocks for low and high bands, RF input / output ports internally matched to 50 Ω to reduce the number of external components, and a MultiFunction Control (MFC) block. A custom BiCMOS integrated circuit provides the internal MFC interface and operation. Extremely low leakage current maximizes handset standby time. 2.5G: The SKY77604 supports the GSM850, EGSM900, DCS1800, and PCS1900 bands. The PAM also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multi-slot operation and EDGE linear modulation. 3G: The SKY77604 uses Load Insensitive Power Amplifier (LIPA®) circuitry to support WCDMA, High-Speed Downlink Packet Access (HSDPA), and High-Speed Uplink Packet Access (HSUPA) modulation at a high antenna Voltage Standing-Wave Ratio (VSWR). This functionality covers multiple bands for 3GPP including bands I, II, V, VIII. The module is fully programmable through a Serial Peripheral Interface (SPI). The InGaP die, the silicon die, and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. The SKY77604 is encapsulated in a 6 mm x 8 mm, 34-pad MCM, Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable, low-cost solution. A functional block diagram is shown in Figure 1. Skyworks Solutions, Inc. • Phone  376-3000 • Fax  376-3100 • [email protected] • www.skyworksinc.com 201243A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • February 9, 2010 1 PRODUCT SUMMARY Figure 1. SKY77604 Functional Block Diagram SKY77604 MULTI-MODE / MULTI-BAND POWER AMPLIFIER MODULE for NEXT GENERATION GGE AND HSPA HANDSETS Figure 2.SKY77604 Pad Configuration Copyright © 2010 Skyworks Solutions Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions Inc. (“Skyworks”) products or services. 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