SNAP01 Class AB Power Amplifier ============== CONTENTS ============== 1. GENERAL DESCRIPTION ....................................................................................... 3 2. FEATURES ................................................................................................................. 3 3. BLOCK DIAGRAM ................................................................................................... 3 4. PIN ASSIGNMENT .................................................................................................... 4 5. ELECTRICAL CHARACTERISTICS ...................................................................... 4 5.1. 5.2. 6. APPLICATION CIRCUIT ......................................................................................... 6 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 7. ABSOLUTE MAXIMUM RATINGS .............................................................................. 4 DC CHARACTERISTICS (TA=25℃).......................................................................... 5 CURRENT DAC APPLICATION WITH SINGLE-END MODE .......................................... 6 PWM WITH DIFFERENTIAL MODE ........................................................................... 7 PUSH-PULL DAC WITH SINGLE-END MODE ............................................................ 8 PUSH-PULL DAC WITH DIFFERENTIAL MODE .......................................................... 9 SINGLE-END WITH MIXED............................................................................... 10 DIFFERENTIAL MODE WITH MIXED ....................................................................... 11 PACKAGE/PAD LOCATIONS ............................................................................... 12 7.1. 7.2. 7.3. Ver1.3 SNAP01H (DICE) ................................................................................................ 12 SNAP01PG (DIP GREEN PACKAGE)..................................................................... 13 SNAP01SG (SOP GREEN PACKAGE).................................................................... 14 1 November 22, 2007 SNAP01 Class AB Power Amplifier AMENDENT HISTORY Ver1.3 VERSION DATE DESCRIPITION V1.0 September 27, 2007 First issue V1.1 October 9, 2007 Advise Application Circuit V1.2 November 2, 2007 Revise Package information. V1.3 November 22, 2007 1. Revise Operation current. 2. Revise package information. 2 November 22, 2007 SNAP01 Class AB Power Amplifier 1. General Description The SNAP01 is an integrated class AB mono speaker driver. The SNAP01 consist of single power supply, no switch-on/off click, high SNR ratio, power control, single-end/differential input mode and support Gain adjusted by external resistor. 2. Features w w w w w w w w w w w Operation voltage：2.4V-5.5V. High signal-to-noise ratio. Low distortion. High slew rate. No switch On/Off click. Power off control. Gain adjustment. Large output voltage swing. Direct driver speaker. Support single-end and differential mode. Low standby current：1.0μA. 3. Block Diagram 75K VIN VM 5K + 5K OOPA 75K 8K 8K VREF Vbias + O+ OPB CE Enable VDD Clickless/Depop CKT Ver1.3 3 Power CKT GND November 22, 2007 SNAP01 Class AB Power Amplifier 4. Pin Assignment Pin No. Symbol I/O Function Description 1 VM I Signal Input Positive 2 VIN I Signal Input Negative 3 GND I Negative Power Supply 4 VREF O Voltage Reference 5 CE I Chip Enable, High Active 6 O+ O Positive Output 7 VDD I Positive Power Supply 8 O- O Negative Output 5. Electrical Characteristics 5.1. Absolute Maximum Ratings Characteristic Symbol Min Max Unit Supply Voltage VDD -0.3 6.0 V Operating Temperature TOG 0 55 ℃ Storage Temperature TSTG -55 125 ℃ Ver1.3 4 November 22, 2007 SNAP01 Class AB Power Amplifier 5.2. DC Characteristics (Ta=25℃) Parameter Supply Power Standby Current Operating Current Symbol VDD ISTB CE Reference Voltage VREF Output Current Io Signal to Noise Ratio SNR Output Power Enable Time Typical - Max 5.5 1 Unit V μA - - 12 mA - - 16 mA IOP Chip Enable The Harmonic Distortion + Noise Min 2.4 - VDD/3 V - VDD/2 - V - 180 360 57 72 - mA mA dB dB - - 1 % - - 1 % 0.5 0.58 - W 0.7 0.75 - W - 16 32 - ms ms THD+N POUT TON 15 Gain 30 Condition CE=Low VDD=3.0V, CE=High, No load & VIN and VM is floating. VDD=4.5V CE=High, No load & VIN and VM is floating. VCE>2/3VDD = High VCE<1/3VDD = Low CE=High, CE=Low, VREF =VDD VDD=3.0V, RL=8Ω VDD=4.5V, RL=8Ω Single-End Mode Differential Mode VDD=3.0V, RL=8Ω P=0.25W VDD=4.5V, RL=8Ω P=0.58W VDD=4.5V, RL=8Ω, THD+N=1% VDD=4.5V, RL=8Ω, THD+N=10% VDD=4.5V VDD=3.0V Single-end mode Gain=75K/(5K+R1) Differential-mode Gain=75K/(5K+R1) Note1：TON is the time from CE high (chip enable) to O+ or O- output. Ver1.3 5 November 22, 2007 Class AB Power Amplifier SNAP01 6. Application Circuit 6.1. Current DAC application with Single-End Mode VCC S1 U1 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 SNC5x3 VDD OSC RST BUO1 BUO2 GND R1 330K R3 1K VCC C1 0.1uF C2 0.47uF U2 SNAP01 1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 VREF CE C3 1uF VCC VCC Current DAC with SINGLE-END MODE R2 R + SPEAKER C4 0.1uF November 22, 2007 6 Ver1.3 + Class AB Power Amplifier SNAP01 6.2. PWM with Differential Mode VCC S1 CE U1 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 SNC5x3 VDD OSC RST BUO1 BUO2 GND R2 330K VCC C5 0.1uF VM VIN GND 1uF C3 SNAP01 1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 CE VREF CE U2 PWM with Differnetial Mode R R1 R R1 + VCC VCC C6 0.1uF SPEAKER November 22, 2007 7 Ver1.3 Class AB Power Amplifier SNAP01 6.3. Push-Pull DAC with Single-End Mode VCC S1 CE 1 2 3 4 5 6 7 8 9 10 16 17 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 SNC12030 U1 VDD 13 20 OSC 18 RST 14 BUO1 12 BUO2 19 TEST 11 GND 15 GND R1 330K VCC C1 0.1uF C2 0.47uF GND U2 SNAP01 1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 VREF CE C3 1uF CE VCC VCC SPEAKER PUSH-PULL DAC with SINGLE-END MODE R2 R + C4 0.1uF November 22, 2007 8 Ver1.3 + Class AB Power Amplifier SNAP01 6.4. Push-Pull DAC with Differential Mode VCC S1 CE 1 2 3 4 5 6 7 8 9 10 16 17 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 SNC12030 U1 VDD 13 20 OSC 18 RST 14 BUO1 12 BUO2 19 TEST 11 GND 15 GND R1 330K VCC C1 0.1uF VM C2 VIN C3 + R R2 R3 GND U2 SNAP01 1 8 O- 7 2 VM 3 VIN VDD 6 4 GND O+ 5 CE VREF CE C4 1uF VCC VCC PUSH-PULL DAC with DIFFERENTIAL MODE 0.47uF 0.47uF R1 + SPEAKER C5 0.1uF November 22, 2007 9 Ver1.3 + Class AB Power Amplifier SNAP01 6.5. SINGLE-END with MIXED VCC VCC S1 S2 CE CE 1 2 3 4 5 6 7 8 9 10 16 17 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 SNC12030 1 2 3 4 5 6 7 8 9 10 16 17 SNC12030 U1 VDD OSC RST BUO1 BUO2 TEST GND GND U3 VDD OSC RST BUO1 BUO2 TEST GND GND 13 20 18 14 12 19 11 15 13 20 18 14 12 19 11 15 R1 330K R3 330K C2 C6 VCC C1 0.1uF VCC C5 0.1uF 0.47uF 0.47uF R R + 1 2 3 4 C4 1uF U2 VM OVIN VDD GND O+ VREF CE SNAP01 8 7 6 5 VCC SPEAKER SINGLE-END MODE with Push Pull DAC R2 R4 VCC C3 0.1uF November 22, 2007 10 Ver1.3 + + Class AB Power Amplifier SNAP01 6.6. Differential Mode with Mixed VCC VCC S1 S2 CE CE 1 2 3 4 5 6 7 8 9 10 16 17 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 SNC12030 1 2 3 4 5 6 7 8 9 10 16 17 SNC12030 U1 VD D OSC RST B UO1 B UO2 TEST GN D GN D U3 VD D OSC RST B UO1 B UO2 TEST GN D GN D 13 20 18 14 12 19 11 15 13 20 18 14 12 19 11 15 R1 330K R4 330K C2 C3 C7 C8 VCC C1 0.1uF VCC 0.47uF R + 1uF C5 1 2 3 4 U2 SNAP01 VM OVIN VDD GND O+ VREF CE 8 7 6 5 VCC DIFFERENTIAL MODE with MIXED R2 R R R3 R5 R 0.47uF 0.47uF R6 C6 0.1uF 0.47uF SPEAKER VCC C4 0.1uF November 22, 2007 11 Ver1.3 + + + + SNAP01 Class AB Power Amplifier 7. PACKAGE/PAD LOCATIONS 7.1. SNAP01H (Dice) PAD Assignment NO PAD NAME X(um) Yum) NO PAD NAME X(um) Yum) 1 VM -495.31 -370.90 6 O+ 375.49 234.14 2 VIN - 385.31 -370.90 7 O+ 375.49 349.14 3 GND -21.41 -295.15 8 VDD -21.41 291.64 4 VREF 385.31 -370.90 9 O- -418.31 349.14 5 CE 495.31 -370.90 10 O- -418.31 234.14 CHIP SIZE: X=1124um,Y=960um Note: 1.The VDD pin MUST bonding to VDD in PCB layout. 2.The substrate MUST be connected to GND in PCB layout. Ver1.3 12 November 22, 2007 SNAP01 Class AB Power Amplifier 7.2. SNAP01PG (DIP Green Package) 8-pin DIP (300mil) Outline Dimensions Pin No. Symbol I/O 1 VM I Signal Input Positive 2 VIN I Signal Input Negative 3 GND I Negative Power Supply 4 VREF O Voltage Reference 5 CE I Chip Enable, High Active 6 O+ O Positive Output 7 VDD I Positive Power Supply 8 O- O Negative Output Ver1.3 Function Description 13 November 22, 2007 SNAP01 Class AB Power Amplifier 7.3. SNAP01SG (SOP Green Package) 8-pin SOP (150mil) Outline Dimensions Pin No. Symbol I/O 1 VM I Signal Input Positive 2 VIN I Signal Input Negative 3 GND I Negative Power Supply 4 VREF O Voltage Reference 5 CE I Chip Enable, High Active 6 O+ O Positive Output 7 VDD I Positive Power Supply 8 O- O Negative Output Ver1.3 Function Description 14 November 22, 2007 SNAP01 Class AB Power Amplifier DISCLAIMER The information appearing in SONiX web pages (“this publication”) is believed to be accurate. However, this publication could contain technical inaccuracies or typographical errors. The reader should not assume that this publication is error-free or that it will be suitable for any particular purpose. SONiX makes no warranty, express, statutory implied or by description in this publication or other documents which are referenced by or linked to this publication. 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SONIX DISCLAIMS ALL WARRANTIES, INCLUDING THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. SONIX reserves the right to halt production or alter the specifications and prices, and discontinue marketing the Products listed at any time without notice. Accordingly, the reader is cautioned to verify that the data sheets and other information in this publication are current before placing orders. Products described herein are intended for use in normal commercial applications. Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical life support equipment, are specifically not recommended without additional processing by SONIX for such application. Ver1.3 15 November 22, 2007