SSC SS35

SS32-SS315
SCHOTTKY BARRIER RECTIFIERS
PRODUCT SUMMARY
3.0 AMPS Surface Mount
SMC/DO-214AB
.126(3.20)
.114(2.90)
FEATURES
.245(6.22)
.220(5.59)
For surface mounted application
Easy pick and place
Metal to silicon rectifier, majority carrier conduction
Low power loss, high efficiency
High current capability, low VF
High surge current capability
Plastic material used carriers Underwriters
Laboratory Classification 94V-0
Epitaxial construction
High temperature soldering:
o
260 C / 10 seconds at terminals
.280(7.11)
.260(6.60)
.012(.31)
.006(.15)
.103(2.62)
.079(2.00)
.008(.20)
.004(.10)
.063(1.6)
.039(1.0)
.320(8.13)
.305(7.75)
MECANICAL DATA
Dimensions in inches and (millimeters)
Case: JEDEC DO-214AB Molded plastic
Terminals: Pure tin plated, lead free.
Polarity: Indicated by cathode band
Packaging: 16mm tape per EIA STD RS-481
Weight: 0.21gram
Pb-free; RoHS-compliant
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
o
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol SS
32
Maximum Recurrent Peak Reverse Voltage VRRM
20
Maximum RMS Voltage
14
VRMS
Maximum DC Blocking Voltage
20
VDC
Type Number
Maximum Average Forward Rectified
Current at TL(See Fig. 1)
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
(Note 1)
IF= 3.0A @ 25oC
@ 100oC
o
Maximum DC Reverse Current @ TA =25 C at
o
Rated DC Blocking Voltage
@ TA=125 C
Typical Thermal Resistance ( Note 2 )
SS
33
30
21
30
SS
34
40
28
40
IFSM
100
VF
0.5
0.4
IR
SS
36
60
42
60
SS
39
90
63
90
SS
310
100
70
100
SS Units
315
150
V
105
V
150
V
3.0
I(AV)
A
70
0.75
0.65
0.5
10
R θJL
R θJA
Operating Temperature Range
TJ
-55 to +125
Storage Temperature Range
TSTG
Notes:
1. Pulse Test with PW=300 usec, 1% Duty Cycle
04/05/2007 Rev.1.00
SS
35
50
35
50
5
17
55
V
0.85
0.95
0.70
0.80
0.1
0.5
-55 to +150
-55 to +150
www.SiliconStandard.com
A
mA
mA
o
C/W
o
o
C
C
1
SS32-SS315
RATINGS AND CHARACTERISTIC CURVES (SS32 THRU SS315)
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
FIG.2- MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
100
AVERAGE FORWARD CURRENT. (A)
RESISTIVE OR
INDUCTIVE LOAD
SS35-SS315
SS32-SS34
2
1
PCB MOUNTED ON 0.6X0.6"
(16X16mm) COPPER PAD AREAS
0
50
60
70
80
90
100
110
120
130
140
150
PEAK FORWARD SURGE CURRENT. (A)
3
AT RATED TL
8.3ms Single Half Sine Wave
JEDEC Method
80
60
40
20
01
160
10
NUMBER OF CYCLES AT 60Hz
o
LEAD TEMPERATURE. ( C)
FIG.4- TYPICAL REVERSE CHARACTERISTICS
FIG.3- TYPICAL FORWARD CHARACTERISTICS
20
40
TJ=25 0C
10
TJ=125 0C
10
INSTANTANEOUS REVERSE CURRENT. (mA)
INSTANTANEOUS FORWARD CURRENT. (A)
SS35-SS36
SS32-SS34
1
SS39-SS310
0.1
1
TJ=75 0C
0.1
0.01
TJ=25 0C
SS315
PULSE WIDTH=300 S
1% DUTY CYCLE
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
SS32-SS34
SS35-SS315
0.001
0
1.6
TRANSCIENT THERMAL IMPEDANCE, ( oC/W)
1000
TJ=25 0C
f=1.0MHz
Vsig=50mVp-p
100
SS32-SS34
SS35-SS36
SS39-SS315
1
40
60
80
100
120
140
FIG.6- TYPICAL TRANSIENT THERMAL
CHARACTERISTICS
FIG.5- TYPICAL JUNCTION CAPACITANCE
10
0.1
20
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)
FORWARD VOLTAGE. (V)
JUNCTION CAPACITANCE.(pF)
100
10
100
100
10
1
0.1
0.01
0.1
1
10
100
t, PULSE DURATION, (sec)
REVERSE VOLTAGE. (V)
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the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
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04/05/2007 Rev.1.00
www.SiliconStandard.com
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