SS8053G 1.5A Ultra Low Dropout Regulator FEATURES DESCRIPTION Fixed output voltages of 1.2/1.5/1.8/2.5/3.3V Output current up to 1.5A Over-current and over-temperature protection Low dropout voltage 500mV @ 1.5A Low ground current SOT-223 package The SS8053G is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 1.5 Amps. The SS8053G features 500mV dropout voltages and very low ground current. Although designed for high current loads, these devices are also useful in lower current, extremely low dropout-critical systems, where their minimal dropout voltage and ground current values are important characteristics. APPLICATIONS Battery powered systems Motherboards Peripheral cards Network cards Set Top Boxes Notebook Computers The SS8053G provides excellent regulation over variations in line, load and temperature. Pb-free; RoHS compliant. ORDERING INFORMATION PIN CONFIGURATION AND MARKING SS8053-xxGT6 XX G953-XX Packing: TR: Tape and reel YWWS G953-xx = SS8053-xxG DATE/LOT CODE: Y = year: H=2005, I=2006, J=2007, ... 1 2 3 VIN GND VO Output voltage: 12: 1.2V 15: 1.5V 18: 1.8V 25: 2.5V 33: 3.3V WW = work week (01 -> 52) S = lot code sequence TYPICAL APPLICATION CIRCUIT 1.5V 3.3V VIN VO GND 22µF 9/27/2006 Rev.1.01 47µF www.SiliconStandard.com 1 of 3 SS8053G ABSOLUTE MAXIMUM RATINGS (Note 1) Input Voltage………………………………….…………7V OPERATING CONDITIONS (Note 1) Input Voltage………………………………..…2.2V ~5.5V Temperature Range………….………-40°C <T A < +85°C Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature.…………………150°C Storage Temperature Range.……..-65°C <TJ < +150°C Reflow Temperature (soldering, 10sec)…..…....260°C Thermal Resistance Junction to Ambient.……141°C/W Thermal Resistance Junction to Case…………..20.1°C/W ESD Rating (Human Body Model)……….………….2kV ELECTRICAL CHARACTERISTICS VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C unless otherwise specified (Note 3) PARAMETER MIN TYP MAX UNIT VIN=VO +0.7V, IO=10mA 2.2 -2 --VO 5.5 2 V % Line Regulation VO+0.7V < VIN < 5.5V, IO=10mA --- 0.2 2 % Load Regulation Quiescent Current IQ 10mA < IO < 1.5A VIN=3.3V ----- 0.8 1.7 2 2.5 % mA Ripple Rejection Dropout Voltage VD fi=120Hz, 1VP-P, IO=100mA IO=1.5A ----- 55 0.5 --0.65 dB V --- 0.8 --- A Supply Voltage Output Voltage SYMBOL VIN VO CONDITION Short Circuit Current Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, QJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) / Q JA. If this dissipation is exceeded, the die temperature will rise above 150°C and the chip will go into thermal shutdown. Note3: Low duty pulse techniques are used during test to maintain the junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. 9/27/2006 Rev.1.01 Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will still operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. www.SiliconStandard.com 2 of 3 SS8053G PHYSICAL DIMENSIONS SOT-223 (unit: mm) A D SYMBOL B1 α MIN MAX C 13°(4X) H E L L2 e Taping Specification e1 13°(4X) Feed Direction SOT-223 Package Orientation A1 B SYMBOL MILLIMETER INCH MIN MAX MIN MAX A A1 1.55 0.02 1.80 0.12 0.061 0.0008 0.071 0.0047 B B1 0.60 2.90 0.80 3.10 0.024 0.114 0.031 0.122 C D 0.24 6.30 0.32 6.70 0.009 0.248 0.013 0.264 E e e1 H 3.30 3.70 0.130 2.30 BSC 4.60 BSC 6.70 0.146 0.090 BSC 0.181 BSC 7.30 0.264 0.287 L 0.90 MIN 0.036 MIN L2 α 0.06 BSC 0.0024 BSC 0º 10º 0º 10º Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 9/27/2006 Rev.1.01 www.SiliconStandard.com 3 of 3