SS8219G Ultra320 Multi-mode LVD/SE SCSI Terminator PRODUCT SUMMARY DESCRIPTION SPI mode auto-detection/switching. Pin/pin compatible with popular industry standard parts DS2118/9 and UCC5672 FEATURES Auto-selectable single-ended or LVD termination Meets SCSI-1, SCSI-2, SCSI-3 SPI Ultra (Fast-20), Ultra 2 (SPI-2 LVD), Ultra160 (SPI-3 LVD) and Ultra320 (SPI-4 LVD) standards Supports active negation Channel capacitance of 3pF Operation from 2.9V to 5.5V Thermal protection Hot-swap compatible Tolerance of 5% on termination resistance Available in 28 pin TSSOP or 36 pin SSOP The SS8219G multi-mode LVD/SE SCSI terminator provides a smooth transition between modes of the SCSI Parallel Interface. It automatically senses the bus via DIFFSENS and switches the termination to either single-ended (SE) or low voltage differential (LVD) SCSI, based on which type of devices are connected to the bus. If the SS8219G detects an HVD SCSI device, it switches to a high impedance state. A 16-bit wide SCSI bus requires three SS8219G for termination. This multi-mode terminator contains all the functions to terminate, auto detect and switch modes for SCSI Parallel Interface (SPI) bus architectures. For SE termination, one regulator and nine precision 110Ω resistors are used. For LVD termination, the SS8219G integrates 18 regulated supplies with nine precision resistor strings. Pb-free, RoHS compliant. APPLICATIONS High performance data storage systems in servers, workstations, high-end and industrial PCs, and RAID disk arrays. PIN CONFIGURATION VREF 1 36 NC 2 35 HVD NC 3 34 LVD TPWR R1+ 4 33 SE VREF 1 28 TPWR R1- 5 32 R9- R1+ 2 27 R2+ 6 31 R9+ R1- 3 26 TPWR R9- R2- 7 30 R8- R2+ R2- 4 25 R9+ HS/GND 8 29 5 24 R8- HS/GND 9 28 R8+ HS/GND NC/ HS GND R3+ 6 23 R8+ 10 27 HS/GND 7 22 NC/ HS GND HS/GND R3+ 11 26 HS/GND R3- 8 21 R7- R3- 12 25 R7R7+ R4+ 9 20 R7+ R4+ 13 24 R4- 10 19 R6- R4- 14 23 R6- R5+ 11 18 R6+ R5+ 15 22 R6+ R5- 12 17 DIFFB DISCNCT 13 16 DIFFSENSE GND 14 15 M/S R5- 16 21 DIFFB DISCNCT 17 20 DIFFSENSE GND 18 19 M/S 28 pin TSSOP 12/06/2005 Rev.3.01 36 pin SSOP www.SiliconStandard.com 1 of 10 SS8219G ORDERING INFORMATION SS8219GX XX TR = tape and reel; TB = tubes For example: SS8219GD TR GD = RoHS-compliant TSSOP-28 GS = RoHS-compliant SSOP-36 => SS8219 in RoHS-compliant TSSOP-28 supplied on tape and reel APPLICATION INFORMATION Please note for the following sections : DIFFSENS - refers to the SCSI bus signal. DIFFSENSE - refers to the SS8219G pin name and internal circuitry related to differential sensing. DIFFB - refers to the SS8219G pin name and internal circuitry related to monitoring the DIFFSENS line. The SS8219G is used in multi-mode active-termination applications where single ended (SE) and low voltage differential (LVD) devices might coexist. The LVD termination section consists of 18 source/sink amplifiers (VTOP, VBOT), biasing circuitry and nine precision resistor strings (RTOP, RMID, RBOT). The SE termination section consists of a 2.85V source/sink regulator with nine precision 110Ω resistors. The DIFFSENSE section consists of a 1.3V, 5mA driver and a sensing circuit (Fig.1). DIFFSENS is used to identify which types of SCSI devices are present on the bus. If the voltage on DIFFSENS is between 0V and 0.5V the bus is singleended; if it is between 0.7V and 1.9V, the bus is LVD; and if it is greater than 2.4V, the bus is HVD. The SS8219G DIFFB pin monitors the DIFFSENS line to determine the proper operating mode of the device. HVD Isolation Mode: The SS8219G identifies that there is an HVD (high voltage differential) device on the SCSI bus and isolates the termination pins from the bus. When DISCNCT is pulled high, or during thermal shutdown, the termination pins are isolated from the SCSI bus and VREF is grounded. The DIFFSENSE driver is shut down during either of these two events. To ensure proper operation, the TPWR pin should be connected to the SCSI bus TERMPWR line. As with all analog circuitry, the TERMPWR lines should be bypassed locally. A 2.2µF capacitor and a 0.01µF high frequency capacitor are recommended between TPWR and ground and placed as close as possible to the SS8219G. The IC should be placed as close as possible to the SCSI connector to minimize both signal and power trace length, thereby reducing the input capacitance 12/06/2005 Rev.3.01 and reflections which can degrade the bus signals. The DIFFSENSE pin can drive the SCSI DIFFSENS line (when M/S is pulled high) to determine the SCSI bus operating mode. The SS8219G switches to the appropriate termination mode for the bus based on the value of the DIFFSENS voltage. These modes are: LVD mode: LVD termination is provided by a precision resistor string with two amplifiers. This configuration yields a 105Ω differential and 150Ω common mode impedance. A fail safe bias of 112mV is maintained when no drivers are connected to the SCSI bus. SE mode: When the external driver for a given signal line turns off, the active terminator will pull that signal line to 2.85 volts (quiescent state). When used with an active-negation driver, the power amp can sink 22mA per line while keeping the voltage reference in regulation. The terminating resistors maintain their 110 Ω value. To maintain the specified regulation, a 4.7µF capacitor is required between the VREF pin and ground of each SS8219G. A high frequency capacitor (0.1µF ceramic recommended) can also be placed on the VREF pin in applications that use fast rise/fall time drivers. A typical SCSI bus configuration is shown in Figure 2. An internal pull-down resistor assures that the SS8219G will still terminate the bus if the DISCNCT pin is left floating. DIFFSENS noise filtering The SS8219G incorporates an internal digital filter to remove the noise signal on the DIFFSENS control line, thereby eliminating erroneous switching between modes. An external filter may also be used in addition to this internal digital filter. www.SiliconStandard.com 2 of 10 SS8219G BLOCK DIAGRAM (Figure 1) ( 36pin SSO P only ) M/S DIFFS ENS E SE LV D HV D DISC NCT THER MA L SHU TDOW N CIRC UITRY DIFFS ENS E CIRC UITRY CO NTROL LOG IC DIFFB V REF V REF R1- 110 Ω R9110 Ω REFER ENC E GENERA TIO N V TOP1 + _ RTO P9 X9 RTO P1 R1- R1- R9R9RMID1 RMID9 R1+ R1+ R9+ R9+ RBO T1 RBO T9 + _ V BOT1 X9 SE GN D DR IV ER 12/06/2005 Rev.3.01 www.SiliconStandard.com 3 of 10 SS8219G SCSI BUS CONFIGURATION (Figure 2) CONTROL LINES (9) TERMPWR 2.2µF TERMPWR TPWR M/S DISCNCT TPWR M/S DISCNCT SS8219G SS8219G DIFFSENS DIFFSENSE VREF 20K 20K 2.2µF DIFFSENSE DIFFB VREF DIFFB 4.7µF 0.1µF 0.1µF 4.7µF DATA LINES (9) TPWR TPWR M/S M/S DISCNCT SS8219G DIFFB DIFFB VREF 4.7µF 4.7µF 2.2µF DATA LINES (9) TPWR TPWR M/S M/S DISCNCT VREF 2.2µF DISCNCT SS8219G SS8219G DIFFB DIFFB VREF 4.7µF 4.7µF 12/06/2005 Rev.3.01 2.2µF DISCNCT SS8219G VREF 2.2µF www.SiliconStandard.com 4 of 10 SS8219G RECOMMENDED OPERATING CONDITIONS PARAMETER Termpower Voltage SYMBOL MIN TYP MAX UNITS Vtpwr(SE) Vtpwr(LVD) 4.0 2.9 5 5 5.5 5.5 V Vil Vih Tamb -0.3 2.0 0 +0.8 Vtpwr+0.3 70 V V °C Logic 0 Logic 1 Operating Temperature ELECTRICAL CHARACTERISTICS (from TA = 0°C to 70°C, unless otherwise spedified) PARAMETER SYMBOL CONDITION MIN All lines Open TYP MAX UNITS LVD Terminator Section Differential Mode Termination Resistance Rdm 100 105 110 Ω Common Mode Termination Resistance Differential Mode Bias Common Mode Bias Rcm Vdm Vcm 110 100 1.125 150 112 1.25 190 125 1.375 Ω mV V Single Ended Terminator Section Output Capacitance SE Termination Resistance SE Voltage Reference SE output Current Cout Rse Vref Iose 104.5 2.79 110 2.85 3 115.5 2.93 25.4 pF Ω Volts mA 2.5 3.5 % % mA Regulator Section Line Regulation Load Regulation Current Limit Sink Current Note Vline = 0-3.0 volts Vline = 0.2 volts LIREG LOREG ILIM 1.0 1.3 350 ISINK 200 mA DC Section Termpower Current Itpmr Input Leakage High Input Leakage Low Output Current High Output Current Low Iih Iil Ioh Iol DIFFSENS Section DIFFSENS SE Operating Range DIFFSENS LVD Operating Range DIFFSENS HVD Operating Range Vseor Vlvdor Vhvdor DIFFSENSE Driver Output Voltage DIFFSENSE Driver Source Current DIFFSENSE Driver Sink Current Vdso Idsh Idsl SE mode (No Load) LVD mode (No Load) 4 20 mA -1.0 1.0 Vout = 2.4 volts; SE/LVD/HVD Pins only Vout=0.4 volts; SE/LVD/HVD Pins only M/S=1; Ids = 0-5mA M/S = 1; Vdso=0V M/S=1; Vdso=2.75V -1.0 4.0 µA µA mA mA -0.3 0.7 2.4 0.5 1.9 Vtpwr+0.3 V V V 1.2 1.4 15 200 V mA µA 5 20 Note: guaranteed by Design. 12/10/2005 Rev.3.01 www.SiliconStandard.com 5 of 10 SS8219G Common Mode Bias Vcm vs. Temperature Common Mode Bias Vcm vs. Vtpwr 1.375 1.375 T=80ºC Vtpwr=5.8V 1.325 1.275 Vcm(V) Vcm(V) 1.325 1.225 1.275 1.225 Vtpwr=2.8V T=-10ºC 1.175 1.175 1.125 1.125 2.5 3.5 4.5 Vtpwr -20 5.5 0.125 0.115 0.11 Vdm(V) Vdm(V) 0.12 T=-10ºC T=80ºC 0.115 0.11 0.105 0.105 0.1 0.1 2.5 3.5 4.5 Vtpwr -20 5.5 Common Mode Termination Resistance Rcm vs. Vtpwr at Temperature=24ºC 190 190 180 180 170 170 160 150 140 0 20 40 60 80 Temperature(ºC) 100 Common Mode Termination Resistance Rcm vs. Temperature at Vtpwr=5V Rcm(Ohm) Rcm(Ohm) 100 0.125 0.12 160 150 140 130 130 120 120 110 110 2.5 3.5 4.5 Vtpwr 5.5 -20 Differential Mode Termination Resistance Rdm vs. Vtpwr 110 109 108 107 106 105 104 103 102 101 100 0 20 40 60 80 Temperature(ºC) 100 Differential Mode Termination Resistance Rdm vs. Temperature 110 T=80ºC Vtpwr=2.8V 108 Rdm(Ohm) Rdm(Ohm) 20 40 60 80 Temperature(ºC) Differential Mode Bias Vdm vs. Temperature@Vtpwr=5V Differential Mode Bias Vdm vs. Vtpwr T=-10ºC 106 104 Vtpwr=5.8V 102 100 2.5 12/10/2005 Rev.3.01 0 3.5 4.5 Vtpwr 5.5 -20 www.SiliconStandard.com 0 20 40 60 80 Temperature(ºC) 100 6 of 10 SS8219G SE Termination Resistance Rse vs. Vtpwr at Vline=0V SE Termination Resistance Rse vs. Vtpwr at T=24ºC; Vline=0V 115 Rse(Ohm) Rse(Ohm) 113 111 109 107 105 3.5 4.5 115 114 113 112 111 110 109 108 107 106 105 Vtpwr=3.8V Vtpwr=5.8V -20 5.5 0 20 40 60 80 100 Temperature(ºC) Vtpwr SE Termination Resistance Rse vs. Vtpwr at Vtpwr=5V; T=24ºC Vref vs. Ivref at Vtpwr=5V 2.93 115 2.91 113 111 Vref Rse(Ohm) 2.89 109 T=80ºC 2.87 2.85 2.83 107 T=-10ºC 2.81 105 0 1 2 2.79 -250 -150 -50 3 2.93 2.93 2.89 2.89 2.87 2.87 2.85 2.83 2.83 Vtpwr=3.8V 2.81 2.79 2.79 0 20 40 Ivref=0mA 2.85 2.81 -20 Ivref=-200mA 2.91 Vtpwr=5.8V Vref Vref 2.91 150 250 350 Vref vs. Vtpwr at T=24ºC Vref vs. Temperature at Ivref=0mA 60 80 100 Ivref=360mA 3.5 Temperature(ºC) 12/10/2005 Rev.3.01 50 Ivref(mA) Vline www.SiliconStandard.com 4.5 5.5 Vtpwr 7 of 10 SS8219G PIN DESCRIPTION (for 28pin TSSOP) PIN SYMBOL 1 VREF 2-5,7-12, 18-21, 23-26 Rx+, Rx- 6,22 13 14 15 DESCRIPTION Reference Voltage. 2.85-volt reference in SE mode and 1.25V in LVD mode; must be connected to a 4.7µF capacitor. Signal Termination. (X=1,2,3,…..9) Rx+: Ground line for single-ended or positive line for differential applications for the SCSI bus. Rx-: Signal line/active line for single-ended or negative line in differential applications for the SCSI bus. NC/ HS GND No Connect/Heat Sink Ground. Should be grounded for heat sinking purpose DISCNCT Disconnect. When pulled high, the SS8219G isolates its bus pins (Rx+, Rx-) from the SCSI bus. GND Ground. Terminator ground pin. Connected to ground. Master/slave. Used to select which terminator is the controlling device. M/S pin high enables M/S the DIFFSENSE driver. 16 17 27,28 DIFFSENSE Output to drive the SCSI bus DIFFSENS line. An input pin to detect the type of device (differential or single-ended) on the SCSI bus. The DIFFB DIFFB pin should be connected by a 0.1µF capacitor to GND and by a 20kΩ resistor to the SCSI bus DIFFSENS line. TPWR Terminator Power. Connect to the SCSI TERMPWR line and de-couple with a 2.2µF capacitor. *The VREF keeps the level at 2.85 volts, whether the DISCNCT pin is asserted or not; even if the termination mode is changed. PIN DESCRIPTION (for 36pin SSOP) PIN SYMBOL 1 VREF* 2,3 4-7,11-16, 22-25, 29-32 8, 9,10,26, 27,28 17 NC DISCNCT 18 GND 19 20 21 33 34 35 36 Rx+ RxHS/GND DESCRIPTION Reference Voltage. 2.85-volt reference; must be connected to a 4.7µF capacitor. No Connect. Do not connect these pins. Signal Termination. (X=1,2,3,…..9) Rx+: Ground line for single-ended or positive line for differential applications for the SCSI bus. Rx-: Signal line/active line for single-ended or negative line in differential applications for the SCSI bus. Heat Sink Ground. Connect to large area PC board traces to increase power dissipation capability. Disconnect. When pulled high, the SS8219G isolates its bus pins (Rx+, Rx-) from the SCSI bus. Ground. Terminator ground pin. Connected to ground. Master/slave. Used to select which terminator is the controlling device. M/S pin high enables M/S the DIFFSENSE driver. DIFFSENSE Output to drive the SCSI bus DIFFSENS line. An input pin to detect the type of device (differential or single-ended) on the SCSI bus. The DIFFB DIFFB pin should be connected by a 0.1µF capacitor to GND and 20kΩ resistor to the SCSI bus DIFFSENS line. SE LVD HVD TPWR Single ended mode indicator. It is HIGH when terminator is operating in SE mode. Low Voltage Differential mode indicator. It is HIGH when terminator is operating in LVD mode. High Voltage Differential mode indicator. It is HIGH when terminator is operating in HVD mode Terminator Power. Connect to SCSI bus TERMPWR line and decouple with 2.2µF capacitor. *The VREF keeps the level at 2.85 volts, whether the DISCNCT pin is asserted or not; even if the termination mode is changed. 12/10/2005 Rev.3.01 www.SiliconStandard.com 8 of 10 SS8219G PHYSICAL DIMENSIONS (36pin SSOP - order package option S) C L E1 E h x 45° Θ D A A1 0.004 C SEATING PLANE b e SYMBOL MIN. A A1 b 2.413 0.203 0.300 c D e E 0.127 15.748 E1 h L Θ 7.391 0.381 0.508 0º DIMENSION IN MM TYP. 2.591 0.305 15.875 0.800 BASIC 10.033 7.493 MAX. MIN. 2.794 0.406 0.450 0.095 0.008 0.012 0.254 16.002 0.005 0.620 10.668 0.395 7.595 0.635 1.016 8º 0.291 0.015 0.020 0º DIMENSION IN INCH TYP. 0.102 0.012 0.625 0.032 BASIC MAX. 0.110 0.016 0.018 0.010 0.630 0.420 0.295 0.289 0.025 0.040 8º Taping Specification Feed Direction Typical SSOP, TSSOP Package Orientation Rev.2.02 12/06/2003 www.SiliconStandard.com 9 of 10 SS8219G PHYSICAL DIMENSIONS (28pin TSSOP - order package option D) C D 28 L E1 E 1 Θ A A2 A1 e b Note: 1. Package body dimensions exclude mold flash protrusions or gate burrs 2. Tolerance ±0.1mm unless otherwise specified 3. Coplanarity : 0.1mm 4. Controlling dimensions are in millimeters. Converted inch dimensions are not necessarily accurate. 5. Follows JEDEC MO-153 MIN. DIMENSION IN MM NOM. MAX. MIN. DIMENSION IN INCH NOM. MAX. A A1 A2 ----0.05 0.80 --------1.00 1.20 0.15 1.05 ----0.002 0.031 --------0.039 0.048 0.006 0.041 b C D E 0.19 0.09 9.60 ----- --------9.70 6.40 0.30 0.20 9.80 ----- 0.007 0.004 0.378 ----- --------0.382 0.252 0.012 0.008 0.386 ----- E1 e L y Θ 4.30 ----0.45 ----- 4.40 0.65 0.60 ----- 4.50 ----0.75 0.10 0.169 ----0.018 ----- 0.173 0.026 0.024 ----- 0.177 ----0.030 0.004 8º 0º ----- 8º SYMBOL 0º ----- Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 12/10/2005 Rev.3.01 www.SiliconStandard.com 10 of 10