HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD P P L I ® FEATU R E S ‧ Small size ‧ Excellent Break down voltage, low DF ‧ Suit to re-flow soldering, wave soldering, hand soldering TS18H A Suntan C A T I O N S ‧ TS18H SMD is widely used in Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converter, Back-lighting Inverters. OUTSIDE DIMENSION Type British expression 0603 0805 1206 1210 1808 1812 2225 Dimension (inches) Metric expression 1608 2012 3216 3225 4520 4532 5763 Length(L±0.1) Width(W±0.1) 0.06 0.08 0.12 0.12 0.18 0.18 0.22 0.03 0.05 0.06 0.10 0.08 0.12 0.20 Coefficient Parameter NPO Temperature Wave X7R Temperature Wave DF≤0.15% None ≥100GΩ DF≤2.50% ≤2.5% decade hour Temperature Coefficient Dissipation Factor Aging Insulation Resistance Dielectric Strength ≥500ΩF OR 50 GΩ Rated Voltage Test Voltage Time Ur=100V 2.5Ur 60±5S 200V≤Ur≤1000V 1.5Ur 60±5S Ur>1000V 1.2Ur 60±5S Suntan® Technology Company Limited Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246 Suntan HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD ® TS18H S P E C I Item C A T I O N S Test Method NPO: -55 ~ +125℃ Operating Range I Specifications Class I Temperature F X7R: -55 ~ +125℃ X5R: -55 ~ +85℃ Class II Y5V: -30 ~ +85℃ Z5U: +10 ~ +85℃ Tolerance Appearance ±5%, ±10% ±20% No visual defects Class I Visual inspection Should be within the specified tolerance Capacitance Class II Should be within the specified tolerance Class I Test Capacitance Frequency 1MHz±10% ＞1000pF 1KHz±10% ≤10μF 1KHz±10% 1.0±0.2Vrms ＞10μF 120±24Hz 0.5±0.1Vrms Z5U 1.0±0.1KHz 0.5±0.05Vrms ≥50V 25V 16V Factor X5R ≤2.5% ≤.35% ≤3.5% Y5V ≤7.0% (C<1.0μF) ≤12.5% ≤12.5% Z5U Class I Rated C＞10nF，Ri*CR≥500ΩF Voltage Insulation （I.R.） 25±2℃ X5R Class II Y5V Z5U Suntan® Technology Company Limited Test Method: The same as "Capacitance" ≤9.0% (C≥1.0μF) C≤10nF，Ri≥50000MΩ X7R Resistance 1.0±0.2Vrms ≤0.15% X7R Class II Temperature ≤1000pF Dissipation （D.F.） Test Voltage Tes Voltage Duration Charge/Disch arge Current C≤25nF，Ri≥ 10000MΩ Ur<500V Ur 60±5 sec C＞25nF，Ri*CR＞ Temper ≤50 mA ±2℃ 100ΩF Humidit C≤25nF，Ri≥ 4000MΩ C＞25nF，Ri*CR＞ ature:25 y:<75% Ur<500V 500V 60±5 sec ≤50 mA 100ΩF Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246 Suntan HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD ® TS18H S P E C Item I F I C （D.W.V.） Duration 2.5Ur 1~5sec. 1.5Ur 1~5sec. 1.2Ur 1~5sec. 200V≤Ur No breakdown ≤ 1000V or visual Ur＞ defects O Test Voltage Ur<200V Dielectric I N 1000V Charge/Discha rge Current ≤50mA Dielectric withstanding voltage testing may requires immersion of the capacitor in a isolation fluid,at test voltage over 2000Vdc. Perform a heat temperature at 150+0/-10℃ for 1hrs,then place room temp. for 24±2hrs. Class I NPO:0±30ppm/℃ According to the following sequence, measure the capacitance after temperature stabilize for 30min .（△C based on T3） Capacitance Temperature Step Temperature（℃） Characteristic / X7R:≤±15% T1 25±2 Coefficient X5R:≤±15% T2 Low-category temp. Y5V:+22%～-82% T3 25±2 Z5U:+22%～-56% T4 High-category temp. T1 25±2 Class II Solderability No defects,≥90% of each terminal should be covered with fresh solder Strength of Preheating Conditions:80~120℃;10～30sec. Solder Temperature ：245±5℃ Immersing Speed:25±0.25mm/s Duration：2±0.5sec. Applied Force:5N Adhesive Appearance: No visible damage. Termination Suntan® Technology Company Limited S Test Method Voltage Voltage T Specifications Rated Withstanding A Duration:10±1sec. Speed:1mm/sec Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246 Suntan HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD ® TS18H S P E C Appearance Resistance F I C A T No crack or marked Solder the capacitor on the defects should occur. test jig,using a eutectic Class I ：≤±5% to Flexure Stresses I △C/C Class II：≤±10% I O N S solder.Then apply a force in the direction. Deflection:1mm Speed: 1mm/sec No defects,≥90% of each Appearance terminal should be covered with fresh solder Class I: ≤±0.5% or ±0.5pF Resistance to Soldering △C/C Heat （whichever is larger） Preheat the capacitor at 100 to 200℃ for 10±2 minute.Immerse the Class II: capacitor in a eutectic solder at 265±5℃ for 5±1 seconds.Store at X7R X5R: -5~+10% room temperature for 24±2 hours before measureing electric properties. Y5V Z5U: -10～+20% D.F. I.R. Appearance Meets Initial Values (As Above) Meets Initial Values (As Above) No visual defect Class I: ≤±1% or ±1pF Temperature △C/C Cycle D.F. I.R. （whichever is larger） Class II: Perform a heat temperature at 150+0/-10℃ for 1hrs,then place room temp. for 24±2hrs. Fix the capacitor to the supporting jig,Perform the five cycles according to the four heat treatments listed in the following table.Store at room temperature for 24±2 hours before measureing electric properties. X7R X5R ≤±10% Step Temperature（℃） Time (min.) Z5U Y5V ≤±20% 1 Low-category temp. 30 Meets Initial Values 2 25±2 3 (As Above) 3 High-category temp. 30 4 25±2 3 Meets Initial Values (As Above) Suntan® Technology Company Limited Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246 Suntan HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD ® TS18H S P E C Appearance I F I C A T I O N S No visual defect Class I: ≤±2% or ±1pF △C/C （whichever is larger） Class II: X7R X5R ≤±10% Humidity Steady State D.F. Z5U Y5V ≤±30% Let the capacitor sit at 40±2℃ and 90 to 95% humidity for 500+24/-0 ≤Initial Values *2 hours.Remove and let sit for 48±2 hours at room temperature before (See Above) measureing electric properties. ClassI:Ri≥2500MΩor Ri*CR＞25ΩF I.R. （whichever is smaller） ClassII:Ri≥1000MΩor Ri*CR＞25ΩF （whichever is smaller） Appearance △C/C No visual defect Rated Voltage Applied Charge/Discharge Voltage Current Class I: ≤±2% or ±1pF Ur<500V 2Ur （whichever is larger） 500V≤Ur ≤ 1000V 1.5Ur Ur＞1000V 1.2Ur Class II: X7R X5R ≤±20% ≤50mA Z5U Y5V ≤±30% Loading Life D.F. ≤Initial Values *2 (See Above) ClassI:Ri≥4000MΩor Ri*CR＞40ΩF （whichever is smaller） I.R. ClassII:Ri≥2000MΩor Ri*CR＞50ΩF （whichever is smaller） Suntan® Technology Company Limited Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246 HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD Suntan ® TS18H Precautions on the use of MLCC: 1.eneral Precautions On The Use Of MLCC: The Multi-layer Ceramic Capacitors MLCC may fail when subjected to severe conditions of electrical environment and manchanical stress beyond the specified "rating" and specified condition in the specification.Following the precautions for satefy . 2. PCB Design The amount of solder applied can affect the ability of chips to withstand mechanical stresses, which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads, which determines the amount of solder necessary to form the fillets. When designing the position of solder pads and SMD capacitors,it should be carefully performed to minimize stress.SMD capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. 3. Considerations For Automatic Placement If the lower limit of the pick-up nozzle is low,too much force may be imposed on the capacitors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. The pick-up pressure should be adjusted between 1 and 3 N static loads. To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins of back-up should be used the under PC board. Suntan® Technology Company Limited Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246 HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD Suntan ® TS18H 4. Soldering The ceramic section and metal section combine to the MLCC. As the poor heat conductivity of the ceramic section ,ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling, especialy for large s When hand soldering,use a soldering iron with a maximum power of 25W and a maximum tip diameter of 1.0mm.The soldering iron should not touch the capacitor directly . 5.Cleaning The temperature difference between the components and cleaning process should not be greater than 100℃. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes’ strength, thus the following condition Ultrasonic output : Below20W/L Ultrasonic frequency: Below 40KHZ Ultrasonic washing period: 5min or less 6.Breakaway PC Boards When splitting the PC board after mounting capacitors and other components, care is required so as not to give any stresses of twisting to board.1. Be careful not to subject the capacitors to excessive mechanical shocks. Board separation should not be done manually, but by using the appropriate devices. 7. Storage Conditions To maintain the solderability of terminal electrodes and to keep the packaging material in good condition,recommended conditions as the following: Temperature: 5-40℃; Humidity: 20-70% RH Even though MLCC are stored in a good condition ,the solderability of MLCC termimal electrodes will decrease as time goes by, so components should be used within 6 months from the time of delivery. Suntan® Technology Company Limited Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246 HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD Suntan ® TS18H Capacitance & Voltage Size 0603 0805 1206 1210 1808 Rated Voltage Capacitance Range (pF) NPO X7R 100V 1 ~ 470 100~22 000 200V 1~330 100V Size Capacitance Range (pF) Rated Voltage NPO X7R 100V 3.3~8 200 220~470 000 100~8 200 200V 3.3~6 800 220~180 000 1~1 000 100~56 000 500V 3.3~4 700 220~150 000 200V 1~820 100~27 000 1000V 3.3~1 200 220~27 000 500V 1~560 100~12 000 2000V 3.3~390 220~12 000 100V 1.5~3 300 100~220 000 3000V 3.3~270 220~5 600 200V 1.5~2 200 100~120 000 4000V 3.3~220 220~1 500 500V 1.5~1 000 100~56 000 100V 10~12 000 470~1000 000 1000V 1.5~680 100~12 000 200V 10~8 200 470~1000 000 1000V 1.5~10 100~5 600 500V 10~5 600 470~470 000 100V 2~5 600 150~330 000 1000V 10~2 700 470~68 000 200V 2~3 900 150~150 000 2000V 10~1 000 470~33 000 500V 2~2 200 150~100 000 3000V 10~680 470~4 700 1000V 2~820 150~15 000 4000V 10~560 470~3 900 2000V 2~470 150~8 200 100V 10~56 000 470~2200 000 100V 2~3 900 150~390 000 200V 10~47 000 470~2200 000 200V 2~3 000 150~180 000 500V 10~12 000 470~1000 000 500V 2~1 800 150~120 000 1000V 10~10 000 470~390 000 1000V 2~820 150~22 000 2000V 10~5 600 470~270 000 3000V 2~150 150~2 700 3000V 10~3 900 470~8 200 4000V 2~100 150~1 000 4000V 10~560 470~3 000 1812 2225 3035 Note: Specification are subject to change without notice. For more detail and update, please visit our website. Suntan® Technology Company Limited Website: www.suntan.com.hk Email: [email protected] Tel: (852) 8202 8782 Fax: (852) 8208 6246