SUPERWORLD C3-5N6-10

CERAMIC CHIP INDUCTORS
C3 SERIES
1. PART NO. EXPRESSION :
C3-1N5S-10
(a) Series code
(a)
(b) Inductance code : 1N5 = 1.5nH
(b) (c)
(d)
(d) 10 : Lead Free
(c) Tolerance code : S = ±0.3nH, J = ±5%, K = ±10%, M = ±20%
2. CONFIGURATION & DIMENSIONS :
A
D
L
H
G
B
C
PCB Pattern
Unit:m/m
A
B
C
D
2.00±0.20 1.25±0.20 0.85±0.20 1.25±0.20 0.50±0.30
G
H
L
1.00 Ref.
1.00 Ref.
3.00 Ref.
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -55°C to +125°C
d) Operating temp. : -40°C to +85°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
C3 SERIES
6. ELECTRICAL CHARACTERISTICS :
Part Number
EIA
Size
Dim. C
( mm )
±0.2
Inductance
( nH )
Test
Frequency
( MHz )
Q
Min.
Q
@ 100MHz
Nom.
DCR
(ȍ)
Max.
Rated Current
( mA )
Max.
SRF
( MHz )
Min.
C3-1N5S-10
0805
0.85
1.5
100
10
21
0.10
300
4000
C3-1N8S-10
0805
0.85
1.8
100
10
18
0.10
300
4000
C3-2N2S-10
0805
0.85
2.2
100
10
18
0.10
300
4000
C3-2N7S-10
0805
0.85
2.7
100
12
19
0.10
300
4000
C3-3N3 -10
0805
0.85
3.3
100
12
16
0.13
300
4000
C3-3N9 -10
0805
0.85
3.9
100
12
18
0.15
300
4000
C3-4N7 -10
0805
0.85
4.7
100
12
18
0.20
300
3500
C3-5N6 -10
0805
0.85
5.6
100
15
20
0.23
300
3200
C3-6N8 -10
0805
0.85
6.8
100
15
20
0.25
300
2800
C3-8N2 -10
0805
0.85
8.2
100
15
21
0.28
300
2400
C3-10N -10
0805
0.85
10.0
100
15
20
0.30
300
2100
C3-12N -10
0805
0.85
12.0
100
15
21
0.35
300
1900
C3-15N -10
0805
0.85
15.0
100
15
22
0.40
300
1600
C3-18N -10
0805
0.85
18.0
100
15
24
0.45
300
1500
C3-22N -10
0805
0.85
22.0
100
18
23
0.50
300
1400
C3-27N -10
0805
0.85
27.0
100
18
23
0.55
300
1300
C3-33N -10
0805
0.85
33.0
100
18
24
0.60
300
1200
C3-39N -10
0805
0.85
39.0
100
18
23
0.65
300
1000
C3-47N -10
0805
0.85
47.0
100
18
23
0.70
300
900
C3-56N -10
0805
0.85
56.0
100
18
23
0.75
300
800
C3-68N -10
0805
0.85
68.0
100
18
25
0.80
300
700
C3-82N -10
0805
0.85
82.0
100
18
24
0.90
300
600
C3-R10 -10
0805
1.25
100.0
100
18
23
0.90
300
600
C3-R12 -10
0805
1.25
120.0
50
13
22
0.95
300
500
C3-R15 -10
0805
1.25
150.0
50
13
22
1.00
300
500
C3-R18 -10
0805
1.25
180.0
50
13
23
1.10
300
400
C3-R22 -10
0805
1.25
220.0
50
12
20
1.20
300
350
C3-R27 -10
0805
1.25
270.0
50
12
20
1.30
300
300
C3-R33 -10
0805
1.25
330.0
50
12
22
1.40
300
250
C3-R39 -10
0805
1.25
390.0
50
10
17
1.30
300
250
C3-R47 -10
0805
1.25
470.0
50
10
17
1.50
300
200
Tolerance code :
: S : ±0.3nH
J : ±5%
K : ±10%
M : ±20%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
CERAMIC CHIP INDUCTORS
C3 SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
Impedance
HCI2012 Zvs.
vsFrequency
Freq.
IMPEDANCE(Ohm)
10000
1000
22n
100
82n
47n
6n8
10n
10
1
10
100
1000
10000
FREQUENCY(MHz)
Inductance
vs.Freq.
Frequency
HCI2012 L vs
INDUTANCE(nH)
1000
82n
100
33n
22n
47n
10n
6n8
10
1
10
100
1000
10000
FREQUENCY(MHz)
Q vs. Frequency
HCI2012 Q vs Freq.
1000
Q
100
6n8
10
10n
82n
22n
47n
1
10
100
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
C3 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Impedance
Refer to standard electrical characteristics list
DC Resistance
HP4291A, HP4287A+16092A
HP4338B
Rated Current
Temperature Rise Test
30°C max. (ǻt)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Solder Heat Resistance
No mechanical damage
Remaining terminal electrode : 70% min.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Preheating Dipping
260°C
150°C
60
seconds
Natural
cooling
10±0.5
seconds
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
More than 90% of the terminal electrode
should be covered with solder.
Solderability
Preheating Dipping
245°C
150°C
Terminal Strength
60
seconds
Natural
cooling
4±1.0
seconds
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
W
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For C Series :
Size
Force (Kfg)
1
0.2
2
0.5
3
0.6
4
1.0
5
1.0
6
1.0
7
1.5
8
2.0
Time (sec)
> 25
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
C3 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
Bending Strength
PERFORMANCE
TEST CONDITION
The ferrite should not be damaged by forces
applied on the right condition.
Series name
mm (inches)
P-Kgf
2
0.80 (0.033)
0.3
3
1.40 (0.055)
1.0
2.00 (0.079)
2.5
2.70 (0.106)
2.5
1.0(0.039)
R0.5(0.02)
4
5
Chip
6
7
A
8
Random Vibration Test
Appearance : Cracking, shipping & any other
defects harmful to the characteristics should
not be allowed.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
No mechanical damage
Loading at High
Temperature
Appearance : No damage.
Inductance : Within ±10% of initial value.
Q : Within ±20% of initial value.
Temperature : 85±5°C
Applied Current : rated current
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity
Humidity : 90~95% RH.
Temperature : 60±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Appearance : No damage.
Inductance : Within ±10% of initial value.
Q : Within ±20% of initial value.
Thermal Shock
Low temperature storage test
Drop
Phase
Temperature (°C)
Times (min.)
1
-40±2°C
30±3
2
+85±5°C
30±3
Measured : 100 times
Drop 10 times on a concrete floor from a
height of 75cm.
For C Series :
Condition for 1 cycle
Step1 : -40±2°C 30±3 min.
Step2 : +85±5°C 30±3 min.
Number of cycles : 100
Measured at room temperature after placing for 2 to 3hrs.
Temperature : -55±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
No mechanical damage
Derating
Derating Curve
6
Derated Current(A)
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85°C, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
85
125
OperatingTemperature(¢X
Tem perature(°C)
Operating
C)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
CERAMIC CHIP INDUCTORS
C3 SERIES
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
3.00
1.00
1.00
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave
soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown
in Fig. 2
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150°C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350°C tip temperature (max)
f) Limit soldering time to 3 secs.
c) Never contact the ceramic with the iron tip
Soldering
Natural
cooling
Preheating
TEMPERATURE °C
TEMPERATURE °C
Preheating
20~40s
TP(260°C/10s max.)
217
200
150
60~150s
60~180s
480s max.
25
Time(sec.)
Soldering
Natural
cooling
260
245
150
Gradual
Cooling
Over 2min.
Figure 1. Re-flow Soldering
Within 3s
TEMPERATURE °C
Preheating
Soldering
3s
(max.)
350
Natural
cooling
Figure 2. Wave Soldering
10s
(max.)
330
150
Over 1min.
Gradual
Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
CERAMIC CHIP INDUCTORS
C3 SERIES
9-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit
t
Recommendable
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
CERAMIC CHIP INDUCTORS
C3 SERIES
10. PACKAGING INFORMATION :
10-1. Reel Dimension
Type
A(mm)
B(mm)
C(mm)
D(mm)
7" x 8mm
9.0±0.5
60.0±2.0
13.5±0.5 178.0±2.0
7" x 12mm 13.5±0.5
60.0±2.0
13.5±0.5 178.0±2.0
C
D
B
A
2±0.5
7" x 8mm
13.5±0.5
7" x 12mm
R10.5
R1.9
R0.5
120°
10-2 Tape Dimension / 8mm
Material : Paper
D:1.56 +0.1
-0.05
t
Bo
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
1
1.12±0.03
0.62±0.03
0.60±0.03
2.0±0.1
0.60±0.03
none
2
1.85±0.05
1.05±0.05
0.95±0.05
4.0±0.1
0.95±0.05
none
3(09)
2.30±0.05
1.50±0.05
0.95±0.05
4.0±0.1
0.95±0.05
none
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
2
1.95±0.10
1.05±0.10
1.05±0.10
4.0±0.1
0.23±0.05
none
3(09)
2.25±0.10
1.42±0.10
1.04±0.10
4.0±0.1
0.22±0.05
1.0±0.1
3(12)
2.35±0.10
1.50±0.10
1.45±0.10
4.0±0.1
0.22±0.05
1.0±0.1
Series
Size
Z/L/C
Ko
Ao
P
W:8.0±0.1
E:1.75±0.1
Po:4±0.1
F:3.5±0.1
P2:2±0.1
Material : Plastic
D:1.5+0.1
Po:4±0.1
t
Series
P
Ao
A
D1:1±0.1
Bo
W:8.0±0.1
A
F:3.5±0.05
E:1.75±0.1
P2:2±0.05
Z/L/C
Ko
4
3.50±0.10
1.88±0.10
1.27±0.10
4.0±0.1
0.22±0.05
1.0±0.1
Section A-A
5
3.42±0.10
2.77±0.10
1.55±0.10
4.0±0.1
0.22±0.05
1.0±0.1
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
6
4.95±0.1
1.93±0.1
1.93±0.1
4.0±0.1
0.24±0.05
1.5±0.1
7
4.95±0.1
3.66±0.1
1.85±0.1
8.0±0.1
0.24±0.05
1.5±0.1
8
6.10±0.1
5.40±0.1
2.00±0.1
8.0±0.1
0.30±0.05
1.5±0.1
10-2.1 Tape Dimension / 12mm
Po:4±0.1
P2:2±0.05
t
A
A
D1:1.5±0.1
P
Ao
Bo
W:12.0±0.1
Series
F:5.5±0.05
E:1.75±0.1
D:1.5+0.1
Z/L
Ko
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
CERAMIC CHIP INDUCTORS
C3 SERIES
10-3. Packaging Quantity
Chip Size
8
7
6
5
4
3 (12)
3 (09)
2
1
Chip / Reel
1000
1000
2000
2500
3000
2000
4000
4000
10000
Inner Box
4000
4000
8000
12500
15000
10000
20000
20000
50000
Middle Box
20000
20000
40000
62500
75000
50000
100000
100000
250000
Carton
40000
40000
80000
125000
150000
100000
200000
200000
500000
Bulk (Bags)
7000
12000
20000
30000
50000
100000
150000
200000
300000
10-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Top cover tape
Room Temp.
(°C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9