HIGH CURRENT POWER INDUCTORS SDL1310 SERIES 1. PART NO. EXPRESSION : SDL1310-R60MF (a) (b) (c) (d)(e) (a) Series code (d) Tolerance code : M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : R60 = 0.60uH F B 2. CONFIGURATION & DIMENSIONS : C ØI G A D H PCB Pattern E mm A 13.0 Max. mm mm B 14.0 Max. C 9.0 Max. mm D 3.5±0.5 mm E 6.0±0.5 mm F 7.3±0.5 mm G 7.3±0.5 mm H 6.0±0.5 mm I 2.0±0.5 3. SCHEMATIC : 4. GENERAL SPECIFICATION : a) Operating temp. : -55°C to +125°C b) Storage temp. : -55°C to +125°C c) Irms (A) : Will cause coil temp. to rise approximately ǻT=60°C without core loss. d) Isat (A) : Will cause L0 to drop approximately 20% e) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS SDL1310 SERIES 5. ELECTRICAL CHARACTERISTICS : Part No. Inductance L 0 ( µH ) Test Frequency ( Hz ) DCR ( mȍ ) Max. Irms (A) Max. Isat (A) Max. SDL1310-R60MF 0.60±20% 0.25V / 100K 1.0 30 40 6. CHARACTERISTICS CURVES : SDL1310-R60MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT POWER INDUCTORS SDL1310 SERIES 7. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Refer to standard electrical characteristics list Inductance HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. DCR CH16502, Agilent33420A Micro-Ohm Meter. Heat Rated Current (Irms) Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 20% Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 230°C 150°C Solder Heat Resistance 60 seconds Natural cooling 4±1 seconds 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Preheating 260°C 150°C 60 seconds Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 230±5°C Flux for lead free : rosin Dip Time : 4±1sec. Dipping Natural cooling Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Low Temperature Life Test 1. Appearance : No damage Thermal Shock 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -55±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step Temperature (°C) 1 -55±3 30±3 2 Room Temperature Within 3 Times (min.) 3 +125±3 30±3 4 Room Temperature Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT POWER INDUCTORS SDL1310 SERIES 8. SOLDERIND AND MOUNTING : 8-1. Recommended PC Board Pattern ( Unit : mm ) 7.3±0.5 5 0. 0± 2. Ø 6.0±0.5 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs. Soldering 10s max. Natural cooling 250~260 230 180 150 60~120s Preheating TEMPERATURE °C TEMPERATURE °C Preheating 280 Soldering Natural cooling 260 150 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering 9. PACKING AND QUANTITY : Size SDL1310 Styrofoam 180 Inner box 360 Carton 1800 NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4