MOLDING TYPE DIP INDUCTORS SDM119N SERIES 1. PART NO. EXPRESSION : SDM119N-R25MF (a) (b) (c) (d)(e) (a) Series code (d) Tolerance code : M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : R25 = 0.25uH 2. CONFIGURATION & DIMENSIONS : A L N E 12.5 E B M F 12.5 D C R30 PCB Pattern ØW F Unit:m/m Part No. A B C D E F W L M N R25/R36/R47 R50/R56/R68 11.5±0.5 11.5±0.5 10.5 Max. 3.4±0.5 5.7±0.5 6.3±0.5 1.5±0.1 8.5±0.5 8.5±0.5 1.8±0.1 R30 11.5±0.5 11.5±0.5 10.5 Max. 3.4±0.5 7.3±0.5 6.0±0.5 1.3±0.1 9.4±0.5 9.4±0.5 1.6±0.1 1R2 11.5±0.5 11.5±0.5 10.5 Max. 3.4±0.5 6.6±0.5 6.6±0.5 1.5±0.1 9.3±0.5 9.3±0.5 1.8±0.1 2R0 11.5±0.5 11.5±0.5 10.5 Max. 3.4±0.5 6.6±0.5 6.6±0.5 1.0±0.1 9.3±0.5 9.3±0.5 1.2±0.1 2R5 11.5±0.5 11.5±0.5 10.5 Max. 3.4±0.5 6.5±0.5 6.9±0.5 0.9±0.1 9.5±0.5 9.5±0.5 1.1±0.1 3R0 11.5±0.5 11.5±0.5 10.5 Max. 3.4±0.5 6.4±0.5 6.3±0.5 1.1±0.1 9.0±0.5 9.0±0.5 1.2±0.1 3. SCHEMATIC : 4. MATERIALS : (a) Core : M-Iron Core (b) Wire : Enamelled Copper Wire (c) Adhesive : Epoxy 5. FEATURES : a) Shielded construction b) Frequency up to 1MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 MOLDING TYPE DIP INDUCTORS SDM119N SERIES 6. GENERAL SPECIFICATION : a) Test Frequency : 100KHz/1.0Vdc b) Operating temp. : -25°C to +125°C c) Ambient temp. : 25°C d) Irms (A) : Will cause an approximately temp. rise < 40°C typ. e) Isat (A) : Will cause L0 to drop approximately 20% typ. f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : Part No. Inductance L0 ( uH ) ±20% @ 0Adc Q Min. Irms (A) Typ. Isat (A) Max. DCR ( mȍ ) Max. SDM119N-R25MF 0.25 20 38 42 0.5 SDM119N-R30MF 0.30 15 42 45 0.8±10% SDM119N-R36MF 0.36 20 40 50 0.6 SDM119N-R50MF 0.50 20 35 40 0.8 SDM119N-R56MF 0.56 15 32 40 0.8 SDM119N-R68MF 0.68 20 32 38 1.0 SDM119N-1R1MF 1.1 15 20 30 1.5 SDM119N-1R2MF 1.2 10 35 35 1.05±8% SDM119N-2R0MF 2.0 15 21 30 3.7 SDM119N-2R5MF 2.5 20 15 28 4.5 SDM119N-3R0MF 3.0 15 20 25 4.0 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise 80 80 60 50 0.2 40 30 0.1 INDUCTANCE (uH) 90 70 0.3 100 90 TEMP. RISE(oC) INDUCTANCE (uH) 0.4 SDM119N-R30MF DMPI119N-R30 0.6 100 70 0.4 60 50 40 0.2 30 20 20 10 0 0 0 10 20 30 40 50 TEMP. RISE(oC) SDM119N-R25MF DMPI119N-R25 0.5 10 0 0 0 10 DC CURRENT(A) 20 30 40 50 DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 MOLDING TYPE DIP INDUCTORS SDM119N SERIES 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise SDM119N-R36MF DMPI119N-R36 SDM119N-R50MF DMPI119N-R50 80 100 1 90 70 50 0.3 40 0.2 30 20 INDUCTANCE (uH) 80 60 TEMP. RISE(oC) INDUCTANCE(uH) 0.4 0.75 70 60 50 0.5 40 30 0.25 20 0.1 10 0 10 0 0 0 10 20 30 40 50 0 0 60 9 18 27 36 45 DC CURRENT(A) DC CURRENT(A) SDM119N-R68MF DMPI119N-R68 SDM119N-R56MF DMPI119N-R56 1 TEMP. RISE(oC) 0.5 100 1 1 00 90 40 0.25 INDUCTANCE (uH) 0.5 TEMP. RISE(oC) INDUCTANCE (uH) 60 0.75 70 60 0 .5 50 40 30 TEMP. RISE(oC) 80 80 0.75 0.25 20 20 10 0 0 0 0 10 20 30 0 0 40 10 30 40 DC CURRENT(A) DC CURRENT(A) SDM119N-1R1MF DMPI119N-1R1 1.5 20 SDM119N-1R2MF DMPI119N-1R2 100 1.5 80 1.2 80 0.6 40 0.3 20 60 50 0.9 40 0.6 30 TEMP. RIS E(oC) 60 INDUCTANCE(uH) INDUCTANCE (uH) 0.9 TEMP. RISE(oC) 70 1.2 20 0.3 10 0 0 0 10 20 30 40 0 0 0 10 DC CURRENT(A) 20 30 40 50 DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 MOLDING TYPE DIP INDUCTORS SDM119N SERIES 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise SDM119N-2R5MF DMPI119N-2R5 SDM119N-2R0MF DMPI119N-2R0 4 100 3.2 80 90 70 40 1.6 30 20 INDUCTANCE (uH) 50 2.4 TEMP. RISE(oC) INDUCTANCE (uH) 60 2.4 70 60 50 1.6 40 30 0.8 20 0.8 10 0 10 0 0 0 6 12 18 24 TEMP. RISE(oC) 80 3.2 0 0 30 7 14 21 28 DC CURRENT(A) DC CURRENT(A) SDM119N-3R0MF DMPI119N-3R0 100 4 90 70 60 50 2 40 30 1 TEMP. RISE(oC) INDUCTANCE (uH) 80 3 20 10 0 0 0 5 10 15 20 25 DC CURRENT(A) Inductance vs. Frequency SDM119N SERIES DMPI119N ˆˁˈ INDUCTANCE(uH) ˆ ˅ˁˈ ˅ ˄ˁˈ ˄ ˃ˁˈ ˃ ˃ˁ˃˃˄ ˃ˁ˃˄ ˃ˁ˄ ˄ FREQUENCY(M Hz) ˄˃ ˄˃˃ ˥˅ˈ ˥ˆ˃ ˥ˆˉ ˥ˈ˃ ˥ˈˉ ˥ˉˋ ˄˥˄ ˄˥˅ ˅˥˃ ˅˥ˈ ˆ˥˃ NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 MOLDING TYPE DIP INDUCTORS SDM119N SERIES 9. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Inductance Refer to standard electrical characteristics list HP-4192A, HP4284A, CH1320 DCR Agilent 33420A Heat Rated Current (Irms) Irms(A) will cause an temp rise < 40°C typ. Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 25% Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C 150°C 60 seconds Natural cooling 4±1 seconds After fluxing, component shall be dipped in a melted solder bath at 245±5°C for 5 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±3% Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C Flux : rosin 260°C Dip Time : 10±0.5sec. 150°C Preheating Dipping 60 seconds Natural cooling 10±0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Temperature : 85±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber 1. Appearance : No damage 2. Inductance : Within ±3% of initial value. Thermal Shock No disconnection or short circuit. Temperature : -40±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Conditions of 1 cycle. Times (min.) Step Temperature (°C) 1 -25±3 30±3 2 Room Temperature Within 3 3 85±3 30±3 4 Room Temperature Within 3 Total : 5 cycles Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±5% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 MOLDING TYPE DIP INDUCTORS SDM119N SERIES 10. SOLDERIND AND MOUNTING : 10-1. Recommended PC Board Pattern Part No. E F M N R25/R36/R47 R50/R56/R68 5.7±0.5 6.3±0.5 8.5±0.5 1.8±0.1 R30 7.3±0.5 6.0±0.5 9.4±0.5 1.6±0.1 1R2 6.6±0.5 6.6±0.5 9.3±0.5 1.8±0.1 2R0 6.6±0.5 6.6±0.5 9.3±0.5 1.2±0.1 2R5 6.5±0.5 6.9±0.5 9.5±0.5 1.1±0.1 3R0 6.4±0.5 6.3±0.5 9.0±0.5 1.2±0.1 N E 12.5 M Unit:m/m F 12.5 10-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 10-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 10-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Soldering 10s max. Natural cooling 250~260 230 180 150 60~120s 30~60s Preheating TEMPERATURE °C TEMPERATURE °C Preheating 350 Soldering Natural cooling 300 150 Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 MOLDING TYPE DIP INDUCTORS SDM119N SERIES 11. PACKING AND QUANTITY : Size SDM119N Styrofoam 100 Inner Box 1000 Carton 2000 Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7