SN54LS640 THRU SN54LS642, SN54LS644, SN54LS645 SN74LS640 THRU SN74LS642, SN74LS644, SN74LS645 OCTAL BUS TRANSCEIVRS SDLS189 – APRIL 1979 – REVISED MARCH 1988 Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54LS640 THRU SN54LS642, SN54LS644, SN54LS645 SN74LS640 THRU SN74LS642, SN74LS644, SN74LS645 OCTAL BUS TRANSCEIVRS SDLS189 – APRIL 1979 – REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS640 THRU SN54LS642, SN54LS644, SN54LS645 SN74LS640 THRU SN74LS642, SN74LS644, SN74LS645 OCTAL BUS TRANSCEIVRS SDLS189 – APRIL 1979 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54LS640, SN54LS645 SN74LS640, SN74LS645 OCTAL BUS TRANSCEIVRS WITH 3-STATE OUTPUTS SDLS189 – APRIL 1979 – REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS640, SN54LS645 SN74LS640, SN74LS645 OCTAL BUS TRANSCEIVRS WITH 3-STATE OUTPUTS SDLS189 – APRIL 1979 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54LS640, SN54LS645 SN74LS640, SN74LS645 OCTAL BUS TRANSCEIVRS WITH 3-STATE OUTPUTS SDLS189 – APRIL 1979 – REVISED MARCH 1988 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS641, SN54LS642, SN54LS644 SN74LS641, SN74LS642, SN74LS644 OCTAL BUS TRANSCEIVRS WITH OPEN-COLLECTOR OUTPUTS SDLS189 – APRIL 1979 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN54LS641, SN54LS642, SN54LS644 SN74LS641, SN74LS642, SN74LS644 OCTAL BUS TRANSCEIVRS WITH OPEN-COLLECTOR OUTPUTS SDLS189 – APRIL 1979 – REVISED MARCH 1988 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-8416101VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type -55 to 125 5962-8416101VR A SNV54LS640J 5962-8416101VSA ACTIVE CFP W 20 25 TBD Call TI N / A for Pkg Type -55 to 125 5962-8416101VS A SNV54LS640W 84161012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84161012A SNJ54LS 640FK 8416101RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8416101RA SNJ54LS640J 8416101SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8416101SA SNJ54LS640W SN54LS640J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS640J SN54LS645J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS645J SN74LS640-1DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640-1 SN74LS640-1DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640-1 SN74LS640-1DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640-1 SN74LS640-1DWR OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70 SN74LS640-1N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS640-1N SN74LS640-1NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS640-1N SN74LS640-1NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS640-1 SN74LS640-1NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS640-1 SN74LS640-1NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS640-1 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74LS640DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LS640 SN74LS640DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LS640 SN74LS640DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LS640 SN74LS640DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640 SN74LS640DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640 SN74LS640DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640 SN74LS640DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640 SN74LS640DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640 SN74LS640DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS640 SN74LS640N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS640N SN74LS640N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS640NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS640N SN74LS640NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS640 SN74LS640NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS640 SN74LS640NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS640 SN74LS641-1DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641-1 SN74LS641-1DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641-1 SN74LS641-1DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641-1 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74LS641-1DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641-1 SN74LS641-1DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641-1 SN74LS641-1DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641-1 SN74LS641-1N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS641-1N SN74LS641-1N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS641-1NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS641-1N SN74LS641DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641 SN74LS641DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641 SN74LS641DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS641 LS641 SN74LS641DWR OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70 SN74LS641DWRE4 OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70 SN74LS641DWRG4 OBSOLETE SOIC DW 20 SN74LS641N ACTIVE PDIP N 20 TBD Call TI Call TI 0 to 70 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS641N SN74LS641N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS641NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS641N SN74LS641NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS641 SN74LS641NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS641 SN74LS641NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS641 SN74LS642-1DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS642-1 SN74LS642-1DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS642-1 Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74LS642-1DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS642-1 SN74LS642-1N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS642-1N SN74LS642-1NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS642-1N SN74LS642DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS642 SN74LS642DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS642 SN74LS642DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS642 SN74LS642N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS642N SN74LS642NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS642N SN74LS642NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS642 SN74LS642NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS642 SN74LS642NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS642 SN74LS644-1N OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS644N OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS645-1DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645-1 SN74LS645-1DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645-1 SN74LS645-1DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645-1 SN74LS645-1DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645-1 SN74LS645-1DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645-1 SN74LS645-1DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645-1 Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty SN74LS645-1N ACTIVE PDIP N 20 Eco Plan Lead/Ball Finish (2) 20 Pb-Free (RoHS) MSL Peak Temp Op Temp (°C) Device Marking (3) CU NIPDAU (4/5) N / A for Pkg Type 0 to 70 SN74LS645-1N SN74LS645-1N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS645-1NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS645-1N SN74LS645-1NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS645-1 SN74LS645-1NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS645-1 SN74LS645-1NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS645-1 SN74LS645DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645 SN74LS645DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645 SN74LS645DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS645 SN74LS645DWR OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70 SN74LS645N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS645N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS645NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS645N SN74LS645NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS645 SN74LS645NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS645 SN74LS645NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS645 SNJ54LS640FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84161012A SNJ54LS 640FK SNJ54LS640J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8416101RA SNJ54LS640J SNJ54LS640W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8416101SA SNJ54LS640W Addendum-Page 5 SN74LS645N Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SNJ54LS645FK NRND LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 645FK SNJ54LS645J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS645J SNJ54LS645W OBSOLETE CFP W 20 TBD Call TI Call TI -55 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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OTHER QUALIFIED VERSIONS OF SN54LS640, SN54LS640-SP, SN54LS645, SN74LS640, SN74LS645 : Addendum-Page 6 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 • Catalog: SN74LS640, SN54LS640, SN74LS645 • Military: SN54LS640, SN54LS645 • Space: SN54LS640-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 18-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS640-1NSR SO SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) NS 20 2000 330.0 24.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.0 2.5 12.0 24.0 Q1 SN74LS640DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74LS640DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74LS640NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS641-1DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74LS641NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS642NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS645-1DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74LS645-1NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS645NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS640-1NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS640DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74LS640DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS640NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS641-1DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS641NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS642NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS645-1DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS645-1NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS645NSR SO NS 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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