VSM0805 Vishay Foil Resistors SURFACE MOUNT Bulk Metal® Foil Technology Discrete Surface Mount Chip Resistors FEATURES Product may not be to scale The VSM0805 represents the latest addition and smallest size to the Precision Bulk Metal® Foil (BMF) technology surface mount chip resistor series. The VSM0805 has a conventional full wrap around termination. The BMF technology offers designers the lowest and most predictable absolute Temperature Coefficient Resistance available. The TCR is a process capability not a selection process and for the most part is independent of ohmic value and lot related variations. • Nominal TCR: + 0.6ppm/°C (0 to 25°C) - 0.6ppm/C° (+ 25°C to + 60°C) + 2.2ppm/°C (- 55°C to + 25°C) - 1.8ppm/°C (+ 25°C to + 125°C) • Absolute Tolerance: to ± 0.01% • Resistance Range: 5.5Ω to 12K • Load Life Stability: ± 0.025% (2000 hours @ 70°C) • Shelf Life Stability: 0.005% Maximum ∆R • Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V) • Current Noise: < - 40dB • Non Inductive: < 0.08µH • Terminal Finishes Available: Lead (Pb)-free (Sn 99.3% Cu 0.7%) Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%) TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE The availability of tight absolute tolerance provides a good cost solution for the variability of other components when compiling the total error budget. BMF offers the best stability available; and is an order of magnitude better than thin film technology. The noise generated by the resistor is non measurable and its design and construction make it well suited for high frequency applications. The BMF is the ultimate resistor component for analog applications. FIGURE 1 - NOMINAL TCR CURVE –50 –25 +25 0 +50 +75 +100 +400 +300 -5 +5 pp m pp +125 250Ω to 12K ± 0.01 100Ω to < 250 ± 0.02 50Ω to < 100 ± 0.05 25Ω to < 50 ± 0.1 10Ω to < 25 ± 0.25 5.5Ω to <10 ± 0.5 m Nominal Resistance/ Temperature (RT) Curve +200 TIGHTEST TOLERANCE (%)* *Tighter tolerances are available. Please contact Application Engineering. Soldering temperatures used during installation may cause resistance to shift up to 0.05%. –55 +500 VALUE (Ω) TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS MIL-PRF-55342G CHARACTERISTIC. E ∆R LIMITS VSM MAXIMUM ∆R LIMITS* Thermal Shock ± 0.10% ± 0.02% Low Temperature Operation ± 0.10% ± 0.02% Short Time Overload ± 0.10% ± 0.02% High Temperature Exposure ± 0.10% ± 0.05% Resistance to Bonding ± 0.20% ± 0.05% Moisture Resistance ± 0.20% ± 0.10% Life 2000 hours @ + 70°C ± 0.50% ± 0.025% +100 ∆R R (ppm) 0 Maximum Spread ±2.3 ppm/°C –100 –200 –300 –400 +2.2 ppm/°C Nominal Chord Slope (TCR) –1.8 ppm/°C Nominal Chord Slope (TCR) Standard Spread ±2.0 ppm/°C –500 –55°C / +25°C / +125°C are the test points with +25°C as the reference temperature The TCR for values < 100Ω are influenced by the termination composition and result in a deviation from this curve. Contact our application engineering department for detailed specification on low values TEST *As shown + 0.01 Ohms to allow for measurement errors at low values. SALES • ISRAEL: [email protected] • FRANCE/SWITZERLAND/SOUTHERN EUROPE: [email protected] • AMERICAS: [email protected] • ASIA/JAPAN: [email protected] • UK/HOLLAND/SCANDANAVIA: [email protected] • GERMANY/CZECH REPUBLIC/AUSTRIA: [email protected] www.vishay.com 22 For technical questions in the Americas, contact [email protected] Document Number: 63061 For technical questions in Asia/Japan/Europe/Africa/Israel, contact [email protected] Revision 17-Aug-04 VSM0805 ® Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors Percent of Rated Power –55°C 125 FIGURE 3 - RECOMMENDED MOUNTING +70°C Rated Power 100 25% to 85% of T 75 A low profile solder fillet is recommended to avoid unnecessary stresses along top edge of metallization. IR and vapor phase reflow are best. Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction. 50 25 0 -75 –50 –25 0 +25 +50 +75 +100 +125 +150 +175 Ambient Temperature (°C) TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters) Top View Bottom View L Recommended Land Pattern L X W T W T Footprint G Z D CHIP POWER MAXIMUM RESISTANCE MAXIMUM SIZE L W T D ± 0.005 (0.13) ± 0.005 (0.13) MAXIMUM ± 0.005 (0.13) 0805 0.080 (2.03) + 70°C VOLTAGE RANGE WEIGHT (mW) (V) (Ω) (mG) 50 22 5.5 - 12K 6 0.050 (1.27) 0.025 (0.64) 0.015 (0.38) Z* G* X* ± 0.004 (0.10) ± 0.004 (0.10) ± 0.004 (0.10) 0.122 (3.10) 0.028 (0.70) 0.050 (1.27) *Land Pattern Dimensions (Z, G, X) are per IPC-782A TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS MODEL VSM CHIP SIZE 0805 RESISTANCE VALUE RESISTANCE RANGE LETTER DESIGNATOR MULTIPLIER FACTOR 5Ω to <1KΩ R Example: 249R00 = 249Ω 1K to 12KΩ K Example: 10K000 = 10.0KΩ x 1.0 x 103 TOLERANCE TERMINATION PACKAGING T ± 0.01% Q ± 0.02% A ± 0.05% B ± 0.1% C ± 0.25% D ± 0.5% F ± 1.0% S - Lead (Pb)-free B - Tin/Lead T = Tape and Reel W = Waffle PacK SALES • ISRAEL: [email protected] • FRANCE/SWITZERLAND/SOUTHERN EUROPE: [email protected] • AMERICAS: [email protected] • ASIA/JAPAN: [email protected] • UK/HOLLAND/SCANDANAVIA: [email protected] • GERMANY/CZECH REPUBLIC/AUSTRIA: [email protected] For technical questions in the Americas, contact [email protected] Document Number: 63061 For technical questions in Asia/Japan/Europe/Africa/Israel, contact [email protected] Revision 17-Aug-04 www.vishay.com 23 SURFACE MOUNT FIGURE 2 - POWER DERATING CURVE Vishay Foil Resistors