XILINX XC9572XV

0
XC9572XV High-performance
CPLD
R
0
5
Note: This product is being discontinued. You cannot
order parts after May 14, 2008. Xilinx recommends replacing XC9572XV devices with equivalent XC9572XL devices
in all designs as soon as possible. Recommended replacements are pin compatible, however require a VCC change to
3.3V, and a recompile of the design file. In addition, there is
no 1.8V I/O support. See XCN07010 for details regarding
this discontinuation, including device replacement
recomendations for the XC9572XV CPLD.
Features
•
•
•
•
•
•
•
•
72 macrocells with 1,600 usable gates
Available in small footprint packages
- 44-pin VQFP (34 user I/O pins)
- 100-pin TQFP (72-user I/O pins)
Optimized for high-performance 2.5V systems
- Low power operation
- Multi-voltage operation
Advanced system features
- In-system programmable
- Superior pin-locking and routability with
Fast CONNECT™ II switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold ciruitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- 20 year data retention
- ESD protection exceeding 2,000V
Product Specification
in a XC9500XV device may be configured for low-power
mode (from the default high-performance mode). In addition, unused product-terms and macrocells are automatically deactivated by the software to further conserve power.
For a general estimate of ICC, the following equation may be
used:
PTOTAL = PINT + PIO = ICCINT x VCCINT + PIO
Separating internal and I/O power here is convenient
because XC9500XV CPLDs also separate the corresponding power pins. PIO is a strong function of the load capacitance driven, so it is handled by I = CVf. ICCINT is another
situation that reflects the actual design considered and the
internal switching speeds. An estimation expression for
ICCINT (taken from simulation) is:
ICCINT(mA) = MCHS(0.122 X PTHS + 0.238) + MCLP(0.042 x
PTLP + 0.171) + 0.04(MCHS + MCLP) x fMAX x MCTOG
where:
MCHS = # macrocells used in high speed mode
MCLP = #macrocells used in low power mode
PTHS = average p-terms used per high speed macrocell
PTLP = average p-terms used over low power macrocell
fMAX = max clocking frequency in the device
MCTOG = % macrocells toggling on each clock (12% is
frequently a good estimate
This calculation was derived from laboratory measurements
of an XC9500XV part filled with 16-bit counters and allowing
a single output (the LSB) to be enabled. The actual ICC
value varies with the design application and should be verified during normal system operation. Figure 1 shows the
above estimation in a graphical form. For a more detailed
discussion of power consumption in this device, see Xilinx
application note XAPP361, “Planning for High Speed
XC9500XV Designs.”
110
90
Description
The XC9572XV is a 2.5V CPLD targeted for high-performance, low-voltage applications in leading-edge communications and computing systems. It is comprised of four
54V18 Function Blocks, providing 1,600 usable gates with
propagation delays of 5 ns.
Typical I CC (mA)
DS052 (v3.0) June 25, 2007
70
H
P
ig h
erfo
50
Low
30
rma
Pow
nce
er
10
Power Estimation
Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
0
50
100
150
Clock F requency (MHz)
200
DS052_01_041405
© 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS052 (v3.0) June 25, 2007
Product Specification
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1
R
XC9572XV High-performance CPLD
Figure 1: Typical ICC vs. Frequency for XC9572XV
3
JTAG Port
1
JTAG
Controller
In-System Programming Controller
54
18
I/O
Function
Block 1
Macrocells
1 to 18
I/O
Fas t CONNECT II Switch Matrix
I/O
I/O
I/O
Blocks
I/O
I/O
I/O
54
18
Function
Block 2
Macrocells
1 to 18
54
18
Function
Block 3
Macrocells
1 to 18
I/O
3
I/O/GCK
54
1
18
I/O/GSR
I/O/GTS
2
Function
Block 4
Macrocells
1 to 18
DS052_02_041200
Figure 2: XC9572XV Architecture (Function Block outputs (indicated by the bold line) drive the I/O Blocks directly)
Supported I/O Standards
The LVTTL I/O standard is a general purpose EIA/JEDEC
standard for 3.3V applications that use an LVTTL input
buffer and Push-Pull output buffer. The LVCMOS2 standard
is used in 2.5V applications.
Table 1: IOSTANDARD Options
IOSTANDARD
VCCIO
LVTTL
3.3V
LVCMOS2
2.5V
X25TO18
1.8V
XC9500XV CPLDs are also 1.8V I/O compatible. The
X25TO18 setting is provided for generating 1.8V compatible
outputs from a CPLD normally operating in a 2.5V environment. The default I/O Standard for pads without IOSTANDARD attributes is LVTTL for XC9500XV devices.
The XC9572XV CPLD features both LVCMOS and LVTTL
I/O implementations. See Table 1 for I/O standard voltages.
2
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DS052 (v3.0) June 25, 2007
Product Specification
R
XC9572XV High-performance CPLD
Absolute Maximum Ratings
Symbol
Value
Units
Supply voltage relative to GND
–0.5 to 2.7
V
VCCIO
Supply voltage for output drivers
–0.5 to 3.6
V
VIN
Input voltage relative to GND(1)
–0.5 to 3.6
V
VTS
Voltage applied to 3-state output(1)
–0.5 to 3.6
V
TSTG
Storage temperature (ambient)
–65 to +150
oC
+150
oC
VCC
TJ
Description
Junction temperature
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0V or overshoot to +3.6V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
3. For solder specifications, see Xilinx Packaging .
Recommended Operation Conditions
Symbol
VCCINT
VCCIO
Parameter
Min
Max
Units
+70oC
2.37
2.62
V
Industrial TA = –40oC to +85oC
2.37
2.62
Supply voltage for output drivers for 3.3V operation
3.0
3.6
V
Supply voltage for output drivers for 2.5V operation
2.37
2.62
V
Supply voltage for output drivers for 1.8V operation
1.71
1.89
V
Supply voltage for internal logic
and input buffers
Commercial TA =
0oC
to
VIL
Low-level input voltage
0
0.8
V
VIH
High-level input voltage
1.7
3.6
V
VO
Output voltage
0
VCCIO
V
Quality and Reliability Characteristics
Symbol
Parameter
Min
Max
Units
20
-
Years
TDR
Data retention
NPE
Program/Erase cycles (endurance)
1,000
-
Cycles
VESD
Electrostatic Discharge (ESD)
2,000
-
Volts
DS052 (v3.0) June 25, 2007
Product Specification
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XC9572XV High-performance CPLD
DC Characteristics (Over Recommended Operating Conditions)
Symbol
VOH
Parameter
Test Conditions
Min
Max
Units
Output high voltage for 3.3V outputs
IOH = –4.0 mA
2.4
-
V
Output high voltage for 2.5V outputs
IOH = –1.0 mA
2.0
-
V
Output high voltage for 1.8V outputs
IOH = –100 μA
90% VCCIO
-
V
Output low voltage for 3.3V outputs
IOL = 8.0 mA
-
0.4
V
Output low voltage for 2.5V outputs
IOL = 1.0 mA
-
0.4
V
Output low voltage for 1.8V outputs
IOL = 100 μA
-
0.4
V
IIL
Input leakage current
VCC = 2.62V
VCCIO = 3.6V
VIN = GND or 3.6V
-
±10
μA
IIH
Input high-Z leakage current
VCC = 2.62V
VCCIO = 3.6V
VIN = GND or 3.6V
-
±10
μA
VCC min < VIN < 3.6V
-
±150
μA
-
10
pF
VOL
CIN
I/O capacitance
VIN = GND
f = 1.0 MHz
ICC
Operating Supply Current
(low power mode, active)
VI = GND, No load
f = 1.0 MHz
14
mA
AC Characteristics
XC9572XV-5
Symbol
Min
Max
Min
Max
Units
-
5.0
-
7.5
ns
3.5
-
4.8
-
ns
TPD
I/O to output valid
TSU
I/O setup time before GCK
TH
I/O hold time after GCK
0
-
0
-
ns
GCK to output valid
-
3.5
-
4.5
ns
fSYSTEM
Multiple FB internal operating frequency
-
222.2
-
125.0
MHz
TPSU
I/O setup time before p-term clock input
1.0
-
1.6
-
ns
TPH
I/O hold time after p-term clock input
2.5
-
3.2
-
ns
P-term clock output valid
-
6.0
-
7.7
ns
TOE
GTS to output valid
-
4.0
-
5.0
ns
TOD
GTS to output disable
-
4.0
-
5.0
ns
TPOE
Product term OE to output enabled
-
7.0
-
9.5
ns
TPOD
Product term OE to output disabled
-
7.0
-
9.5
ns
TAO
GSR to output valid
-
10.0
-
12.0
ns
TPAO
P-term S/R to output valid
-
10.7
-
12.6
ns
TWLH
GCK pulse width (High or Low)
2.2
-
4.0
-
ns
TPLH
P-term clock pulse width (High or Low)
5.0
-
6.5
-
ns
Asynchronous preset/reset pulse width (High or Low)
5.0
-
6.5
-
ns
TCO
TPCO
TAPRPW
4
Parameter
XC9572XV-7
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DS052 (v3.0) June 25, 2007
Product Specification
R
XC9572XV High-performance CPLD
Internal Timing Parameters
VTEST
R1
Output Type
Device Output
R2
CL
VCCIO
VTEST
R1
R2
CL
3.3V
3.3V
320Ω
360Ω
35 pF
2.5V
2.5V
250Ω
660Ω
35 pF
1.8V
1.8V
10KΩ
14KΩ
35 pF
DS051_03_0601000
Figure 3: AC Load Circuit
XC9572XV-5
Symbol
Parameter
XC9572XV-7
Min
Max
Min
Max
Units
Buffer Delays
TIN
Input buffer delay
-
2.0
-
2.3
ns
TGCK
GCK buffer delay
-
1.2
-
1.5
ns
TGSR
GSR buffer delay
-
2.0
-
3.1
ns
TGTS
GTS buffer delay
-
4.0
-
5.0
ns
TOUT
Output buffer delay
-
2.1
-
2.5
ns
TEN
Output buffer enable/disable delay
-
0
-
0
ns
Product Term Control Delays
TPTCK
Product term clock delay
-
1.7
-
2.4
ns
TPTSR
Product term set/reset delay
-
0.7
-
1.4
ns
TPTTS
Product term 3-state delay
-
5.0
-
7.2
ns
-
0.2
-
1.3
ns
Internal Register and Combinatorial Delays
TPDI
Combinatorial logic propagation delay
TSUI
Register setup time
2.0
-
2.6
-
ns
THI
Register hold time
1.5
-
2.2
-
ns
TECSU
Register clock enable setup time
2.0
-
2.6
-
ns
TECHO
Register clock enable hold time
1.5
-
2.2
-
ns
TCOI
Register clock to output valid time
-
0.2
-
0.5
ns
TAOI
Register async. S/R to output delay
-
5.9
-
6.4
ns
TRAI
Register async. S/R recover before clock
TLOGI
Internal logic delay
-
0.7
-
1.4
ns
TLOGILP
Internal low power logic delay
-
5.7
-
6.4
ns
-
1.6
-
3.5
ns
5.0
7.5
ns
Feedback Delays
TF
Fast CONNECT II feedback delay
Time Adders
TPTA
Incremental product term allocator delay
-
0.7
-
0.8
ns
TPTA2
Adjacent macrocell p-term allocator delay
-
0.3
-
0.3
ns
TSLEW
Slew-rate limited delay
-
3.0
-
4.0
ns
DS052 (v3.0) June 25, 2007
Product Specification
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5
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XC9572XV High-performance CPLD
XC9572XV I/O Pins
Function
Block
Macrocell
VQ44
TQ100
BScan
Order
Function
Block
Macrocell
VQ44
TQ100
BScan
Order
1
1
-
16
213
3
1
-
41
105
1
2
39
13
210
3
2
5
32
102
1
3
-
18
207
3
3
-
49
99
1
4
-
20
204
3
4
-
50
96
1
5
40
14
201
3
5
6
35
93
1
6
41
15
198
3
6
-
53
90
1
7
-
25
195
3
7
-
54
87
1
8
42
17
192
3
8
7
37
84
1
9
43(1)
22(1)
189
3
9
8
42
81
1
10
-
28
186
3
10
-
60
78
1
11
44(1)
23(1)
183
3
11
12
52
75
1
12
-
33
180
3
12
-
61
72
1
13
-
36
177
3
13
-
63
69
1
14
1(1)
27(1)
174
3
14
13
55
66
1
15
2
29
171
3
15
14
56
63
1
16
-
39
168
3
16
18
64
60
1
17
3
30
165
3
17
16
58
57
1
18
-
40
162
3
18
-
59
54
2
1
-
87
159
4
1
-
65
51
2
2
29
94
156
4
2
19
67
48
2
3
-
91
153
4
3
-
71
45
2
4
-
93
150
4
4
-
72
42
2
5
30
95
147
4
5
20
68
39
2
6
31
96
144
4
6
-
76
36
2
7
-
3(2)
141
4
7
-
77
33
2
8
32
97
138
4
8
21
70
30
2
9
33(1)
99(1)
135
4
9
-
66
27
2
10
-
1
132
4
10
-
81
24
2
11
34(1)
4(1)
129
4
11
22
74
21
2
12
-
6
126
4
12
-
82
18
2
13
-
8
123
4
13
-
85
15
2
14
36(3)
9(3)
120
4
14
23
78
12
2
15
37
11
117
4
15
27
89
9
2
16
-
10
114
4
16
-
86
6
2
17
38
12
111
4
17
28
90
3
2
18
-
92
108
4
18
-
79
0
Notes:
1. Global control pin.
2. GTS1 for TQ100
3. GTS1 for VQ44
6
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DS052 (v3.0) June 25, 2007
Product Specification
R
XC9572XV High-performance CPLD
XC9572XV Global, JTAG and Power Pins
Pin Type
VQ44
TQ100
I/O/GCK1
43
22
I/O/GCK2
44
23
I/O/GCK3
1
27
I/O/GTS1
36
3
I/O/GTS2
34
4
I/O/GSR
33
99
TCK
11
48
TDI
9
45
TDO
24
83
TMS
10
47
VCCINT 2.5V
15, 35
5, 57, 98
VCCIO 1.8/2.5V/3.3V
26
26, 38, 51, 88
GND
4, 17, 25
21, 31, 44, 62, 69, 75,
84, 100
No Connects
-
2, 7, 19, 24, 34, 43, 46,
73, 80
DS052 (v3.0) June 25, 2007
Product Specification
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7
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XC9572XV High-performance CPLD
Device Part Marking and Ordering Combination Information
R
XC95xxxXV
TQ144
Device Type
Package
7C
Speed
Operating Range
This line not
related to device
part number
1
Sample package with part marking.
Notes:
1. Due to the small size of chip scale packages, part marking on these packages does not follow the above
sample and the complete part number cannot be included in the marking. Part marking on chip scale
packages by line:
·
·
·
·
Line 1 = X (Xilinx logo), then truncated part number (no XC), i.e., 95xxxXV.
Line 2 = Not related to device part number.
Line 3 = Not related to device part number.
Line 4 = Package code, speed, operating temperature, three digits not related to device
part number. Package code: C1 = CS48.
Speed
(pin-to-pin
delay)
Pkg.
Symbol
No. of
Pins
Package Type
Operating
Range(1)
XC9572XV-5VQ44C
5 ns
VQ44
44-pin
Quad Flat Pack (VQFP)
C
XC9572XV-5TQ100C
5 ns
TQ100
100-pin
Thin Quad Flat Pack (TQFP)
C
XC9572XV-7VQ44C
7.5 ns
VQ44
44-pin
Quad Flat Pack (VQFP)
C
XC9572XV-7TQ100C
7.5 ns
TQ100
100-pin
Thin Quad Flat Pack (TQFP)
C
XC9572XV-7VQ44I
7.5 ns
VQ44
44-pin
Quad Flat Pack (VQFP)
I
XC9572XV-7TQ100I
7.5 ns
TQ100
100-pin
Thin Quad Flat Pack (TQFP)
I
Device Ordering and
Part Marking Number
Notes:
1. C = Commercial: TA = 0° to +70°C; I = Industrial: TA = –40° to +85°C
2. Some packages available in Pb-free option. See Xilinx Packaging for more information.
8
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DS052 (v3.0) June 25, 2007
Product Specification
R
XC9572XV High-performance CPLD
Revision History
Date
Revision No.
02/01/00
1.1
Initial Xilinx release. Advance information specification.
01/29/01
2.0
Added -4 performance specification and VQ44 pagkage. Deleted VQ64 package.
Updated ICC vs. Frequency Figure 1.
05/15/01
2.1
Updated ICC formula, Recommended Operation Conditions, -4 and -5 AC
Characteristics and Internal Timing Parameters
08/27/01
2.2
Changed VCCIO 3.3V from 3.13 to 3.0 (min), 3.46 to 3.60 (max); DC characteristics: IIL
- added "low" current, IIH - changed to "Input leakage high current"; Internal Timing: -5
TAOI from 6.5 to 5.9.
05/31/02
2.3
Updated ICC equation on page 1. Updated Component Availability Chart. Changed to
Preliminary. Added second test condition and max measurement to IIH DC
Characteristics. Added Part Marking Information to Ordering Information. Removed the
-4 device.
06/18/03
2.4
Updated TSOL from 260 to 220oC. Updated Device Part Marking.
08/21/03
2.5
Updated Package Device Marking Pin 1 orientation.
04/15/05
2.6
Added TAPRPW specification to AC Characteristics. Added IOSTANDARD information.
01/16/06
2.7
Removed PC44 and CS48 packages as per XCN05020.
06/25/07
3.0
Notice of discontinuance.
DS052 (v3.0) June 25, 2007
Product Specification
Description
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9