ACCUTEK AK5816384S

Accutek
Microcircuit
Corporation
AK5816384S / AK5816384G
16,777,216 Word by 8 Bit CMOS
Dynamic Random Access Memory
DESCRIPTION
Front View
The Accutek AK5816384 high density memory module is a CMOS
DRAM organized in 16 Meg x 8 bit words. The assembly consists of
eight 16 Meg x 1 DRAMs in plastic SOJ packages mounted to the
front side of a printed circuit board in 30 pad SIM (leadless) or SIP
(leaded) configuration. The module is only 0.8 inch high (same
height as standard 1 Meg modules), making it ideally suited for applications with low height restrictions.
30-Pin SIM
30
1
30-Pin SIP
The operation of the AK5816384 is identical to eight 16 Meg x 1
DRAMs. The data input is tied to the data output and brought out
separately for each device, with common RAS, CAS and WE control. This common I/O feature dictates the use of early-write cycles
to prevent contention of D and Q. Since the Write-Enable (WE) signal must always go low before CAS in a write cycle, Read-Write and
Read-Modify-Write operation is not possible.
1
FEATURES
· 16,777,216 x 8 bit organization
· Optional 30 Pad leadless SIM (Single In-Line Module) or 30
Pin leaded SIP (Single In-Line Package)
· JEDEC standard pinout
· Each device (data bit) has common DQ lines with common
CAS and RAS controls
· CAS-before-RAS refresh
· Downward compatible with AK584096, AK581024/481024,
AK58256/48256
· TTL-Compatible Inputs and Outputs
· 4096 Cycle Refresh every 64mSEC
· Power:
3.96 Watt Max Active (60 nS)
4.40 Watt Max Active (70 nS)
3.52 Watt Max Active (80 nS)
44 mWatt Max Standby
· Operating free air temperature 0oC to 70oC
· Fast Page Mode
· 9 Bit version (with parity bit) also available
· RAS-Only Refresh
PIN NOMENCLATURE
DQ1 - DQ8
Data In/Data Out
PIN ASSIGNMENT
FUNCTIONAL DIAGRAM
PIN #
SYMBOL
PIN #
SYMBOL
1
Vcc
16
DQ5
2
CAS
17
A8
A0 - A11
Address Inputs
CAS
Column Address Strobe
3
DQ1
18
A9
RAS
Row Address Strobe
4
A0
19
A10
WE
Write Enable
DQ6
Vcc
5
A1
20
6
DQ2
21
WE
5v Supply
7
A2
22
Vss
Vss
Ground
8
A3
23
DQ7
NC
No Connect
MODULE OPTIONS
Leadless SIM: AK5816384S
Leaded SIP: AK5816384G
9
Vss
24
A11
10
DQ3
25
DQ8
11
A4
26
NC
12
A5
27
RAS
13
DQ4
28
NC
14
A6
29
NC
15
A7
30
Vcc
MECHANICAL DIMENSIONS
ORDERING INFORMATION
Inches
PART NUMBER CODING INTERPRETATION
Position
1
2
3
4
5
6
7
8
1
0.815
0.785
0.425
0.375
.100
.060
0.325
0.275
0.815
0.785
0.100
TYP
1
1
0.100
TYP
3.525
3.475
3.100
3.090
0.024
0.016
30
0.200
MAX
0.053
0.047
Product
AK = Accutek Memory
2 Type
4 = Dynamic RAM
5 = CMOS Dynamic RAM
6 = Static RAM
3 Organization/Word Width
1 = by 1 16 = by 16
4 = by 4 32 = by 32
8 = by 8 36 = by 36
9 = by 9
4 Size/Bits Depth
64 = 64K
4096 = 4 MEG
256 = 256K
8192 = 8 MEG
1024 = 1 MEG 16384 = 16 MEG
5 Package Type
G = Single In-Line Package (SIP)
S = Single In-Line Module (SIM)
D = Dual In-Line Package (DIP)
W = .050 inch Pitch Edge Connect
Z = Zig-Zag In-Line Package (ZIP)
6 Special Designation
P = Page Mode
N = Nibble Mode
K = Static Column Mode
W = Write Per Bit Mode
V = Video Ram
7 Separator
- = Commercial 00C to +700C
M = Military Equivalent Screened
(-550C to +1250C)
I = Industrial Temperature Tested
(-450C to +850C)
X = Burned In
8 Speed (first two significant digits)
DRAMS
SRAMS
60 = 60 nS
8 =
8 nS
70 = 70 nS
12 = 12 nS
80 = 80 nS
15 = 15 nS
The numbers and coding on this page do not include all variations available but are shown as examples of the most widely
used variations. Contact Accutek if other information is required.
0.100
TYP
EXAMPLES:
AK5816384SP-70
16 Meg x 8, 70 nSEC, Leadless SIM, Fast Page Mode
AK5816384GP-60
16 Meg x 8, 60 nSEC, Leaded SIP, Fast Page Mode
ACCUTEK MICROCIRCUIT CORPORATION
BUSINESS CENTER at NEWBURYPORT
2 NEW PASTURE ROAD, SUITE 1
NEWBURYPORT, MA 01950-4054
PHONE: 978-465-6200 FAX: 978-462-3396
Email:
[email protected]
Internet: www.accutekmicro.com
Accutek reserves the right to make changes in specifications at any
time and without notice. Accutek does not assume any responsibility for the use of any circuitry described; no circuit patent licenses
are implied. Preliminary data sheets contain minimum and maximum limits based upon design objectives, which are subject to
change upon full characterization over the specific operating conditions.