AMC76386 Dual 450mA LDO REGULATOR www.addmtek.com DESCRIPTION FEATURES The AMC76386 series is a low dropout regulator rated for 450mA output current. Low power consumption and high accuracy is achieved through CMOS technology and internal trimmed reference voltage. The AMC76386 series consists of a high-precision voltage reference, error correction circuit, and a current limit output driver. The fast transient response is an outstanding feature for applications with various loads. 2% internally trimmed output Output current is excess of 450mA Input-Output differential of typ. 360mV at 300mA & low quiescent current of 10µA typical P-MOS output stage with low RdsON. Short circuit protection Internal thermal overload protection Available in SOP-8 package TYPICAL APPLICATION CIRCUIT APPLICATIONS VOUT1 VIN1 2.5V CIN 1µF COUT AMC76386 VIN2 CD ROM, DVD Wireless Communication Systems Digital Camera Battery Powered Applications 4.7µF PACKAGE PIN OUT VOUT2 3.3V VOUT1 GND CIN COUT VIN1 GND 1µF 4.7µF VOUT2 VIN2 GND2 GND 8-Pin Plastic SOP-8 Surface Mount (Top View) TA (OC) -40 to 85 Note: ORDER INFORMATION Plastic SOP-8 DM 8-pin AMC76386-DMF (Lead Free) 1.All surface-mount packages are available in Tape & Reel. Append the letter “T” to part number (i.e. AMC76386DMFT). 2.The letter ”F” is marked for Lead Free process. Copyright © 2006 ADDtek Corp. 1 DD055_A -- JUNE 2006 AMC76386 ABSOLUTE MAXIMUM RATINGS 13V 150OC -65OC to 150OC 260OC Input Voltage, VIN1, VIN2 Maximum Operating Junction Temperature, TJ Storage Temperature Range Lead Temperature (soldering, 10 seconds) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. Package θJA (OC/ W ) DM 165(Note) POWER DISSIPATION TABLE Derating factor (mW/OC ) TA ≤ 25OC TA ≥ 25OC Power rating (mW) 6 TA=70OC Power rating (mW) 757 487 Note: TJ = TA + (PD × θJA) PD: Total Power dissipation. θJA: Thermal resistance from Junction to Ambient. The θJA numbers are guidelines for the thermal performance of the device/PC-board system. All of the above assume no ambient airflow. BLOCK DIAGRAM VIN2 VIN1 Current Limiter Current Limiter VOUT2 VOUT1 VREF VREF GND GND Copyright © 2006 ADDtek Corp. 2 DD055_A -- JUNE 2006 AMC76386 RECOMMENDED OPERATING CONDITIONS Parameter Symbol Input Voltage Load Current (with adequate heat sinking) Input Capacitor (VIN to GND) Output Capacitor with ESR of 10Ω max., (VOUT to GND) Operating ambient temperature range Operating junction temperature Recommended Operating Conditions VIN IO TA TJ Min. Typ. Max. 3.0 5 0.1 1.0 -40 10 450 Units V mA µF µF O C O C 85 125 ELECTRICAL CHARACTERISTICS Unless otherwise specified, VIN = VOUT(TYP) + 1V, IO = 10mA, COUT = 4.7µF, TA=25 OC, and are for DC characteristics only. (Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Parameter Output Voltage Symbol VOUT1 VOUT2 Line Regulation Load regulation Dropout Voltage Ground Pin Current Current Limit Output Voltage Temperature Coefficient Copyright © 2006 ADDtek Corp. VO ∆VOI ∆VOL ∆V IQ ICL Test Conditions AMC76386 Min Typ Max 2.450 2.500 2.550 3.234 3.300 3.366 VIN = (VOUT + 0.5V) to 8V 0.1 0.3 10mA ≤ IO ≤100mA 15 30 10mA ≤ IO ≤ 300mA 45 80 10mA ≤ IO ≤ 450mA 95 140 IO = 100mA 120 180 IO = 300mA 360 540 IO = 450mA 540 810 8 20 IO = 10mA IO = 10mA~450mA VIN = VOUT+ 0.5V IO=100mA, -40OC ≤ TJ ≤ 125OC 3 450 Units V %/V mV mV µA mA ±100 DD055_A ppm/OC -- JUNE 2006 AMC76386 CHARACTERIZATION CURVES Typical Performance Characteristics (VIN=5V，CIN=1µF，COUT=4.7µF，TA=25 OC unless otherwise specified.) Line Regulation Load Regulation 3.5 3.5 VOUT2=3.3V 3.4 VOUT2=3.3V 3.4 3.3 VO (V) VO (V) 3.3 3.2 3.1 3.2 3 3.1 2.9 3 2.8 0 100 200 300 400 3.5 500 4.5 5.5 IO (mA) 8.5 9.5 10.5 3.5 0.6 VOUT2=3.3V 3.4 0.5 Io=10mA 3.3 0.4 VO (V) Dropout voltage (V) 7.5 Output Voltage vs. Temperature Dropout vs. Load Current 0.3 0.2 Io=100mA 3.2 Io=300mA 3.1 Io=450mA 3 0.1 2.9 2.8 0 0 100 200 300 400 -40 -20 500 0 20 40 60 80 100 120 TA (OC) IO (mA) Dropout vs. Temperature Current Limit vs. Supply Voltage 0.50 2 0.45 0.40 Current limit (A) Dropout voltage (V) 6.5 VIN (V) Io=300mA 0.35 0.30 0.25 Io=100mA 0.20 0.15 0.10 1.6 1.2 0.8 0.4 0 4 0.05 -40 -20 0 20 40 60 80 5 6 7 8 9 10 VIN (V) 100 120 TA (OC) Copyright © 2006 ADDtek Corp. 4 DD055_A -- JUNE 2006 AMC76386 CHARACTERIZATION CURVES (Continued) Typical Performance Characteristics VIN= 5V，CIN=1µF，COUT= 4.7µF，TA=25 OC unless otherwise specified. Quiescent Current vs. Temperature Quiescent Current vs. Load 14 IQ(μA) IQ(μA) 12 10 8 6 4 0 100 200 300 400 -40 -20 500 0 20 40 60 80 100 120 TA(OC) IO (mA) Load Transient Regulation Load Transient Regulation IOUT1 IOUT2 VOUT1 VOUT1 VOUT2 VOUT2 Copyright © 2006 ADDtek Corp. 20 18 16 14 12 10 8 6 4 2 0 5 DD055_A -- JUNE 2006 AMC76386 Application Note: The maximum power dissipation of a single-output regulator: PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ VOUT(NOM) = the nominal output voltage IOUT(NOM) = the nominal output current, and IQ = the quiescent current the regulator consumes at IOUT(MAX) VIN(MAX) = the maximum input voltage Thermal consideration: The AMC76386 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load conditions. The thermal protection circuit of AMC76386 series will prevent the device from damage due to excessive power dissipation. When the device temperature rises to approximately 150 OC, the regulator will be turned off. When power consumption is over about 487mW (SOP-8 package, at TA=70 OC), additional heat sink is required to control the junction temperature below 125 OC. The junction temperature is: TJ = PD (θJT + θCS + θSA ) + TA P D: Total Dissipated power. θJT:Thermal resistance from the junction to the mounting tab of the package. θCS:Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically, θCS < 1.0 OC /W) θSA:Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through hole vias. 59 PCB θSA (OC /W ) PCB heat sink size (mm2) 500 45 1000 38 1500 33 2000 27 3000 24 4000 21 5000 Recommended figure of PCB area used as a heat sink. through hole vias (Top View) Copyright © 2006 ADDtek Corp. (Bottom View) 6 DD055_A -- JUNE 2006 AMC76386 PACKAGE 8-Pin Surface Mount SOP-8 MILLIMETERS INCHES MIN TYP MAX MIN TYP MAX A 0.183 - 0.202 4.65 - 5.13 B 0.144 - 0.163 3.66 - 4.14 C 0.068 - 0.074 1.73 - 1.88 D 0.010 - 0.020 0.25 - 0.51 F 0.015 - 0.035 0.38 - 0.89 A B P F D G G J L C SEATING PLAN K Copyright © 2006 ADDtek Corp. M J 7 0.050 BSC 0.007 - 1.27 BSC 0.010 0.19 - 0.25 K 0.005 - 0.010 0.13 - 0.25 L 0.189 - 0.205 4.80 - 5.21 M - - 8º - - 8º P 0.228 - 0.244 5.79 - 6.20 DD055_A -- JUNE 2006 AMC76386 IMPORTANT NOTICE ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer’s applications, the customer should provide adequate design and operating safeguards. ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of its products to the specifications applicable at the time of sale. ADDtek Corp. 9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105 TEL: 2-25700299 FAX: 2-25700196 Copyright © 2006 ADDtek Corp. 8 DD055_A -- JUNE 2006