AMIS-710200:200dpi CIS Module Data Sheet 1.0 General Description The AMIS-710200 (PI200MC-A4) is a contact image sensor (CIS) module. It is a long CIS using MOS image sensor technology for high-speed performance and high sensitivity. The AMIS-710200 is suitable for scanning A4 size (216mm) documents with 8 dots per millimeter (dpm) resolution. Applications include document scanners, mark readers and other office automation equipment. 2.0 Key Features • • • • • • • • • Light source, lens and sensor are integrated into a single module 8dpm resolution, 216mm scanning length 437µsec/line scanning speed @ 4.0MHz clock rate Wide dynamic range Analog output 660 Red LED light source Compact size - 20.5mm x 21.5mm x 232mm Low power Light weight 3.0 Functional Description The AMIS-710200 imaging array consists of 27 sensors, AMIS-720220 (PI3020), produced by AMIS. The sensor is a monolithic chip with an array of 64 photo sensing elements, of which 27 are cascaded to provide 1728 photo-detectors. These cascaded chips are contiguously aligned in a single row and bonded to the printed circuit board (PCB). See Figure 1, AMIS-710200's block diagram. This st configuration allows a stream of sequential video pixels to be read from its output port, for example, starting from the first pixel, 1 , th located next to the connector end of the module and continues to and through the last pixel, 1728 . Each chip contains a complete control circuitry. Integrated within monolithic chip is a set of multiplex switches, and a digital shift register to control the chips sequential readout. Additionally, the chips contain a chip selection switch that is interrogated in a sequence as each predecessor chip completes its scanning process. AMI Semiconductor – May 06, M-8-001 www.amis.com 1 AMIS-710200:200dpi CIS Module Data Sheet Figure 1: AMIS-710200 Block Diagram Figure 2 shows a mechanical cross section of the module's internal structure. Mounted in the module is a number of components. These components function together to provide the module a complete integrated system. The LED light bar illuminates the documents through the window and reflection from the imaged documents is picked up and focused by the one-to-one graded indexed micro lens array. The lens, through the glass window, focuses the scanned images from the document onto the sensing plane of the sensor chips, which is mounted on the PCB. During the imaging process, the document is passed across the glass window's surface. The PCB not only has the sensor chips mounted on it, but it has an on-board amplifier, a clock buffer for both the start pulse (SP), and the module's master clock (CP) buffer. This amplifier processes the pixel charges from the image sensor chips and converts them into voltage signal to produce a sequential stream of video at the output pin of the AMIS-710200 module. All these discussed components are housed in a small plastic housing which has a cover glass, the window. This housing with its sealed windows protects the imaging array, the micro lens assembly and the LED light source from dust. AMI Semiconductor – May 06, M-8-001 www.amis.com 2 AMIS-710200:200dpi CIS Module Data Sheet Figure 2: AMIS-710200 Cross Section 4.0 Pin Out Description There is one connector located at the end of the module. The outline of the module in Figure 4 of the mechanical section illustrates the connector location. With the module window facing down on flat surface, the viewer looking down on backside of the module and with the connector's pins facing the viewer, the connector is located on the left hand end of the module. The connector is a 2.0mm dual 8pin row with a total of 16 pin connector, part # Berg 88054-X16. Its I/O designation is provided in Table 1. Pin number 1’s location is indicated on the module outline. All of the odd pins are on the bottom row with Pin 1 on the edge closest to the end of the module. All of the even pins are on the top row with Pin 2 located adjacent to Pin 1. Table 1:I/O Designation Pin Number 1, 2 , 4, & 8 3 5&6 7 9 & 10 11 & 12 13 & 14 15 & 16 Symbol Gnd Vout Vdd (+5V) SP Vn (-5V to –12V) CP GLED VLED AMI Semiconductor – May 06, M-8-001 www.amis.com Names and Functions Ground; 0V Analog video output Positive power supply Start clock pulse Negative power supply Sampling clock pulse Ground for the light source; 0V Supply for the light source 3 AMIS-710200:200dpi CIS Module Data Sheet 5.0 Absolute Maximum Rating Table 2: Absolute Maximum Rating Parameter Power supply voltage Symbols Vdd Maximum Rating 7.0 Units V Input clock pulse (high level) Idd Vn In VLED ILED Vih 70 -15 20 5.75 600 Vdd mA V mA V mA V Input clock pulse (low level) Vil -0.5 V Maximum Rating 0 to 50 10 to 85 -25 to +85 5 to 95 Units ° C % ° C % Note: These are the absolute maximums and are not to be used in prolonged operation. Table 3: Operating Environment Parameter Operating temperature Operating humidity Storage temperature Storage humidity Symbols Top Hop Tstg Hstg 6.0 Electro-Optical Characteristics (25oC) Table 4: Electro-Optical Characteristics (25°C) Parameter Number of photo detectors Pixel-to-pixel spacing (1) Line scanning rate (2) Clock frequency Bright output voltage (4) Bright output non-uniformity (5) Adjacent pixel non-uniformity (6) Dark non-uniformity (6) Dark output voltage (7) Modulation transfer function Symbol Tint Fclk Up Upadj Ud Vd MTF Parameter 1728 125 437 Units Elements µm µsec 4.0 1.0 <+/-30 <25 <50 <75 >30 MHz Volts % % mV mV % Note @ 4MHz clock frequency Definitions: 1. Tint is the line scanning rate or integration time. Tint is determined by the interval between two start pulses (SP). 2. Fclk is the main clock, CP, frequency. 3. Vpavg = ∑ Vp(n)/1728. 4. Up = [(Vpmax - Vp) / Vp] x 100% or [(Vp - Vpmin) / Vp] x 100%. 5. Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)] x 100%. Upadj is the non-uniformity percentage pixel-to-pixel. 6. Ud = Vdmax –Vdmin Vdmin is the minimum dark output voltage, Vd, with light source off. Vdmax: maximum dark output voltage, Vd, with light source off. Vd is measured between the reset level of the video and the dark video signal level. This fixed offset occurs because of the video line is reset to ground after each pixel and before the following pixel. However, because the video signal is amplified and the offset is adjusted to force the average dark video signal near ground, the average dark video signal is only few millivolts from ground and reset level will be below ground. 7. MTF = [(Vpmax - Vpmin) / (Vpmax + Vpmin)] x 100 [%] is the effective algorithm which is used to make the measurements. V(p)max: maximum output voltage at 4.0lp/mm V(p)min: minimum output voltage at 4.0lp/mm. 8. lp / mm: line pair per mm. AMI Semiconductor – May 06, M-8-001 www.amis.com 4 AMIS-710200:200dpi CIS Module Data Sheet 7.0 Recommended Operating Conditions o Table 5: Recommended Operating Conditions (25 C) Item Symbol Power supply Vdd Vn. VLED Idd Ivn ILED Input voltage at digital high Vih Input voltage at digital low Vil Clock frequency Fclk Clock pulse high duty cycle Dclk Clock pulse high duration CPH Integration time Tint Operating temperature Top Min. 4.5 -4.5 4.5 42 5.0 300 Vdd-1.0 0 Mean 5.0 -5 5 50 4.0 Max. 5.5 -12 5.5 55 6.0 550 Vdd 0.8 5.0 25 5.0 50 450 Vdd-.5 25 (3) 50 0.347 Units V V V ma ma ma V V MHz % ns ms 0 C 8.0 Switching Characteristics (25°C) Figure 3: AMIS-710200 Timing Diagram Each of the switch timing characteristics for the I/O clocks is defined in symbolic acronyms. There is a corresponding clock switching time for each symbol on the timing diagram. The corresponding time for each symbol is given in the following Table 6. AMI Semiconductor – May 06, M-8-001 www.amis.com 5 AMIS-710200:200dpi CIS Module Table 6: Symbol Definitions for the Above Timing Diagram Item Symbol Clock cycle time to Clock pulse width tw Clock duty cycle Prohibit crossing time of SP tprh Data setup time tds Data hold time tdh Signal delay time tdl Signal settling time tsh Min. 0.20 50 25 15 10 35 20 90 Data Sheet Mean Max. 2.0 75 Units µs ns % ns ns ns ns ns 9.0 Mechanical Description Figure 4 is an overview drawing of the module with approximate dimensions. If a detailed drawing is desired, especially for a design in application, a full size drawing is available upon request. Figure 4: AMIS-710200 Module Outline AMI Semiconductor – May 06, M-8-001 www.amis.com 6 AMIS-710200:200dpi CIS Module Data Sheet 10.0 Company or Product Inquiries For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com North America Tel: +1.208.233.4690 Fax: +1.208.234.6795 Europe Tel: +32 (0) 55.33.22.11 Fax: +32 (0) 55.31.81.12 Production Technical Data - The information contained in this document applies to a product in production. AMI Semiconductor and its subsidiaries (“AMIS”) have made every effort to ensure that the information is accurate and reliable. However, the characteristics and specifications of the product are subject to change without notice and the information is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify that data being relied on is the most current and complete. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. Products sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no other warranty, express or implied, and disclaims the warranties of noninfringement, merchantability, or fitness for a particular purpose. AMI Semiconductor's products are intended for use in ordinary commercial applications. These products are not designed, authorized, or warranted to be suitable for use in life-support systems or other critical applications where malfunction may cause personal injury. Inclusion of AMIS products in such applications is understood to be fully at the customer’s risk. Applications requiring extended temperature range, operation in unusual environmental conditions, or high reliability, such as military or medical life-support, are specifically not recommended without additional processing by AMIS for such applications. Copyright © 2006 AMI Semiconductor, Inc. AMI Semiconductor – May 06, M-8-001 www.amis.com 7