™ Peripheral Imaging Corporation PI200MC-A4 200DPI CIS Module Engineering Data Sheet Key Features • Light source, lens, and sensor are integrated into a single module • 8 dpm resolution, 216 mm scanning length • 437m sec/line scanning speed @ 4.0MHz clock rate • Wide dynamic range • Analog output • 660 Red LED light source • Compact size - 20.5 mm x 21.5 mm x 232 mm • Low power • Light weight General Description The PI200M-A4 is a CIS module. It is a long contact image sensor, using MOS image sensor technology for high-speed performance and high sensitivity. The PI200M-A4 is suitable for scanning A4 size (216 mm) documents with 8 dots per millimeter resolution. Applications include document scanners, mark readers, and other office automation equipment. Functional Description The PI200M-A4 imaging array consists of 27 sensors, PI3020 produced by Peripheral Imaging Corp. The sensor is a monolithic chip with an array of 64 photo sensing elements, of which 27 are cascaded to provide 1728 photo-detectors. These cascaded chips are contiguously aligned in a single row and bonded to PCB. See Figure 1, PI200M-A4's PAGE 1 OF 7 - PI200M-A4, 01/31/01 Block Diagram. This configuration allows a stream of sequential video pixels to be read from its output port, i.e., starting from 1st pixel located next to the connector end of the module and continues to and through the last pixel, 1728th. Each chip contains a complete control circuitry. Integrated within monolithic chip is a set of multiplex switches, and a digital shift register to control the chips sequential readout. Additionally, the chips contain a chip selection switch that is interrogated in a sequence as each predecessor chip completes its scanning process. GLED LED LED LED LED LED LED LED LED VLED ROD LENS 1726 PHOTO SENSORS 1 2 3 4 5 1727 1728 ---------------- VIDEO LINE VN(-V) VDD (+5) SHIFT REGISTER GRD BUFFER CP VIDEO AMPLIFIER SP VOUT GRD Figure 1. PI200M-A4 Block Diagram Figure 2, PI200M-A4's Cross Section, shows a mechanical cross section of the module's internal structure. Mounted in the module is number of components. These components function together to provide the module a complete integrated system. The LED light bar illuminates the documents through the window and reflection from the imaged documents is pickup and focused by the one-to-one graded indexed micro lens array. The lens, through the glass window, focuses the scanned images from the document onto the sensing plane of the sensor chips, which is mounted on the PCB. During the imaging process, the document is passed across the glass window's surface. The PCB board not only has the sensor chips mounted on it, but it has an on-board amplifier, a clock buffer for both the Start Pulse, SP, and the module's master clock, CP, buffer. This amplifier processes the pixel charges from the image sensor chips and converts them into voltage signal to produce a sequential stream of video at the output pin of the PI200M-A4 module. PAGE 2 OF 7 - PI200M-A4, 01/31/01 All these discussed components are housed in a small plastic housing which has a cover glass, the window. This housing with its sealed windows protects the imaging array, the micro lens assembly, and the LED light source from dust. DOCUMENT SURFACE GLASS WINDOW ROD LENS MODULE HOUSE LIGHT PATH D LE R BA SENSORS PCB INSIDE PICTORIAL OF MODULE Figure 2. PI200M-A4 Cross Section Pin Out Description There is one connector located at the end of the module. The outline of the module in Figure 4 of the mechanical section illustrates the connector location. With the module window facing down on flat surface, with the viewer looking down on backside of the module, and with the connector's pins facing viewer, the connectors is located on the left hand end of the module. The connector is a 2.0mm dual 8-pin rows with a total of 16 pin connector, part # Berg 88054-X16. Its I/O designation is provided in Table 1. I/O Designation. Pin number 1 location is indicated on the module outline. All of the odd pins are on the bottom row with pin number one on the edge closest to end of module. All of even pins are on the top row with pin 2 located adjacent to the pin 1. Pin Number 1, 2 , 4 & 8 3 5&6 7 9 &10 11 & 12 13 & 14 15 & 16 Symbol Gnd Vout Vdd (+5V) SP Vn (-5V to –12V) CP GLED VLED Names and Functions Ground; 0V Analog Video Output Positive power supply Start Clock Pulse Negative power supply Sampling clock pulse Ground for the light source; 0V Supply for the light source Table 1. I/O Designation PAGE 3 OF 7 - PI200M-A4, 01/31/01 Absolute Maximum Rating: Parameter Power supply voltage Symbols Vdd Idd Vn In VLED ILED Input clock pulse (high level) Vih Input clock pulse (low level) Vil Maximum Rating 7.0 70 -15 20 5.75 600 Vdd -0.5 Units V mA V mA V mA V V Table 2. Absolute Maximum Rating Note, these are the absolute maximums and are not to be used in prolonged operation. Operating Environment Operating temperature Operating humidity Storage temperature Storage humidity Top Hop Tstg Hstg 0 0 to 50 10 to 85 -25 to+85 5 to 95 C % 0 C % Table 3. Operating Environment Electro-Optical Characteristics (25° C) Parameter Symbol Number of photo detectors Pixel to pixel spacing Line scanning rate(1) Tint Parameter 1728 125 437 Units elements µm µsec Clock frequency(2) Bright output voltage Bright output(4) nonuniformity Adjacent pixel(5) nonuniformity Dark nonuniformity(6) Dark output voltage(6) Modulation transfer function(7) Up 4.0 1.0 <+/-30 MHz Volts % Upadj <25 % Ud Vd MTF <50 <75 >30 mV mV % Fclk Table 4. Electro-optical characteristics at 25° C. PAGE 4 OF 7 - PI200M-A4, 01/31/01 Note @ 4MHz clock frequency Definition: (1) Tint is the line scanning rate or integration time. Tint is determined by the interval between two start pulses (SP). (2) Fclk is the main clock, CP, frequency. (3) Vpavg = å Vp(n)/1728 (4) Up = [(Vpmax - Vp) / Vp] x 100% or [(Vp - Vpmin) / Vp] x 100% (5) Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)] x 100% Upadj is the nonuniformity percentage pixel to pixel (6) Ud = Vdmax -Vdmin Vdmin is the minimum dark output voltage, Vd, with light source off. Vdmax: maximum dark output voltage, Vd, with light source off. Vd is measured between the reset level of the video and the dark video signal level. This fixed offset occurs because of the video line is reset to ground after each pixel and before the following pixel. However, because the video signal is amplified and the offset is adjusted to force the average dark video signal near ground, the average dark video signal is only few millivolts from ground and reset level will be below ground. (7) MTF = [(Vpmax - Vpmin) / (Vpmax + Vpmin)] x 100 [%] is the effective algorithm which is used to make the measurements. V(p)max: maximum output voltage at 4.0 lp/mm V(p)min: minimum output voltage at 4.0 lp/mm (8) lp / mm: line pair per mm Recommended Operating Conditions (25 °C) Item Power Supply Input voltage at digital high Input voltage at digital low Clock frequency Clock pulse high duty cycle Clock pulse high duration Integration time Operating temperature Symbol Vdd Vn. VLED Idd Ivn ILED Vih Vil Fclk Dclk CPH Tint Top Min 4.5 -4.5 4.5 42 5.0 300 Vdd-1.0 0 Mean 5.0 -5 5 50 4.0 Max 5.5 -12 5.5 55 6.0 550 Vdd 0.8 5.0 25 5.0 50 450 Vdd-.5 25 50(3) 0.347 Table 5. Recommended Operating Conditions (25 °C) PAGE 5 OF 7 - PI200M-A4, 01/31/01 Units V V V ma ma ma V V MHz % ns ms 0 C Switching Characteristics (25°C) to tw CP tprh tdh SP tds tdl Vout tsh MODULE TIMING DIAGRAM Figure 3. PI200M-A4 Timing Diagram Each switch timing characteristics for the I/O clocks are defined in symbolic acronyms. There is a corresponding clock's switching times for each symbol on the timing diagram. These corresponding times for each symbol is given in the following Table 6. Item Clock cycle time Clock pulse width Clock duty cycle Prohibit crossing time of Start Pulse Data setup time Data hold time Signal delay time Signal settling time Symbol to tw tprh Min. 0.20 50 25 15 tds tdh tdl tsh 10 35 20 90 Mean Max. 2.0 75 Table 6. Symbol Definitions for the Above Timing Diagram PAGE 6 OF 7 PI200M-A4, 01/31/01 Units m s ns % ns ns ns ns ns Mechanical Description Figure 4 is an overview drawing of the module with approximate dimensions. If a detailed drawing is desired, especially for a design in application, a full size drawing is available upon request. SC .5 82 23 82 D AN E IR CT IO N 2 .5 END VIEW ø1.65± HOLE 21.5 SIDE TAPE 1X1-M2 TAPSIZE USE (DP6) AD 11.5 ±0.2 RE LIN 1 20.25±0.2 PIN 6.0 E ø2.2±0.05 HOLE 2X2-M2.6 TAPSIZE USE (DP6) 7.1±0.2 15.5±0.2 THE SURFACE OF THE GLASS 16.2±0.2 1.25 ALL DIMENSIONS IN MM UNLESS SPECIFIED Figure 4. PI200M-A4 Module Outline Printed in USA. All rights reserved. Specifications ©2001 AMI Semiconductor. are subject to change without notice. Contents may not be reproduced in whole or in part without the express prior written permission of AMIS. Information furnished herein is believed to be accurate and reliable. However, no responsibility is assumed by AMIS for its use nor for any infringement of patents or other rights granted by implication or otherwise under any patent or patent rights of AMIS. PAGE 7 OF 7 - PI200M-A4, 01/31/01