data sheet CERAMIC / HERMETIC CQFP Ceramic Quad Flat Pack Package (CQFP) Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CQFP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. The ceramic / LF / ceramic system is held together hermetically by glass. The frit lid is sealed/reflowed over the package cavity at temperatures between 400° - 460° Centigrade. Features: The CQFP offers a variety of features: • Square package body • 14-256 lead count, 25-50 mil lead pitch's • Hermetic package • High thermal conductive ceramic • Solder Plate lead finish • JEDEC standard compliant • Wide selection of available cavity sizes to meet most die size needs • Commercial or full Military flows Applications: Along with the other standard industry packages, the CQFP has a proven track record and is still being used by semiconductor technologies such as: Digital to Analog converters, Microwave, Logic, Memory, Microcontrollers, and Video controllers. Some end applications are: Military electronics, Commercial electronics, Automotive and Telecommunications. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS806 Rev Date: 08’02