25 Watts, 50 Ω General Specifications Resistive Element: Substrate: Terminals: Thick film Aluminum nitride ceramic Tin/Lead, 90/10 over nickel Electrical Specifications Resistance Value: Frequency Range: Power: V.S.W.R.: Features • DC – 3.0 GHz • 25 Watts Aluminum Nitride SMD Terminations Model RFP-250375N4Z50-2 Aluminum Nitride Terminations 50 ohms, ±2% DC - 3.0 GHz 25 Watts 1.25:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +125°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. • Aluminum Nitride (AlN) Ceramic • Surface Mountable • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Outline Drawing .250 RFP 250375 N4ZXXX .040 DENOTES LOCATION OF RF PAD ON BACKSIDE OF CHIP Note: XXX denotes value. BACK VIEW TOP VIEW SIDE VIEW .375 .060 .060 .058 .135 .058 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING .135 VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Aluminum Nitride SMD Terminations Model RFP-250375N4Z50-2 Typical Performance Suggested Mounting Procedures Power Derating SCREW (2 PLS.) % OF RATED POWER 100 SOLDER PASTE 75 50 PC BOARD HEATSINK SOLDER FILLED VIA 25 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). 0 25 50 75 100 125 P.C.B. SOLDER INTERFACE TEMPERATURE — °C 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. Available on Tape and Reel for Pick and Place Manufacturing. 2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369