ANPEC APL1117D-33VC-TU

APL1117D/R
1A, Low Dropout Fast Response Positive Regulator Fixed 3.3V and 5.0V
Features
General Description
•
•
•
The APL1117D/R is a low dropout three-terminal fixed
3.3V and 5.0V regulators with 1A output current
capability. In order to obtain lower dropout voltage
and faster transient response, which is critical for
low voltage applications , the APL1117D/R has been
optimized. The dropout voltage is guaranteed at a
maximum of 1.3V at 0.8A. Current limit is trimmed to
ensure specified output current and controlled shortcircuit current. On-chip thermal limiting provides protection against any combination of overload that would
create excessive junction temperatures. The
APL1117D/R is available in the industry standard 3pin SOT-223 and TO-252 the low profile surface mount
packages which can be used in applications where
space is limited.
Guaranteed Output Voltage Accuracy within 2%
Fast Transient Response
Guaranteed Dropout Voltage at Multiple Currents
•
•
•
•
•
•
Load Regulation : 0.1% Typ.
Line Regulation : 0.03% Typ.
Low Dropout Voltage : 1.2V Typ. at IOUT =0.8A
Current Limit : 1A Typ. at TJ=125 °C
On-Chip Thermal Limiting : 150 °C Typ.
Standard 3-pin SOT-223 and TO-252 Power
Packages
Pin Description
Applications
•
•
•
•
Front View for SOT-223
Active SCSI Terminators
Low Voltage Logic Supplies
Battery-Powered Circuitry
1
2
3
Post Regulator for Switching Power Supply
APL1117D
APL1117R
GND VOUT VIN
VIN GND VOUT
Front View for TO-252
1
APL1117D
APL1117R
2
3
GND VOUT VIN
VIN GND VOUT
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
1
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APL1117D/R
Ordering and Marking Information
Package Code
U : T O -2 5 2
V : S O T -2 2 3
Tem p. R ange
C : 0 to 7 0 ° C
H a n d lin g C o d e
TU : Tube
TR : Tape & Reel
V o lta g e C o d e
3 3 : 3 .3 V
5 0 : 5 .0 V
L e a d F re e C o d e
L : L e a d F re e D e v ic e
B la n k : O rig in a l D e v ic e
A P L 1 1 1 7 D /R L e a d F re e C o d e
H a n d lin g C o d e
Tem p. R ange
Package Code
V o lta g e C o d e
A P L 1 1 1 7 D /R -3 3 U :
33
A P L 1 1 1 7 D /R
XXXXX
XXXXX
- D a te C o d e
A P L 1 1 1 7 D /R -3 3 U :
A P L 1 1 1 7 D /R
XXXXX33
X X X X X - D a te C o d e
XXXXX
- D a te C o d e
A P L 1 1 1 7 D /R -5 0 U :
A P L 1 1 1 7 D /R
XXXXX50
X X X X X - D a te C o d e
50
A P L 1 1 1 7 D /R -5 0 U :
A P L 1 1 1 7 D /R
XXXXX
Absolute Maximum Ratings
Symbol
VI
TJ
Parameter
Rating
Unit
13.2
V
°C
TSTG
Input Voltage
Operating Junction Temperature Range
Control Section
Power Transistor
Storage Temperature Range
0 to 125
0 to 150
-65 to +150
°C
TL
Lead Temperature (Soldering, 10 second)
260
°C
Electrical Characteristics
Symbol
V OUT
REG LINE
REG LOAD
VD
I LIMT
PSRR
TR
TS
LS
Parameter
Test Conditions
APL1117D/R-33 T J =0~125°C,
APL1117D/R-50 0≤I OUT ≤0.8A, 4.75V≤V IN ≤12V
Line Regulation
T J =0~125°C,
I OUT =0.8A, 4.75V≤V IN ≤7.75V (Note1)
Load Regulation
T J =0~125°C,
V IN =4.75A, 0V≤I OUT ≤0.8A (Note1)
APL1117D/R
Unit
Min. Typ. Max.
3.235 3.300 3.365
V
4.900 5.000 5.100
1
6
mV
1
10
mV
1.3
V
Dropout Voltage
I OUT ≤0.8A,T J =0~125°C
1.2
Current Lim it
(V IN -V OUT )=5V, T J =25°C
1
A
Ripple Rejection
F RIPPLE =120Hz, V RIPPLE =1 VP-P
(V IN -V OUT )=3V,T J =0~125°C
75
dB
0.01
%/W
0.5
%
0.3
%
Thermal Regulation T J =25°C, 30ms Pulse
Temperature
Stability
Long -Term
Stability
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
T J =125°C, 1000Hrs
2
60
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APL1117D/R
Electrical Characteristics
Symbol
Parameter
Test Conditions
VN
RMS Output Noise
θ th
Thermal Resistance Junction to Case, at Tab
Junction to ambient
Over Temperature
Point
Quiescent Current
T J=0~125°C,
V IN ≤12V
OT
APL1117D/R
Unit
Min. Typ. Max.
T J=25°C,10Hz≤F≤10kHz, (% of V OUT )
0.003
%
15
50
°C/ W
150
°C
5.5
10
mA
Note 1: See thermal regulation specifications for changes in output voltage due to heating effects. Load line regulations are measured at a constant junction temperature by low duty cycle pulse testing.
Note 2: Dropout voltage is specified over the full output current range of the device. Dropout voltage is defined as the minimum input/
output differential measured at the specified output current. Test points and limits are also shown on the Dropout Voltage curve.
Note 3: Minimum load current is defined as the minimum output current required to maintain regulation.
Application Schematic
APL1117D/R
VIN=5~12V
+ CIN
10uF
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
3
VOUT
+ COUT1
+ COUT2
0.1uF
10uF
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APL1117D/R
Typical Characteristics
Input Current vs. Temperature
Current Limit vs. Temperature
V out=3.3V
8
7
1.2
6
Current Limit (mA)
Input Current (mA)
V out=3.3V
1.3
5
4
3
1.1
1
Vin-Vout=5V
0.9
0.8
2
-5 0
-2 5
0
25
50
75
1 00
0.7
-50
1 25
-30
-10
10
Temperature (°C)
50
70
90
110
130
150
Temperature (°C)
Load Transient Response
Line Transient Response
V out=3.3V
5
30
V out=3.3V
0.02
6
0.15
3.5
3
0
2.5
CIN=10uF
Cout=10uF Tantalum
V IN=5V
2
1.5
-0.01
1
-0.02
5
0.1
Input Voltage (V)
0.01
Output Voltage Deviation (V)
Output Current (A)
4
4
CIN=10uF
Cout=10uF Tantalum
IOUT=0.1A
3
0.05
2
0
1
Output Voltage Deviation (V)
4.5
0.5
0
-100
100
200
300
400
500
600
700
800
900
-20
30
80
130
180
Time (µs)
Time (µs)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
-0.05
0
-0.03
0
4
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APL1117D/R
Typical Characteristics
Output Voltage vs. Input Voltage
Dropout Voltage vs. Output Current
V out=3.3V
1.3
1.25
3
1.2
Outputt Voltage (V)
Dropout Voltage (V)
V out=3.3V
3.5
1.15
1.1
1.05
1
2.5
2
1.5
1
0.5
0.95
0.9
0
0
0.2
0.4
0.6
0.8
1
0
1
2
3
Output Current (A)
5
6
7
8
9
Iutput Voltage (V)
Input Current vs. Input Voltage
Current Limit vs. Input Voltage
V out=3.3V
6
V out=3.3V
1.12
5
1.1
Current Limit (A)
Input Current (mA)
4
4
3
2
1.08
1.06
1.04
1.02
1
1
0
0
2
4
6
8
4
10
Input Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
5
6
7
8
9
10
11
12
13
Input Voltage (V)
5
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APL1117D/R
Typical Characteristics Cont.
Output Voltage vs. Temperature
V out=3.3V
3.6
Output Voltage (V)
3.5
3.4
3.3
3.2
3.1
3
-50
-25
0
25
50
75
100
125
Temperature (°C)
Copyright  ANPEC Electronics Corp.
6 - Jun., 2003
Rev. A.3
6
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APL1117D/R
Package Information
SOT-223( Reference JEDEC Registration SOT-223)
D
A
B1
a
c
H
E
L
K
e
A1
e1
b
B
Dim
A
A1
B
B1
c
D
E
e
e1
H
L
K
α
β
Millimeters
Min.
1.50
0.02
0.60
2.90
0.28
6.30
3.30
Inches
Max.
1.80
0.08
0.80
3.10
0.32
6.70
3.70
Min.
0.06
Max.
0.07
0.02
0.11
0.01
0.25
0.13
0.03
0.12
0.01
0.26
0.15
2.3 BSC
4.6 BSC
6.70
0.91
1.50
0°
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
0.09 BSC
0.18 BSC
7.30
1.10
2.00
10°
0.26
0.04
0.06
0°
13°
0.29
0.04
0.08
10°
13°
7
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APL1117D/R
Package Informaion
TO-252( Reference JEDEC Registration TO-252)
E
A
b2
C1
L2
D
H
L1
L
b
C
e1
D1
A1
E1
Dim
M illim et er s
Inc he s
M in.
M ax.
M in.
M ax.
A
2. 1 8
2. 3 9
0. 0 86
0. 0 94
A1
0. 8 9
1. 2 7
0. 0 35
0. 0 50
b
0. 5 08
0. 8 9
0. 0 20
0. 0 35
b2
5. 2 07
5. 4 61
0. 2 05
0. 2 15
C
0. 4 6
0. 5 8
0. 0 18
0. 0 23
C1
0. 4 6
0. 5 8
0. 0 18
0. 0 23
D
5. 3 34
6. 2 2
0. 2 10
0. 2 45
D1
E
5. 2 R EF
6. 3 5
E1
0. 2 05 R EF
6. 7 3
0. 2 50
5. 3 R EF
0. 2 65
0. 2 09 R EF
e1
3. 9 6
5. 1 8
H
9. 3 98
10 . 41
L
0. 5 1
L1
0. 6 4
1. 0 2
0. 0 25
0. 0 40
L2
0. 8 9
2. 0 32
0. 0 35
0. 0 80
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
0. 1 56
0. 2 04
0. 3 70
0. 4 10
0. 0 20
8
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APL1117D/R
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
C ritical Zone
T L to T P
T e m p e ra tu re
R am p-up
TL
tL
T sm ax
T sm in
R am p-down
ts
Preheat
25
t 25 °C to Peak
T im e
Classificatin Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Large Body
Small Body
Average ramp-up rate
3°C/second max.
(TL to TP)
Preheat
- Temperature Min (Tsmin)
100°C
- Temperature Mix (Tsmax)
150°C
- Time (min to max)(ts)
60-120 seconds
Tsmax to TL
- Ramp-up Rate
Tsmax to TL
- Temperature(TL)
183°C
- Time (tL)
60-150 seconds
Peak Temperature(Tp)
225 +0/-5°C
240 +0/-5°C
Time within 5°C of actual Peak
10-30 seconds
10-30 seconds
Temperature(tp)
Ramp-down Rate
6°C/second max.
6 minutes max.
Time 25°C to Peak Temperature
Pb-Free Assembly
Large Body
Small Body
3°C/second max.
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
250 +0/-5°C
10-30 seconds
20-40 seconds
6°C/second max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
9
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APL1117D/R
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Carrier Tape
t
D
P
Po
E
P1
Bo
F
W
Ko
Ao
D1
T2
J
C
A
B
T1
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
10
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APL1117D/R
Carrier Tape
Application
A
B
C
J
2.5± 0.5
Po
T1
16.4 +0.3
-0.2
P1
TO-252
330±3
100 ± 2
13 ± 0. 5
2 ± 0.5
Application
F
D
D1
TO-252
7.5 ± 0.1
1.5± 0.1
Application
A
B
1.5+ 0.25
4.0 ± 0.1
SOT-223
330±1
62±1.5
Application
F
D
C
12.75±
0.15
D1
SOT-223
5.5 ± 0.05
1.5+ 0.1
1.5+ 0.1
T2
P
E
8 ± 0.1
1.75± 0.1
Ao
W
16 + 0.3
16 - 0.1
Bo
Ko
t
2.0 ± 0.1
6.8 ± 0.1
10.4± 0.1
2.5± 0.1
0.3±0.05
J
T1
T2
P
E
2 ± 0.6
12.4 +0.2
2± 0.2
W
12 ± 0.3
8 ± 0.1
1.75± 0.1
Po
P1
Ao
4.0 ± 0.1 2.0 ± 0.05 6.9 ± 0.1
Bo
Ko
t
7.5± 0.1
2.1± 0.1
0.3±0.05
(mm)
Cover Tape Dimensions
Application
SOT- 223
TO- 252
Carrier Width
12
16
Cover Tape Width
9.3
13.3
Devices Per Reel
2500
2500
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2003
11
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