ANPEC APW7066RC-TU

APW7066
Dual Synchronous Buck PWM Controllers and One Linear Controller
Features
General Description
•
The APW7066 has two synchronous buck PWM
controllers and one linear controller with high
precision internal references voltage to offer accurate
outputs. The PWM controllers are designed to drive
two N-channel MOSFETs in synchronous buck
topology, and the linear controller drives an external
N-channel MOSFET. The device requires 12V and 5V
power supplies, if the 5V supply is not available,
VCC12 can offer an optional shunt regulator 5.8V for
5V supply.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Two Synchronous Buck Converters and
a Linear Regulator
VIN range up to 12V
Input Power Supplies Require 12V and 5V or
use 12V to generate a Shunt Regulator 5.8V
0.6V Reference for VOUT1 and VOUT3
with 0.8% accurate
3.3V Reference for VOUT2 with 0.8% accurate
Buffered VTT Reference Output
Three Outputs have Independent Soft-Start
and Enable
Internal 300kHz Oscillator and Programmable
Frequency range from 70 kHz to 800kHz
Synchronous Switching Frequency
DDR mode or Independent Mode Selection
Phase Shift Selection
Power Good Function
Short-Circuit Protection for VOUT1 and VOUT2
Thermally Enhanced TSSOP-24 and QFN-32
Package
Lead Free Available (RoHS Compliant)
All outputs have independent soft-start and enable
functions by SS/EN pins to control. Connect a capacitor
from each SS/EN pin to the ground for setting the
soft-start time, and pulling the SS/EN pin below 1V to
disable regulator. Pull the SS2/EN2 to VCC, enter the
DDR mode, the SS1/EN1 controls both VOUT1 and
VOUT2, and allows VOUT2 to track VOUT1. It also
offers the phase shift function by REFOUT pin to
select the phase shift between VOUT1 and VOUT2 in
DDR mode or Independent mode. When all SS/EN
pins exceed 3.3V and no faults are detected, the
PGOOD pin goes high to indicate the regulators are
ready. If any of the SS/EN pins goes below 3.2V or
any of the outputs has a fault condition, the PGOOD
pin will be pulled low.
Applications
•
•
•
Graphic Cards
DDR memory Power Supplies
Low-Voltage Distributed Power Supplies
The internal oscillator is nominally 300kHz (keep the
FS/SYNC pin open or short to GND), and it offers the
programmable frequency function from 70kHz to
800kHz; connecting a resistor from FS/SYNC to VCC
to decrease the frequency, conversely, connect a
resistor from FS/SYNC to GND to increase the frequency.
The IC also provides the synchronous frequency function.
Connect the LGATE signal of another converter to
FS/SYNC pin; forcing the switching frequency to follow
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
1
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APW7066
General Description (Cont.)
NC
BOOT1
NC
VCC
FB1
COMP1
32
FB2
Pin Description
COMP2
the external clock. The possible synchronous frequency
is from 150kHz to 800kHz. There is no Rds(on)
sensing or under-voltage sensing on APW7066.
However, it provides a simple short-circuit protection
by monitoring the COMP1 and COMP2 for over-voltage.
When any of two pins exceeds their trip point and the
condition persists for 1-2 internal clock cycle (3-6us
at 300kHz), then it will shut down all regulators.
25
1
VCC
BOOT1
UGATE1
PGND_1
VCC12_1
REFOUT
VCC12
LGATE1
19 LGATE2
18 PGND
17 UGATE2
16 BOOT2
GND
BOTTOM
SIDE PAD
SS1/EN1
SS2/EN2
LGATE1
LGATE2
SS3/EN3
VCC12_2
VREF
15 GND
14 PGOOD
13 FS/SYNC
PGND_2
DRIVE3
NC
8
BOOT2
NC
UGATE2
GND
9
TSSOP-24
TOP VIEW
PGOOD
17
FS/SYNC
GND
BOTTOM
SIDE
PAD
NC
NC
6
7
SS2/EN2 8
SS3/EN3 9
VREF 10
DRIVE3 11
FB3 12
24
23
22
21
20
UGATE1
FB3
FB1 1
2
3
4
5
COMP1
COMP2
FB2
REFIN
REFOUT
SS1/EN1
24
REFIN
16
32 LD 5x5 QFN32
Top View
Ordering and Marking Information
APW7066
Pa c k a g e C o d e
R : TSSOP-P *
QA : Q F N - 3 2
Operating Ambient Temp. Range
C : 0 to 70 ° C
Handling Code
TU : Tube
TR : Tape & Reel
TY : T r a y ( f o r Q F N o n l y )
Lead Free Code
L : Lead Free Device
Blank : Original Device
Lead Free Code
Handling Code
Temp. Range
Pa c k a g e C o d e
A PW7066 R :
A PW7066 QA :
A PW 7 0 6 6
XXXXX
XXXXX - Date Code
XXXXX - Date Code
A PW 7 0 6 6
XXXXX
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate
termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering
operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C
for MSL classification at lead-free peak reflow temperature.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
2
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APW7066
Block Diagram
VCC
VREF
VCC12
5.8V
30uA
Power On Reset and
Control
SS1/EN1
BOOT1
30uA
3.3V
Bias
Current
SS2/EN2
0.6V
3.3V
Gate
Control
Logic 1
UGATE1
30uA
LGATE1
SS3/EN3
3.3V
BOOT2
Gate
Control
Logic 2
UGATE2
Oscillator
LGATE2
PGOOD
Monitor COMP Pins
for Short Protection
FS/SYNC
COMP1
0.6V
3.3V
1-2 Clock
Cycle Filter
FB1
REFOUT
If short, Filter shut
down all outputs
REFIN
VCC12
FB3
FB2
0.6V
COMP2
DRIVE3
GND
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
PGND
3
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APW7066
Absolute Maximum Ratings
Symbol
VCC12
Parameter
Rating
Unit
-0.3 to 15
V
-0.3 to 5.5
V
-0.3 to 6
V
VCC12 to GND
VCC, separate supply VCC, separate supply
VCC, shunt regulator VCC, shunt regulator to GND
UGATE1, UGATE2,
BOOT1, BOOT2
UGATE1, UGATE2, BOOT1, BOOT2 to GND
-0.3 to 30
V
LGATE1, LGATE2,
DRIVE3
LGATE1, LGATE2, DRIVE3 to GND
-0.3 to 15
V
FS/SYNC to GND
-0.3 to 15
V
FS/SYNC
REFIN, REFOUT,
PGOOD, VREF
REFIN, REFOUT, PGOOD, VREF to GND
-0.3 to VCC
V
FB1, COMP1, FB2,
COMP2, FB3
FB1, COMP1, FB2, COMP2, FB3 to GND
-0.3 to VCC
V
SS1/EN1, SS2/EN2,
SS3/EN3
SS1/EN, SS2/EN2, SS3/EN3 to GND
-0.3 to VCC
V
PGND to GND
-0.3 to +0.3
V
0 to +70
°C
+150
°C
-65 to +150
°C
260
°C
PGND
TA
Operating Temperature Range
TJ
Maximum Junction Temperature
TSTG
TL
Storage Temperature Range
Lead Temperature (Soldering, 10sec)
Electrical Characteristics
Operating Conditions: VCC = 5V, VCC12 = 12V, TA = 0 to 70°C, Unless Otherwise Specified.
Parameter
INPUT SUPPLY POWER
Input Supply Current
(Quiescent)
Test Conditions
Typ.
Max.
Units
VCC; outputs disabled
4
mA
VCC12; outputs disabled
6
mA
50
mA
7
mA
VCC12; UGATEs, LGATEs CL = 1nF,
300KHz
Input Supply Current (Dynamic)
VCC; UGATEs, LGATEs CL = 1nF,
300KHz
20mA current; ~Equivalent to 300Ω
Shunt Regulator Output Voltage
resistor VCC to 12V
Shunt Regulator Current
300Ω resistor VCC to 12V
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
Min.
4
5.6
5.8
6.0
V
20
60
mA
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APW7066
Electrical Characteristics (Cont.)
Operating Conditions: VCC = 5V, VCC12 = 12V, TA = 0 to 70°C, Unless Otherwise Specified.
Parameter
Test Conditions
Min.
Typ.
VCC Rising
4.15
VCC Falling
VCC12 Rising
VCC12 Falling
3.9
7.55
7.1
Max.
Units
4.23
4.4
V
4.0
7.8
7.3
4.15
8
7.55
V
V
V
INPUT SUPPLY POWER
Power-On Reset Threshold
SYSTEM ACCURACY
Outputs 1 and 3 Reference
Voltage
Output 2 Reference Voltage
Outputs 1 and 2 System Accuracy
Output 3 System Accuracy
OSCILLATOR
0.6
3.3V
Accuracy
Frequency
Adjustment Range
FS/SYNC pin open
FS/SYNC pin: resistor to GND;
resistor to VCC12
Sawtooth Amplitude
Duty-Cycle Range
ERROR AMPLIFIER (OUT1 and OUT2)
Open-Loop Gain
RL = 10kΩ to ground
Open-Loop Bandwidth
CL = 100pF, RL = 10kΩ to ground
Slew Rate
CL = 100pF, RL = 10kΩ to ground
EA Offset
COMP1/2 to FB1/2; compare to
internal VREF/REFIN
Maximum Output Voltage
RL = 10kΩ to ground; (may trip
short-circuit)
Output High Source Current
COMP1/2, VCOMP=2V
Output Low Sink Current
COMP1/2, VCOMP=2V
PROTECTION AND MONITOR
Under-Voltage Threshold
Causes PGOOD to go low; if there
(COMP1 and COMP2)
for a filter time, implies the COMP
pin(s) is out-of-range, and shuts
down IC
Based on internal oscillator clock
UV filter time
frequency (nominal 300kHz = 3.3µs
clock period)
PGOOD Low Voltage
IPGOOD = 2mA
LINEAR REGULATOR (OUT3)
DRIVE3 to FB3; compare to internal
EA Offset
VREF
DRIVE3 High Output Voltage
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
V
5
-0.8
-0.8
0.8
0.8
%
%
-20
20
%
360
KHz
800
KHz
85
V
%
240
300
70
2.1
0
85
15
4
2
dB
MHz
V/µs
mV
VCC
V
-50
45
mA
mA
3.3
V
1
0.1
2
2
Clock
pulses
0.3
V
mV
VCC12
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APW7066
Electrical Characteristics (Cont.)
Operating Conditions: VCC = 5V, VCC12 = 12V, TA = 0 to 70°C, Unless Otherwise Specified.
Parameter
Test Conditions
Min.
LINEAR REGULATOR (OUT3)
DRIVE3 High Output Source
Current
DRIVE3 Low Output Sink Current
VREF
Output Voltage
1.1µF max capacitance
Output Accuracy
Typ.
mA
2.5
mA
3.3
V
-0.8
Determined by REFIN voltage
Units
1.5
Source Current
REFOUT (VTTREF)
Output Voltage
Max.
+0.8
%
2.0
mA
0.6
3.3
V
Offset Voltage
-10
+10
mV
Source Current
0.2
20
mA
0.48
mA
Sink Current
Output Capacitance
Output High Voltage Minimum
µF
0.1
To select 0 degree phase; see Table 1
3.8
ENABLE/SOFTSTART (SS/EN 1,2,3)
EN Rising
Enable Threshold
EN falling
1.05
Soft-Start Current
Soft-Start High Voltage
Output High Voltage
-30
3.5
3.8
VCC
V
V
0.95
End of ramp
To select DDR mod; see Table 1
VCC
µA
V
V
800
KHz
12
V
FS/SYNC PLL
Frequency range of Lock-in
High Voltage
150
( from LG pin of another IC, for
example)
GATE DRIVERS
Output1 GATE Driver Source
Output2 GATE Driver Source
UGATE1, LGATE1=3V, BOOT=12V
UGATE2, LGATE2=3V, BOOT=12V
1.8
1
A
A
Output1 GATE Driver Sink
UGATE1, LGATE1=3V, BOOT=12V
2.5
Ω
Output2 GATE Driver Sink
UGATE2, UGATE2=3V, BOOT=12V
4
Ω
Output Voltage
UGATE1, UGATE2
Output Voltage
LGATE1, LGATE2
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
6
30
12
V
V
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APW7066
Typical Application Circuit
APW7066
DDR MODE
VCC
VCC12
Optional for
shunt regulator
COMP1
VOUT1
VIN1
BOOT1
FB1
UGATE1
COMP2
VOUT2
VOUT1
LGATE1
VCC12
FB2
BOOT2
VOUT1(DDR)
VIN2=VOUT1(DDR)
REFIN
PHASE
SHIFT 0
APW7066
VCC12 VCC
PHASE
SHIFT 90
VTTREF
UGATE2
VOUT2
LGATE2
REFOUT
VREF
PGOOD
SYNCHRONOUS
FREQUENCY
VIN3
FS/SYNC
SS1/EN1
DRIVE3
SS2/EN2
FB3
SS3/EN3
GND
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
7
VOUT3
PGND
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APW7066
Typical Application Circuit (Cont.)
APW7066
INDEPENDENT MODE
VCC
VCC12
Optional for
shunt regulator
COMP1
VOUT1
VIN1
BOOT1
FB1
UGATE1
COMP2
VOUT2
PHASE
SHIFT 0
LGATE1
VCC12
FB2
BOOT2
VREF
VOUT1
VIN2
REFIN
APW7066
VCC12 VCC
PHASE
SHIFT 180
VTTREF
UGATE2
VOUT2
LGATE2
REFOUT
VREF
PGOOD
SYNCHRONOUS
FREQUENCY
VIN3
FS/SYNC
SS1/EN1
DRIVE3
SS2/EN2
VOUT3
FB3
SS3/EN3
GND
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
8
PGND
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APW7066
Function Pin Descriptions
VCC
BOOT1, BOOT2
Power supply input pin. Connect a nominal 5V power
supply to this pin for the control circuit, or connect a
resistor (nominally 300Ω) to VCC12 for a shunt
regulator function (typical 5.8V). It is recommended
that a decoupling capacitor (1 to 10uF) is connected
to the GND for noise decoupling.
These pins provide the bootstrap voltage to the gate
driver for driving the upper MOSFETs. It can be
connected to a power voltage directly, but the difference voltage between the BOOT and VIN must be high
enough to drive the upper MOSFETs.
REFIN
GND
This pin is the reference input voltage of error amplifier
of the VOUT2. It also provides the voltage into a buffer,
which is out on the REFOUT pin.
This pin is the signal ground pin. The metal thermal
pad under the package is the IC substrate; connects
the GND pin and metal thermal pad together on the
board, and ties to the good GND plane for electrical
and thermal conduction.
REFOUT
This pin provides a buffed voltage, which is from REFIN
pin. In Independent mode, it can be used by other
ICs. In DDR mode, it is from the VOUT1, and can be
used as the VTT buffer.
VCC12
Power supply input pin. Connect a nominal 12V power
supply to this pin for the gate driver. It is recommended
that a decoupling capacitor (1 to 10uF) is connected
to the GND for noise decoupling.
This pin also uses to select the phase shift (see table1).
When this pin pulls to VCC, the buffer is disabled and
the REFOUT is not available for use. It is recommended
that a 0.1uF capacitor is connected to the ground for
stability.
PGND
This pin is the power ground pin for the gate driver and
linear driver circuit. It should be tied to the GND.
VREF
FB1, FB2, FB3
This pin provides a 3.3V reference voltage, which can
be used by the REFIN pin or other ICs as a voltage
reference. It is recommended that a 1uF capacitor is
connected to ground for stability.
These pins are the inverting inputs of the error amplifiers of their respective regulators. They are used to
set the output v oltage and the compensation
components.
DRIVE3
SS1/EN1, SS2/EN2, SS3/EN3
This pin drives the gate of an external N-channel
MOSFET for linear regulator.
These pins provide two functions. Connect a capacitor
to the GND for setting the soft-start time. Use an open
drain logic signal to pull the SS/EN pin low to disable
the respective output, leave open to enable the respective output.
PGOOD
This pin is an open drain device; connect a pull up
resistor to the VCC for PGOOD function.
FS/SYNC
COMP1, COMP2
This pin is used to adjust the switching frequency.
Connecting a resistor from FS/SYNC pin to the ground
increases the switching frequency. Conversely, connecting a resistor from this pin to the VCC12 reduces
the switching frequency. In addition, this pin also
provides synchronous frequency function. An external
clock can be fed into this pin, and force the switching
frequency to follow the external clock.
These pins are the outputs of error amplifiers of their
respective regulators. They are used to set the
compensation components.
UGATE1, UGATE2
These pins provide the gate driver for the upper
MOSFETs of VOUT1 and VOUT2.
LGATE1, LGATE2
These pins provide the gate driver for the lower
MOSFETs of VOUT1 and VOUT2.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
9
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APW7066
Typical Characteristics
VOUT2 Power Up
VOUT1 Power Up
VCC12(5V/div)
VCC12(5V/div)
VCC(2V/div)
VCC(2V/div)
VOUT2(2V/div)
VOUT1(1V/div)
SS2(2V/div)
SS1(2V/div)
Time(5ms/div)
Time(5ms/div)
VOUT3 Power Up
VREF Power Up
VCC12(5V/div)
VCC12(5V/div)
VCC(2V/div)
VCC(2V/div)
VOUT3(1V/div)
VREF(2V/div)
SS3(2V/div)
SS2(2V/div)
Time(5ms/div)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
Time(5ms/div)
10
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APW7066
Typical Characteristics (Cont.)
VOUT2 Power Up
VOUT1 Power Up
UGATE1(20V/div)
UGATE2(20V/div)
LGATE2(10V/div)
LGATE1(10V/div)
VOUT1(1V/div)
VOUT2(5V/div)
SS1(2V/div)
SS2(2V/div)
Time(2ms/div)
Time(2ms/div)
DDR Mode Power Up
Phase Shift 0 degrees
SS2=VCC
VOUT1=REFIN
VREF(2V/div)
LG1(10V/div)
VOUT2(2V/div)
LG2(10V/div)
VOUT1(1V/div)
SS1(2V/div)
Time(1us/div)
Time(2ms/div)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
11
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APW7066
Typical Characteristics (Cont.)
Phase Shift 180 degrees
Phase Shift 90 degrees
LG1(10V/div)
LG1(10V/div)
LG2(10V/div)
LG2(10V/div)
Time(1us/div)
Time(1us/div)
PGOOD High
PGOOD Low
SS1(2V/div)
SS1(2V/div)
SS2(2V/div)
SS2(2V/div)
SS3(2V/div)
SS3(2V/div)
PGOOD(5V/div)
PGOOD(5V/div)
Time(5ms/div)
Time(5ms/div)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
12
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APW7066
Typical Characteristics (Cont.)
VOUT1 Short Circuit Protection
VOUT2 Short Circuit Protection
Comp1 (2V/div)
Comp2 (2V/div)
SS1 (2V/div)
SS2 (2V/div)
UG1 (20V/div)
UG2 (20V/div)
PGOOD (5V/div)
PGOOD (5V/div)
Time(5us/div)
Time(5us/div)
VOUT2 Load Transient
VOUT1 Load Transient
VOUT1=VIN3
VOUT1 (0.1V/div)
VOUT1=VIN3
VOUT1 (0.2V/div)
VOUT2 (0.1V/div)
VOUT2 (0.1V/div)
VOUT3 (0.1V/div)
VOUT3 (0.05V/div)
IOUT2 (5A/div)
IOUT1 (10A/div)
Time(20us/div)
Time(20us/div)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
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APW7066
Typical Characteristics (Cont.)
VOUT3 Load Transient
UG1 Rising
VOUT1=VIN3
VOUT1 (0.1V/div)
UG1 (10V/div)
VOUT2 (0.1V/div)
Phase1 (10V/div)
VOUT3 (0.1V/div)
LG1 (10V/div)
IOUT3 (2A/div)
Time(20us/div)
Time(50ns/div)
UG1 Falling
UG2 Rising
UG1 (10V/div)
UG2 (10V/div)
Phase1 (10V/div)
Phase2 (10V/
LG1 (10V/div)
LG2 (10V/div)
Time(50ns/div)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
Time(50ns/div)
14
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APW7066
Typical Characteristics (Cont.)
PGOOD Sink Current vs. PGOOD Voltage
UG2 Falling
3
2.5
Sink Current (mA)
UG2 (10V/div)
Phase2 (10V/div)
2
1.5
1
0.5
LG2 (10V/div)
0
0
10
Time(50ns/div)
20
30
40
PGOOD Voltage (mV)
REFOUT Voltage vs. Source Current
VREF Voltage vs. Source Current
3.32
3.35
3.34
3.31
3.32
VREF Voltage (V)
REFOUT Voltage (V)
3.33
3.31
3.3
3.29
3.28
3.27
3.3
3.29
3.26
3.25
3.28
0
5
10
15
20
0
Source Current (mA)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
0.5
1
1.5
2
Source Current (mA)
15
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APW7066
Typical Characteristics (Cont.)
UG1 Source Current vs. Voltage
2.4
2.2
2.4
2.2
2
1.8
2
1.8
Source Current (A)
Sink Current (A)
UG1 Sink Current vs. Voltage
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
0
2
4
6
8
10
12
0
2
UG1 Voltage (V)
6
8
10
12
UG1 Voltage (V)
LG1 Sink Current vs. Voltage
LG1 Source Current vs. Voltage
2.4
2.4
2.2
2.2
2
2
1.8
1.8
1.6
1.4
Source Current (A)
Sink Current (A)
4
1.2
1
0.8
0.6
0.4
0.2
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
0
2
4
6
8
10
12
0
LG1 Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
2
4
6
8
10
12
LG1 Voltage (V)
16
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APW7066
Typical Characteristics (Cont.)
UG2 Sink Current vs. Voltage
UG2 Source Current vs. Voltage
1.4
1.6
BOOT=12V
BOOT=12V
1.4
1.2
Source Current (A)
Sink Current (A)
1.2
1
0.8
0.6
0.4
0.2
1
0.8
0.6
0.4
0.2
0
0
0
2
4
6
8
10
0
12
2
4
8
10
12
UG2 Voltage
UG2 Voltage (V)
LG2 Source Current vs. Voltage
LG2 Sink Current vs. Voltage
1.6
1.4
1.4
1.2
1.2
1
Source Current (A)
Sink Current (A)
6
1
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
0
0
0
2
4
6
8
10
0
12
LG2 Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
2
4
6
8
10
12
LG2 Voltage (V)
17
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APW7066
Typical Characteristics (Cont.)
DRIVE3 Sink Current vs. Voltage
DRIVE3 Source Current vs. Voltage
3.5
2
3
Source Current (mA)
Sink Current (mA)
2.5
2
1.5
1
0.5
1.5
1
0.5
0
0
0
2
4
6
8
10
12
0
2
DRIVE3 Voltage (V)
6
8
10
12
DRIVE3 Voltage (V)
Shunt Regulator Sink Current vs. Voltage
FS Resistance vs. Switching Frequency
60
1000
FS to VCC12
900
50
Sink Current (mA)
800
FS Resistance (kΩ)
4
700
600
500
400
300
200
40
30
20
10
FS to GND
100
0
0
0
100 200 300 400 500 600 700 800
3
Switching Frequency (kHz)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
3.5
4
4.5
5
5.5
6
6.5
7
Shunt Regulator Voltage (V)
18
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APW7066
Typical Characteristics (Cont.)
Comp Source Current vs. Voltage
70
50
60
Source Current (mA)
Sink Current (mA)
Comp Sink Current vs. Voltage
60
40
30
20
10
0
50
40
30
20
10
0
0
0.5
1
1.5
2
2.5
3
0
1
3
4
VREF Voltage vs. Temperature
FB Voltage vs. Temperature
3.35
608
3.34
606
3.33
VREF Voltage (V)
610
604
FB Voltage (V)
2
Comp Voltage (V)
Comp Voltage (V)
602
600
598
596
3.32
3.31
3.3
3.29
3.28
594
3.27
592
3.26
3.25
590
0
25
50
75
100
125
150
0
Rev. A.4 - Jun., 2005
50
75
100
125
150
Temperature (°C)
Temperature (°C)
Copyright  ANPEC Electronics Corp.
25
19
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APW7066
Function Descriptions
Operational Modes
Phase Shift
The APW7066 has two independent synchronous buck
converters, and it also has DDR mode operation to
allow VOUT2 to track VOUT1.
The APW7066 has phase shift function, use the
REFOUT pin to select the phase shift between
Independent mode and DDR mode. Connect the
REFOUT to VCC to get the 0 degrees in either mode.
In this case, the buffer of the REFOUT is disabled.
Leave the REFOUT open shifts the phase 90 degrees
in DDR mode, or 180 degrees in Independent mode,
REFOUT can be used in this case ( see Table 1.).
In independent mode operation, connect a capacitor
from each SS/EN pin to the ground to set each
regulator’s soft-start time. The 3.3V reference VREF
can be used directly, or divided by two resistors for
REFIN, since the VREF is controlled by the SS2/EN2.
MODE
DDR
DDR mode is chosen by connecting the SS2/EN2 pin
to VCC(5V). In this mode, SS2/EN2 function will be
disabled, SS1/EN1 is used to control soft start and
enable both VOUT1 and VOUT2. The VOUT1 is used
as the REFIN for the VOUT2, that makes VOUT2 to
track VOUT1.
SS2/EN2 REFOUT REFIN PHASE SHIFT
CH1/CH2
VCC
VCC VOUT1
0 deg
SS1/EN1 for CH1
and CH2
DDR
VCC
Open
VOUT1
90 deg
Independent
Independent
SS2 cap
SS2 cap
VCC
Open
VREF
VREF
0 deg
180 deg
SS1/EN1 for CH1
SS2/EN2 for CH2
Table1.Mode and Phase Selection
VREF
The advantage of Phase shift is to avoid overlapping
the switching current spikes of the two channels, or
interaction between the channels; it also reduces the
RMS current of the input capacitors, allowing fewer
caps to be employed. However, the phase shift
between the rising edge of LGATE1 and LGATE2 (See
figure 3.), depending on the duty cycles, the falling
edges of the two channels might overlap; so the user
should check it.
REFIN
SS1/EN1
SS2/EN2
SS3/EN3
GND
Figure 1. Independent Mode Circuit
LG1
VOUT1
REFIN
LG2
(0deg)
VCC
LG2
(90deg)
SS1/EN1
SS2/EN2
SS3/EN3
GND
LG2
(180deg)
0
Rev. A.4 - Jun., 2005
180
0
Figure 3. Phase of LG2 with respect
to rising edge of LG1
Figure 2.DDR Mode Circuit
Copyright  ANPEC Electronics Corp.
90
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APW7066
Function Descriptions (Cont.)
Soft-Start/Enable
PGOOD
The three SS/EN pins control the soft-start and enable
or disable the controller. In Independent mode, the
three regulators all have independent soft-start and
enable functions. Connect a soft-start capacitor from
each SS/EN pin to the GND to set the soft-start
interval, and an open drain logic signal for each SS/EN
pin will enable or disable the respective output.
The PGOOD output is an open-drain device, when the
VCC is present; the gate of open-drain device will be
high, forcing the PGOOD pin to go low. The three
SS/EN pins and the SCP signals control the PGOOD
signal (see block diagram), after the three SS/EN
signals are over threshold high 3.3V and three outputs
have no short-circuit, the PGOOD goes high to
indicate all regulators are ready. If any of the SS/EN
pins goes below threshold low 3.2V, the PGOOD will
go low. Also, if any of the outputs has a short, the
PGOOD pull low and if short-circuit condition
continues for 1-2 clock pulses, all regulators will shut
down. If the short-circuit is not long enough to shut
down, it may still cause PGOOD to go low momentarily.
Figure 4. Shows the soft-start interval. When both VCC
and VCC12 reach their Power-On-Reset threshold
4.23V and 7.8V, a 30uA current source starts to
charge the capacitor. When the SS reaches the
enabled threshold about 1V, the internal 0.6V
reference starts to rise and follows the SS; the error
amplifier output (COMP) suddenly raises to 1.1V, which
is the valley of the oscillator’s triangle wave, leads the
VOUT to start up. Until the SS reaches about 3.0V,
the internal reference completes the soft-start interval
and reaches to 0.6V; then VOUT1 is in regulation. The
SS1 still rises to 3.5V and then stops.
Because the PGOOD is an open-drain device, the
typical range of the value to connect a pull high
resistor to VCC will be 1kΩ to 10kΩ; if PGOOD is not
used, leave it open.
Shunt Regulator
VOLTAGE
The APW7066 must have two power supplies VCC
(5V) and VCC12 (12V) to drive the IC; VCC (5V) is for
the control circuit and VCC12 (12V) is for the drivers
of outputs. But it can also operate only VCC12,
because the shunt regulator 5.8V was designed for
VCC (5V); the range of the shunt regulator was designed over the usual range 4.5V to 5.5V of typical 5V
power supplies.
V SS
3V
V OUT
1V
t0
t1
t2
Connect a resistor from VCC12 to VCC for shunt
regulator and for the supply current. The input supply
current of VCC is 7mA; minimum shunt regulator
current is about 7mA, and therefore the 20mA shunt
regulator current is enough; thus, the typical value,
300Ω of the resistor is recommended. The relation
among minimun shunt regulator current, required shunt
regulator current and supply current is:
TIME
Figure 4. Soft-Start Interval
TSoft - Start = t2 − t1 =
CSS
⋅ 2V
ISS
Where:
CSS = external Soft-Start capacitor
ISS = Soft-Start current = 30µA
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
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APW7066
Function Descriptions (Cont.)
PGOOD (Cont.)
ISHUNT = ICC + ISHUNT(MIN)
Where:
ISHUNT = Required Shunt Regulator Current
ICC = Supply Current
ISHUNT(MIN) = Minimum Shunt Regulator Current
OPTIONAL R
VCC (5.8V) FOR SHUNT
REGULATOR
SYNC
The switching frequency also can be synchronized to
an external frequency. If there are two switching
converters on the same board, taking the LGATE
signal from another switching converter, go through a
10kΩ resistor, and connecting to the FS/SYNC pin.
The APW7066 will read another converter’s frequency
and after several milliseconds, the APW7066 will
change to new frequency. If another converter’s signal
is lost, the APW7066 will return to internal oscillator.
This allows the two switching converters for operating
at the same frequency to avoid the interference from
the independent frequencies between them. The
acceptable frequency is a range of 150kHz to 800kHz.
VCC12
Oscillator
The APW 7066 provides the oscillator switching
frequency adjustment. Connect a resistor from
FS/SYNC pin to the ground, the nominally 300kHz
oscillator switching frequency is increased according
to the value of the resistor. The adjustment range of
the switching frequency is 300kHz to 800kHz.
Short-Circuit Protection
The APW7066 has a simple short-circuit protection
to monitor COMP1 and COMP2 for VOUT1/2. When
output voltage has a short, the FB pin should start to
follow output, since it is a resistor divider from the
output. The FB is the inverting input of Error-Amp,
when FB pin is lower than the Error-Amp reference,
then the COMP will rise to increase the duty-cycle of
the upper MOSFET gate driver, this allows output to
get higher voltage. If the short-circuit condition is long
enough, the COMP pin will exceed the trip point 3.3V,
and the duty circle will hit the maximum. This means
that either Over-Current or Under-Voltage condition is
detected. If any of the COMP1 and COMP2 exceeds
their trip points, and holds over a filter time (1-2 clock
cycle of switching frequency), then all regulators will
shut down, and require a POR on either of VCC or
VCC12 to restart. Note that the linear regulator has
no short-circuit protection.
Conversely, connecting a resistor from FS/SYNC pin
to the VCC12 reduces the switching frequency.The
adjustment range of the switching frequency is 70kHz
to 300kHz.
1000
FS to VCC12
900
FS Resistance (kO)
800
700
600
500
400
300
FS to GND
200
100
0
0
100 200 300 400 500 600 700 800
Switching Frequency (kHz)
Figure 5. FS/SYNC Resistance vs. Frequency
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
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APW7066
Application Information
Output Voltage Setting
Linear Regulator Input/Output MOSFET Selection
The output voltage can be adjusted with a resistive
divider, from output voltage to FB pin to the ground.
Use 1% or better resistors for these resistor dividers
is recommended. The reference voltages of VOUT1
and VOUT3 are 0.6V, the reference voltage of VOUT2
is REFIN voltage. The VREF voltage is for REFIN in
independent mode. The following equations can be
used to calculate the output voltage:
The maximum DRIVE3 voltage is determined by the
VCC12. Since this pin drives an external N-channel
MOSFET, therefore the maximum output voltage of
the linear regulator is dependent upon the VGS.
VOUT1 = (1 +
VOUT3MAX = VCC12 - VGS
Another criteria is its efficiency of heat removal. The
power dissipated by the MOSFET is given by:
Pdiss = Iout x (VIN - VOUT3)
R1
) x 0.6V
R2
where Iout is the maximum load current VOUT3 is the
nominal output voltage
R1
VOUT2 = ( 1 +
) x REFIN
R2
In some applications, heatsink might be required to
help maintain the junction temperature of the MOSFET
below its maximum rating.
R1
VOUT3 = ( 1 +
) x 0.6V
R2
R3
) x VOUT1 (DDR Mode)
R4
R3
REFIN = (1 +
) x VREF (Independe nt Mode)
R4
REFIN = (1 +
Linear Regulator Compensation Selection
The linear regulator is stable over all load current.
However, the transient response can be further
enhanced by connecting a RC network between the
FB3 and DRIVE3 pin. Depending on the output
capacitance and load current of the application, the
value of this RC network is then varied. A good starting
point for the resistor value is 6.8kΩ and 470pF for the
capacitor.
Where:
R1 = resistor from VOUT to FB
R2 = resistor from FB to GND
R3 = resistor from VREF or VOUT1 to REFIN
R4 = resistor from REFIN to GND
Note that the R1 is part of the compensation. It should
be conformed to the feedback compensation.
PWM Compensation
Linear Regulator Input/Output Capacitor Selection
The output LC filter of a step down converter introduces
a double pole, which contributes with –40dB/decade
gain slope and 180 degrees phase shift in the control
loop. A compensation network between COMP, FB
and VOUT should be added. The compensation
network is shown in Fig. 9.
The input capacitor is chosen based on its voltage
rating. Under load transient condition, the input
capacitor will momentarily supply the required
transient current. The output capacitor for the linear
regulator is chosen to minimize any droop during load
transient condition. In addition, the capacitor is chosen
based on its voltage rating.
The output LC filter consists of the output inductor
and output capacitors. The transfer function of the LC
filter is given by:
GAINLC =
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
23
1+ s × ESR × COUT
s × L × COUT + s × ESR × COUT + 1
2
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APW7066
Application Information (Cont.)
PWM Compensation (Cont.)
VIN
The poles and zero of this transfer function are:
Driver
1
FLC =
PWM
Comparator
2 × π × L × COUT
VOSC
1
FESR =
2 × π × ESR × C OUT
Output of
Error
Amplifier
The FLC is the double poles of the LC filter, and FESR is
the zero introduced by the ESR of the output capacitor.
L
PHASE
Driver
Output
COUT
Figure 8. The PWM Modulator
ESR
The compensation circuit is shown in Figure 9. It
provide a close loop transfer function with the highest
zero crossover frequency and sufficient phase margin.
The transfer function of error amplifier is given by:
Figure 6. The Output LC Filter
V COMP
GAINAMP =
V OUT
FLC
-40dB/dec
FESR
The poles and zeros of the transfer function are:
1
FZ1 =
2 × π × R2× C2
Frequency
Figure 7. The LC Filter Gain & Frequency
FZ2 =
The PWM modulator is shown in Figure. 8. The input
is the output of the error amplifier and the output is the
PHASE node. The transfer function of the PWM
FP1 =
modulator is given by:
V IN
Rev. A.4 - Jun., 2005
FP2 =
∆ V OSC
Copyright  ANPEC Electronics Corp.
=
1
1 

//  R2 +

sC1
sC2


1


R1 //  R3 +

sC3



1
1

 

s +
 ×  s +
R1+ R3
 R2× C2   (R1+ R3)× C3 
×
=
C1+ C2  
1 
R1× R3× C1 
s s +
× s +

×
×
R3
×
C3 
R2
C1
C2

 
-20dB/dec
GAINPWM =
PHASE
24
1
2× π× (R1+ R3) ×C3
1
 C1 × C2 
2 × π × R2 × 

 C1 + C2 
1
2 × π × R3 × C3
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APW7066
Application Information (Cont.)
PWM Compensation (Cont.)
C1
R3
C3
R2
C2
VOUT
R1
FB
VCOMP
+
VREF
Figure 9. Compensation Network
The closed loop gain of the converter can be written
as:
GAINLC x GAINPWM x GAINAMP
Figure 10. shows the asymptotic plot of the closed
loop converter gain and the following guidelines will
help to design the compensation network. Using the
below guidelines should give a compensation similar
to the curve plotted. A stable closed loop has a -20dB/
decade slope and a phase margin greater than 45
degree.
1.Choose a value for R1, uaually between 1K and
5K.
2.Select the desired zero crossover frequency FO:
(1/5 ~ 1/10) x FS >FO>FESR
Use the following equation to calculate R2:
R2 =
Open Loop Error
Amp Gain
Gain
20log
(R2/R1)
FLC
PWM & Filter
Gain
Converter
Gain
Frequency
Figure 10. Converter Gain & Frequency
Output Inductor Selection
The inductor value determines the inductor ripple
current and affects the load transient response. Higher
inductor value reduces the inductor’s ripple current and
induces lower output ripple voltage. The ripple current
and ripple voltage can be approximated by:
1
2 × π × R2 × FLC × 0.75
IRIPPLE =
C2
VIN − VOUT VOUT
×
FS × L
VIN
∆VOUT = IRIPPLE x ESR
2 × π × R2× C2× FESR − 1
Rev. A.4 - Jun., 2005
FO
FESR
∆ V OSC
FO
×
× R1
V IN
F LC
Copyright  ANPEC Electronics Corp.
FP2=0.5FS
20log
(VIN / VOSC) Compensation
Gain
0
4.Set the pole at the ESR zero frequency FESR:
FP1 = FESR
Calculate the C1 by the equation:
C1 =
FZ1=0.75FLC FP1=FESR
FZ2=FLC
3.Place the first zero FZ1 before the output LC filter
double pole frequency FLC.
FZ1 = 0.75 x FLC
Calculate the C2 by the equation:
C2 =
5.Set the second pole F P2 at half the switching
frequency and also set the second zero FZ2 at the
output LC filter double pole FLC. The compensation
gain should not exceed the error amplifier open
loop gain, check the compensation gain at FP2
with the capabilities of the error amplifier.
FP2 = 0.5xFO
FZ2 = FLC
Combine the two equations will get the following
component calculations:
R1
1
R3 =
C3 =
FS
π × R3 × FS
−1
2xFLC
25
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APW7066
Application Information (Cont.)
Output Inductor Selection (Cont.)
rating and the RMS current rating. For reliable
operation, select the capacitor voltage rating to be at
least 1.3 times higher than the maximum input voltage.
The maximum RMS current rating requirement is
approximately IOUT/2, where IOUT is the load current.
During power up, the input capacitors have to handle
large amount of surge current. If tantalum capacitors
are used, make sure they are surge tested by the
manufactures. If in doubt, consult the capacitors
manufacturer. For high frequency decoupling, a
ceramic capacitor 1uF can be connected between the
drain of upper MOSFET and the source of lower
MOSFET.
where Fs is the switching frequency of the regulator.
Although increase the inductor value and frequency
reduce the ripple current and voltage, but there is a
tradeoff exists between the inductor’s ripple current
and the regulator load transient response time.
A smaller inductor will give the regulator a faster load
transient response at the expense of higher ripple
current. Increasing the switching frequency (FS) also
reduces the ripple current and voltage, but it will
increase the switching loss of the MOSFET and the
power dissipation of the converter. The maximum ripple
current occurs at the maximum input voltage. A good
starting point is to choose the ripple current to be
approximately 30% of the maximum output current.
MOSFET Selection
The selection of the N-channel power MOSFETs are
determined by the RDS(ON), reverse transfer capacitance
(CRSS) and maximum output current requirement.The
losses in the MOSFETs have two components:
conduction loss and transition loss. For the upper and
lower MOSFET, the losses are approximately given
by the following :
Once the inductance value has been chosen, select
an inductor that is capable of carrying the required
peak current without going into saturation. In some
types of inductors, especially core that is made of
ferrite, the ripple current will increase abruptly when it
saturates. This will result in a larger output ripple
voltage.
PUPPER = Iout (1+ TC)(RDS(ON))D + (0.5)(Iout)(VIN)(tsw)FS
Output Capacitor Selection
PLOWER = Iout (1+ TC)(RDS(ON))(1-D)
Higher Capacitor value and lower ESR reduce the
output ripple and the load transient drop. Therefore
select high performance low ESR capacitors that are
intended for switching regulator applications. In some
applications, multiple capacitors have to be parallel to
achieve the desired ESR value. A small decoupling
capacitor in parallel for bypassing the noise is also
recommended, and the voltage rating of the output
capacitors are also must be considered. If tantalum
capacitors are used, make sure they are surge tested
by the manufactures. If in doubt, consult the capacitors
manufacturer.
where IOUT is the load current
TC is the temperature dependency of RDS(ON)
FS is the switching frequency
tsw is the switching interval
D is the duty cycle
Note that both MOSFETs have conduction losses while
the upper MOSFET include an additional transition
loss.The switching internal, tsw, is a function of the
reverse transfer capacitance CRSS.
The (1+TC) term is to factor in the temperature
dependency of the RDS(ON) and can be extracted from
the “RDS(ON) vs Temperature” curve of the power
MOSFET.
Input Capacitor Selection
The input capacitor is chosen based on the voltage
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
26
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APW7066
Application Information (Cont.)
Connecting One Input from Another Output
short; the COMP pin will have a sharp rise.
However, if the current rises too fast, it may cause
a false trip. The output capacitance and its ESR
can affect the rising time of the current during short.
It can be connected one of the 3 outputs as the input
voltage to the 2nd. In these cases the output current
of the first output includes its own load current and the
2nd output’s load current. Therefore, the components of
the first output must be designed and sized for the
both outputs. The soft-start of first output must be faster
than the 2nd output. If the first output is not present
when the 2nd output tries to start up, the 2nd output
cannot get smooth and controlled output voltage rise,
Layout Considerations
In high power switching regulator, a correct layout is
important to ensure proper operation of the regulator.
In general, interconnecting impedances should be
minimized by using short, wide printed circuit traces.
Signal and power grounds are to be kept separate
and finally combined using ground plane construction
or single point grounding. Figure 10. illustrates the
layout, with bold lines indicating high current paths;
these traces must be short and wide. Components
along the bold lines should be placed lose together.
Below is a checklist for your layout :
even cause short-circuit protection.
Short Circuit Protection
The APW 7066 prov ides a simple short circuit
protection function, and it is not easy to predict its
performance, since many factors can affect how well
it works. Therefore, the limitations and suggestions
of this method must be provided for users to understand
how to work it well.
• The metal plate of the bottom of the packages
(TSSOP-24 and QFN-32) must be soldered to the
PCB and connected to the GND plane on the
backside through several thermal vias.
• The short circuit protection was not designed to
work for the output in initial short condition. In this
case, the short circuit protection may not work,
and damage the MOSFETs. If the circuit still works,
remove the short can cause an inductive kick on
the phase pin, and it may damage the IC and
MOSFETs.
• Keep the switching nodes (UGATE, LGATE and
PHASE) away from sensitive small signal nodes
since these nodes are fast moving signals.
Therefore, keep traces to these nodes as short
as possible.
• If the resistance of the short is not low enough to
• The traces from the gate drivers to the MOSFETs
cause protection, the regulator will work as the
load has increased, and continue to regulate up
until the MOSFETs is damaged. The resistance of
the short should include wiring, PCB traces,
contact resistances, and all of the return paths.
(UG1, LG1, UG2, LG2, DRIVE3) should be short
and wide.
• Decoupling capacitor, compensation component,
• The higher duty cycle will give a higher COMP
• The input capacitor should be near the drain of the
voltage level, and it is easy to touch the trip point.
The compensation components also affect the
response of COMP voltage; smaller caps may give
a faster response.
upper MOSFET; the output capacitor should be
near the loads. The input capacitor GND should be
close to the output capacitor GND and the lower
MOSFET GND.
the resistor dividers, boot capacitors, and SS
capacitors should be close their pins.
• The output current has faster rising time during
• The drain of the MOSFETs (VIN and phase nodes)
should be a large plane for heat sinking.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
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APW7066
Application Information (Cont.)
VIN
APW7066
UG
C BOOT
FB
BOOT
L1
Q2
REFOUT
C REFOUT
LG
PGND
VCC
VCC12
VREF
C VREF
SS
C SS
VOUT
Q1
CVCC12
COUT
CIN
L
O
A
D
C VCC
GND
Figure 11. Layout Guidelines
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
28
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APW7066
Packaging Information
TSSOP/ TSSOP-P (Reference JEDEC Registration MO-153)
e
N
D
2x E/2
A2
E1
A
E
A1
b
1
2
3
e/2
D1
(
2)
GAUGE
PLANE
S
EXPOSED THERMAL
PAD ZONE
E2
0.25
L
1
(L1)
BOTTOM VIEW
(
3)
(THERMALLY ENHANCED VARIATIONDS ONLY)
Dim
A
A1
A2
b
D
D1
e
E
E1
E2
L
L1
R
R1
S
φ1
φ2
φ3
Millimeters
Max.
1.2
0.00
0.15
0.80
1.05
0.19
0.30
6.6 (N=20PIN)
6.4 (N=20PIN)
7.9 (N=24PIN)
7.7 (N=24PIN)
9.8 (N=28PIN)
9.6 (N=28PIN)
4.2 BSC (N=20PIN)
4.7 BSC (N=24PIN)
3.8 BSC (N=28PIN)
0.65 BSC
6.40 BSC
4.30
4.50
3.0 BSC (N=20PIN)
3.2 BSC (N=24PIN)
2.8 BSC (N=28PIN)
0.45
0.75
1.0 REF
0.09
0.09
0.2
0°
8°
12° REF
12° REF
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
Inches
Min.
29
Min.
Max.
0.047
0.000
0.006
0.031
0.041
0.007
0.012
0.260 (N=20PIN)
0.252 (N=20PIN)
0.303 (N=24PIN)
0.311 (N=24PIN)
0.378 (N=28PIN)
0.386 (N=28PIN)
0.165 BSC (N=20PIN)
0.188 BSC (N=24PIN)
0.150 BSC (N=28PIN)
0.026 BSC
0.252 BSC
0.169
0.177
0.118 BSC (N=20PIN)
0.127 BSC (N=24PIN)
0.110 BSC (N=28PIN)
0.018
0.030
0.039REF
0.004
0.004
0.008
0°
8°
12° REF
12° REF
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APW7066
Packaging Information
QFN-32
D
32
31
30
29
28
27
26
D2
25
1
24
2
L
31 32
1
23
2
3
22
4
21
E
E2
5
20
6
19
7
18
8
17
9
10
11
12
13
14
15
16
e
b
A
A3
A1
Dim
Millimeters
Inches
Min.
Max.
Min.
Max.
A
-
0.84
-
0.033
A1
0.00
0.04
0.00
0.0015
A3
0.20 REF.
0.008 REF.
D
4.90
5.10
0.192
0.200
E
4.90
5.10
0.192
0.200
b
0.18
0.28
0.007
0.011
D2
3.50
3.60
0.138
0.142
E2
3.50
3.60
0.138
0.142
0.500 BSC
e
L
0.35
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
0.020 BSC
0.45
0.014
30
0.018
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APW7066
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
T L to T P
Temperature
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25 °C to Peak
Time
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
(mm)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
31
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APW7066
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s
3
3
Package Thickness
Volume mm
Volume mm
<350
≥350
<2.5 mm
240 +0/-5°C
225 +0/-5°C
≥2.5 mm
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Package Thickness
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0°C.
For example 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
Bo
F
W
Ko
Ao
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
D1
32
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APW7066
Carrier Tape & Reel Dimensions(Cont.)
T2
J
C
A
B
T1
Application
TSSOP- 24
A
B
C
J
T1
T2
W
P
E
330 ±1
100 ref
13 ±0.5
2 ±0.5
16.4 ±0.2
2 ±0.2
16 ±0.3
12 ±0.1
1.75±0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
7.5 ±0.1
1.5 +0.1
1.5 min
4.0 ±0.1
2.0 ±0.1
6.9 ±0.1
8.3 ±0.1
1.5 ±0.1
0.3±0.05
(mm)
5x5 Shipping Tray
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
33
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APW7066
5x5 Shipping Tray(Cont.)
Cover Tape Dimensions
Application
TSSOP- 24
Carrier Width
16
Cover Tape Width
21.3
Devices Per Reel
2000
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jun., 2005
34
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