������������������������������� ���� � � � � � � � � � � � � � � � �������������������������������������������������������������� INTRODUCTION Fast and easy breadborading of circuits using the SA60 are possible with the EK06 evaluation kit. The amplifier may be mounted vertically with the HS20 heat sink, or horizontally. Connections are provided for required power supply bypassing recommended protection components, as well as optional current sense resistors. A large area for component mounting provides flexibility and makes a multitude of circuit configurations possible. CAUTION ASSEMBLY Use the supplied thermal washers or thermal grease between the power amplifier and the heat sink. 1. On the silk screen side of the evaluation board, insert and solder the MS06 mating socket in DUT holes 1 – 12. Be sure each one is fully seated. 2. Solder components for your circuit. Be sure to include proper bypassing. See the SA60 data sheet for help in selecting these components. 1uF capacitors and a .10Ω resistor have been included with the EK06 kit but may be replaced with other components as necessary. C1, not provided, should be selected for the voltage required by the application. See Apex Application Note 30 for guidelines in selecting this bypass capacitor. If current sense resistors are not used, the I SENSE traces on the EVAL11 board must be shorted to power ground in place of the resistors. 3. Place the TW07 thermal washer on the heat sink over the mounting hole for the DUT. Place a #6 screw through the mounting hole and thread a #6 nut onto the screw at the back of the heat sink. Do not tighten. Note that there are two sets of mounting holes on the HS20). Holes on one edge allow room between the DUT and evaluation board for the MS06 socket. The holes on the other edge are for direct through hole mounting of the DUT to the evaluation board. It is recommended that you use the MS06. 4. Mount the DUT to the HS20 by sliding under the head of the #6 screw and on top of the thermal washer. Tighten the nut to the specified 8 to 10 in-lbs. (.9 to .13 N*M). Do not over torque. 5. Install leads of the DUT into the MS06 on the evaluation board. Use #6 self-tapping screws to secure the evaluation board to the HS20 heat sink as shown in the assembly diagram (Figure 1). PARTS LIST Part # Description Quantity HS20 EVAL11 MS06 OX7R105KWN CSR07 TWO7 HS22 Heatsink PC Board Mating Socket 1µF Ceramic Capacitor .1 Ω 1% Resistor Thermal Washer Heatsink 1 1 1 2 2 1 package 2 BEFORE YOU GET STARTED • All Apex amplifiers should be handled using proper ESD precautions. • Always use the heat sink and thermal washers included in this kit. • Always use adequate power supply bypassing. • Do not change connections while the circuit is powered. • Initially set all power supplies to the minimum operating levels allowed in the device data sheet. • Check for oscillations. • Power ground and signal ground must be separated to avoid switching noise in the DUT. FIGURE 1. APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL [email protected] 1 EK06 EVALUATION KIT FOR SA60 PIN-OUT FIGURE 2. �������� ��� ��� � �� �� �� �� �� � �� ���� ������ � ������ ��� ������ ��� ��� ����� �������� � � � � � � � � � � � � � � � ������� ����� ������ ����� �������� ������ ��� ��� ����� ��� � ����� ��� ���� ����������� ������ ����� ���������� ���� � �� This data sheet has been carefullyCORPORATION checked and is believed to beNORTH reliable, however, no responsibility is assumed for possible inaccuracies omissions. All specificationsHOTLINE: are subject to1 change notice. APEX MICROTECHNOLOGY • 5980 SHANNON ROAD • TUCSON, ARIZONA 85741 • orUSA • APPLICATIONS (800)without 546-2739 2 EK06 REV C OCTOBER 2004 © 2004 Apex Microtechnology Corp.