Quartz SMD, Ceramic HC4025 Features: - Application: Bluetooth, wireless LAN - Ultra-thin and small leadress type - Automatic mounting is enabled by emboss taping - Reflow soldering Specifications Symbol f Df/f CL HC4025 14.000MHz - 32.000MHz ± 10ppm ~ ± 30ppm Series, 10pf, 12pF, 16pF Storage temperature Df/f TSTG ± 10ppm ~ ± 30ppm -40°C ~ +85°C Operating temperature TOPR Maximum drive level MDL 300mW Recommended drive level RDL Frequency range Frequency tolerance,Ta=25°C Load capacitance Temperature tolerance Temperature range Drive level Please specify Please specify Please specify -10°C ~ +60°C; -20°C ~ +70°C Others are offered Series resistance R1 100mW As per table Shunt capacitance C0 3pF Insulation resistance Aging IR DfA 500M Ohm ±1 ~ ± 3ppm/Year Resistance of series resonance (ESR) Frequency (MHz) Mode 14 Fundamental 16 Fundamental Remarks Fundamental mode Ohm 80 80 25°C 100Vdc Frequency (MHz) 26 32 Mode Fundamental Fundamental Ohm 60 60 Drawing HC4025 Dimensions in mm Order key Q Part Q=Quartz - 32.000000M - HC4025 Frequency M=MHz Package HC4025 -F - 30 - 30 -D - 16 - TR Mode of Frequency Temperature Temperature Load oscillation tolerance tolerance range capacitance F=fund. +/-ppm +/-ppm A= pF TR=Tape and reel (25°C) (Temp. range) B=-10°C ~ 60°C SR=series X=Special options 0°C ~ 70°C Option C=-10°C ~ 70°C D=-20°C ~ 70°C I=-10°C ~ +50°C Remarks: All specifications subject to change without notice! 2.14