AVAGO AMMP-5024

AMMP-5024
30kHz – 40 GHz Traveling Wave Amplifier
Data Sheet
Description
Features
Avago Technologies’ AMMP-5024 is a broadband PHEMT
GaAs MMIC TWA designed for medium output power and
high gain over the full 30 KHz to 40 GHz frequency range.
The design employs a 9-stage, cascade-connected FET
structure to ensure flat gain and power as well as uniform
group delay. E-beam lithography is used to produce
uniform gate lengths of 0.15um and MBE technology
assures precise semiconductor layer control.
•
•
•
•
•
Pin Connections (Top View)
• Broadband Test and Measurement Applications
Pin
1
2
3
4
5
6
7
8
Function
Vaux
Not Used
Not Used
RFout / Vdd
Vg1
Not Used
Vg2
RFin
RoHS-Exemption
Surface Mount Package 5.0 x 5.0 x 2.0 mm
Wide Frequency Range 30kHz – 40GHz
High Gain: 14.8 dB Typical @ 22GHz
Output P1dB: 22 dBm Typical @ 22GHz
50 Ohm Input and Output Match
Applications [1]
Notes:
1. Use in hermetic assemblies only.
Attention:
Observe precautions for handling
electrostatic sensitive devices.
ESD Machine Model (Class A): 40V
ESD Human Body Model (Class 0): 150V
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
Please refer to Hazardous substances table on page 11.
Table 1. Absolute Maximum Ratings[1]
Symbol
Parameters and Test Conditions
Unit
Minimum
Vdd
Idd
Vg1
Ig1
Vg2
Ig2
Pin
Tch
Tstg
Tmax
V
mA
V
mA
V
mA
dBm
°C
°C
°C
-10
-
380
-9.5
0
-381
-3.5
4
-20
-17
-
+150
-65
+150
-
+260
Positive Drain Voltage
Total Drain Current
First Gate Voltage
First Gate Current
Second Gate Voltage
Second Gate Current
CW Input Power
Operating Channel Temperature
Storage Case Temperature
Maximum Assembly Temperature (20 sec max)
Maximum
Note:
1) Operation in excess of any one of these conditions may result in permanent damage to this device. The absolute maximum ratings
for DC and Power parameters were determined at an ambient temperature of 25°C unless noted otherwise.
Table 2. DC Specifications
(Vdd = 7V, Vg2 = Open, TA = 25°C, otherwise specified)
Symbol
Parameters and Test Conditions
Unit
Minimum
Vdd
Idd
Vg1
Idss
Idsmin (Vg1)
qch-b
V
mA
V
mA
mA
°C/W
-
7
-
200
-2.5
-3.0
-
350
-
80
-14.5
-3.5
-
Minimum
Maximum
Recommended Drain Supply Voltage
Total Drain Supply Current (Vg1 set for typical Idd)
First Gate Voltage (Vdd = 7V, Idd = 200mA)
Saturated Drain Current (Vg1 = 0V)
First Gate Minimum Drain Current (Vg1 = -7V)
Thermal Resistance [1]
Typical
Maximum
Note:
1) Channel-to-board Thermal Resistance is measured using Infrared Microscopy method.
Table 3. RF Specifications [1]
(Freq = 22GHz, Vdd = 7V, Idd = 200mA, TA = 25°C, Zin = Zo = 50Ohm)
Symbol
Parameters and Test Conditions
Unit
Gain
ISO
RLin
RLout
NF
P1dB
OIP3
Small Signal Gain [2]
Reverse Isolation
Input Return Loss
Output Return Loss
Noise Figure
Output Power at 1dB Gain Compression
Output 3rd Order Intercept Point [3]
Typical
dB12.514.816.5
dB
-
30
dB
-13
dB
-14
dB
-
4.6
dBm
-
22
dBm
-
25
-
Notes:
1) Specifications are derived from measurements in a 50 Ohm test environment. Aspects of the amplifier performance may be improved over a
narrower bandwidth by application of additional conjugate, linearity, or low noise matching.
2) All tested parameters guaranteed with measurement accuracy ± 0.5 dB for gain.
3) RFin1 = RFin2 = -5 dBm, Freq = 22GHz, Df = 100MHz
Table 4. RF Specifications [1]
(Freq = 22GHz, Vdd = 4V, Idd = 160mA, TA = 25°C, Zin = Zo = 50Ohm)
Symbol
Parameters and Test Conditions
Unit
Minimum
Gain
ISO
RLin
RLout
NF
P1dB
OIP3
-15
-
27
-13
-14
-
4.6
-19
-18.5
Small signal Gain
Reverse Isolation
Input Return Loss
Output Return Loss
Noise Figure
Output Power at 1dB Gain Compression
Output 3rd Order Intercept Point [3]
dB
dB
dB
dB
dB
dBm
dBm
Typical
Maximum
-
Notes:
1) Specifications are derived from measurements in a 50 Ohm test environment. Aspects of the amplifier performance may be improved over a
narrower bandwidth by application of additional conjugate, linearity, or low noise matching.
2) RFin1 = RFin2 = -5 dBm, Freq = 22GHz, Df = 100MHz
AMMP-5024 Typical Performance
(Vdd = 7V, Idd = 200mA, Vg2 = Open, TA = 25°C, Zin = Zo = 50Ohm)
20
0
0
-5
0
-40
S21
S12
-10
-10
RETURN LOSS (dB)
-20
ISOLATION (dB)
GAIN (dB)
10
-60
-15
-20
-25
-30
S21
S12
-35
-20
0
5
10
15
20
25
30
35
40
-80
-40
0
5
10
FREQUENCY (GHz)
Figure 1. Gain and Reverse Isolation.
30
35
40
35
40
40
20
OIP3 (dBm)
OUTPUT POWER (dBm)
25
50
25
15
30
20
10
P1dB
P3dB
5
0
0
5
10
15
20
25
30
35
10
40
FREQUENCY (GHz)
8
6
4
2
0
5
10
15
20
25
FREQUENCY (GHz)
Figure 5. Noise Figure.
0
5
10
15
Figure 4. Output IP3.
10
0
0
20
25
FREQUENCY (GHz)
Figure 3. Output Power (P1dB and P3dB).
NF (dB)
20
Figure 2. Return Loss (Input and Output).
30
15
FREQUENCY (GHz)
30
35
40
30
AMMP-5024 Typical Scattering Parameters
(Vdd = 7V, Idd = 200mA, TA = 25°C, Zin = Zo = 50Ohm)
Freq.
S11
S21
GHz
dB
Mag
Ang
dB
Mag
Ang
dB
S12
Mag
Ang
dB
S22
Mag
0.05
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
0.000141.290
0.001 -165.550
0.002 -99.050
0.00415.990
0.004
55.720
0.006 -127.830
0.008158.680
0.009
85.780
0.01113.470
0.013 -57.350
0.013 -135.610
0.014152.110
0.015
77.930
0.016
6.700
0.017 -69.860
0.019 -139.850
0.019145.780
0.021
70.520
0.024
-5.160
0.026 -85.970
0.028 -162.750
0.030116.180
0.031
35.000
0.033 -39.830
0.031 -110.330
0.036174.660
0.039
88.570
0.03615.030
0.038 -65.960
0.036 -143.090
0.039135.300
0.037
48.910
0.033 -34.570
0.033 -104.760
0.029154.650
0.018
79.650
0.024
-6.350
0.018 -102.940
0.022154.830
0.027
87.970
0.019
-5.950
0.048 -42.740
0.022 -90.950
0.064 -155.950
0.127115.270
0.193
33.330
0.248 -39.310
0.247 -104.940
0.191 -159.490
0.121153.100
0.018124.870
0.078 -172.790
0.058116.650
0.064174.450
0.170
94.380
0.233
-3.190
0.260 -99.380
0.210175.490
0.098118.490
0.108138.190
0.216
71.230
0.257 -24.200
0.220 -149.100
0.204
65.510
0.254 -33.300
0.253 -129.100
0.157132.130
0.026 -122.730
0.270112.700
0.45112.770
0.396 -88.900
0.108
78.600
0.385 -54.660
0.427 -121.060
0.269 -171.520
0.203 -149.510
0.317133.420
0.331
-8.060
0.377 -142.750
0.229111.160
0.140 -48.940
0.177 -87.100
-25.978
-26.744
-26.571
-26.930
-29.254
-19.848
-14.255
-11.138
-10.433
-12.506
-17.570
-17.725
-14.873
-13.815
-12.745
-10.716
-8.667
-7.590
-8.199
-10.463
-12.461
-13.659
-12.899
-10.155
-8.977
-8.885
-10.631
-12.342
-11.834
-10.876
-15.263
-20.051
-8.785
-4.750
-9.580
-13.936
-16.029
-11.205
-7.265
-5.714
-5.580
0.050173.71016.186
0.046117.22015.721
0.047
61.34015.557
0.04512.94015.263
0.035
6.46015.395
0.102
-6.58015.123
0.194 -58.16014.695
0.277 -115.08014.510
0.301179.95015.543
0.237104.57014.512
0.132
5.78014.440
0.130 -99.61014.711
0.180173.32014.513
0.204100.17015.232
0.231
25.40013.791
0.292 -51.69013.598
0.369 -128.15013.624
0.417153.76014.037
0.389
74.85013.957
0.300
-1.09014.036
0.238 -78.40014.291
0.208 -165.11014.069
0.227116.34013.220
0.311
34.53013.003
0.356 -42.09013.722
0.360 -126.57013.578
0.294125.64014.768
0.242
22.19015.031
0.256 -49.79014.375
0.286 -119.60013.914
0.173132.23013.992
0.09911.09013.096
0.364 -45.77012.628
0.579 -131.44013.436
0.332158.37013.170
0.201
78.06011.457
0.158 -43.06013.131
0.275 -128.41012.777
0.433159.22013.000
0.518
58.02013.086
0.526 -52.12011.090
6.446174.640
6.110100.990
5.996
24.710
5.797 -52.010
5.885 -129.670
5.704155.170
5.429
78.790
5.315
3.360
5.335 -71.300
5.316 -147.300
5.272137.020
5.439
59.010
5.317 -20.030
5.148 -97.380
4.893 -172.930
4.785110.940
4.800
32.800
5.034 -43.060
4.987 -120.390
5.033161.010
5.183
81.230
5.052
-2.200
4.582 -82.050
4.468 -157.240
4.854126.770
4.774
50.130
5.475 -33.080
5.643 -122.180
5.233159.050
4.963
72.680
5.008 -13.290
4.517 -97.250
4.279 -176.240
4.697104.860
4.55510.340
3.740 -67.360
4.535 -153.950
4.354115.460
4.467
23.260
4.511 -75.620
3.585 -179.700
-72.335
-58.370
-53.860
-49.134
-47.270
-44.616
-42.263
-40.891
-39.546
-38.049
-37.511
-36.835
-36.316
-35.782
-35.242
-34.507
-34.278
-33.476
-32.375
-31.781
-31.169
-30.415
-30.291
-29.612
-30.071
-28.925
-28.294
-28.914
-28.375
-28.988
-28.236
-28.635
-29.742
-29.755
-30.895
-35.014
-32.535
-34.865
-33.033
-31.534
-34.663
-26.454
-33.252
-23.888
-17.895
-14.298
-12.123
-12.138
-14.387
-18.374
-35.109
-22.144
-24.802
-23.867
-15.395
-12.660
-11.701
-13.556
-20.200
-19.304
-13.297
-11.796
-13.161
-13.817
-11.899
-11.948
-16.071
-31.606
-11.365
-6.919
-8.057
-19.323
-8.293
-7.399
-11.404
-13.866
-9.981
-9.601
-8.479
-12.795
-17.081
-15.054
Ang
Notes:
1) S-parameters are measured on R&D Evaluation Board with 50 Ohm traces at input and output. Effects of connectors and board traces are
included in results.
AMMP-5024 Typical Performance
(Vdd = 4V, Idd = 160mA, Vg2 = Open, TA = 25°C , Zin = Zo = 50Ohm)
20
0
0
-5
0
-40
S21
S12
-10
-10
RETURN LOSS (dB)
-20
ISOLATION (dB)
GAIN (dB)
10
-60
-15
-20
-25
-30
S11
S22
-35
-20
0
5
10
15
20
25
30
35
40
-80
-40
0
5
10
FREQUENCY (GHz)
30
35
40
35
40
50
25
40
OIP3 (dBm)
20
15
30
20
10
P1dB
P3dB
5
0
0
5
10
15
20
25
30
35
10
40
0
0
5
10
15
FREQUENCY (GHz)
Figure 9. Output IP3.
10
8
6
4
2
0
0
5
10
15
20
25
FREQUENCY (GHz)
Figure 10. Noise Figure.
20
25
FREQUENCY (GHz)
Figure 8. Output Power (P1dB and P3dB).
NF (dB)
25
Figure 7. Return Loss (Input and Output).
30
20
FREQUENCY (GHz)
Figure 6. Gain and Reverse Isolation.
OUTPUT POWER (dBm)
15
30
35
40
30
AMMP-5024 Typical Scattering Parameters
(Vdd = 4V, Idd = 160mA, TA = 25°C, Zin = Zo = 50Ohm)
Freq.
S11
S21
GHz
dB
Mag
Ang
dB
Mag
Ang
dB
S12
Mag
Ang
dB
S22
Mag
0.05 -25.975
1
-28.128
2
-30.831
3
-28.241
4
-24.184
5
-18.702
6
-14.730
7
-11.826
8
-10.975
9
-12.836
10
-17.716
11
-17.651
12
-14.886
13
-14.513
14
-13.644
1511.754
16
-9.429
17
-7.942
18
-8.189
19
-10.225
20
-12.340
21
-13.992
22
-13.705
23
-10.932
24
-9.671
25
-9.069
26
-10.111
27
-11.661
28
-11.753
29
-11.212
30
-15.324
31
-21.074
32
-11.267
33
-4.486
34
-8.316
35
-13.961
36
-15.198
37
-13.810
38
-8.901
39
-4.175
40
-3.037
0.003 -169.010
0.001 -171.660
0.002
95.150
0.003
5.870
0.003 -61.360
0.005 -136.060
0.006150.930
0.008
78.940
0.009
8.470
0.011 -63.760
0.011 -142.980
0.012145.670
0.013
71.210
0.014
2.890
0.015 -76.640
0.016 -144.320
0.018141.280
0.019
66.320
0.021
-9.190
0.023 -89.470
0.025 -167.210
0.028111.200
0.029
30.820
0.031 -44.140
0.030 -115.840
0.034169.820
0.037
87.000
0.03710.560
0.040 -69.280
0.038 -149.580
0.042130.670
0.041
40.680
0.038 -43.040
0.038 -110.990
0.031148.930
0.027
67.850
0.038 -21.850
0.036 -122.710
0.031130.050
0.045
85.060
0.048 -35.600
0.040 -50.830
0.011 -114.170
0.048 -156.480
0.107116.080
0.171
35.680
0.230 -34.710
0.245 -98.940
0.207 -154.490
0.138152.170
0.023
98.900
0.071 -170.310
0.051120.520
0.072175.400
0.177
93.210
0.234
-3.800
0.255 -99.180
0.203178.870
0.109130.040
0.121123.910
0.198
64.290
0.232 -25.240
0.202 -148.040
0.194
64.620
0.235 -29.680
0.251 -122.900
0.170146.520
0.029
95.370
0.218111.780
0.42317.340
0.418 -83.330
0.115101.450
0.390 -51.180
0.439 -118.200
0.326 -172.120
0.116 -148.940
0.310153.430
0.403
8.390
0.451 -135.880
0.298116.150
0.225 -45.140
0.109 -120.650
0.050174.63016.479
0.039108.03016.018
0.029
64.31015.889
0.039
46.52015.628
0.06216.64015.754
0.116 -19.78015.503
0.183 -65.59015.125
0.256 -116.98014.965
0.283 -179.33015.037
0.228106.43015.001
0.130
4.85014.909
0.131 -103.90015.229
0.181168.36015.064
0.196
93.98014.860
0.208
20.67014.476
0.258 -52.75014.332
0.338 -125.91014.399
0.401157.23014.751
0.390
78.11014.623
0.308
0.47014.727
0.242 -79.40015.088
0.200 -167.59014.916
0.206115.70014.032
0.284
36.14013.956
0.328 -37.33014.892
0.352 -118.94014.529
0.312133.92015.764
0.261
25.30016.279
0.258 -53.36015.868
0.275 -118.65015.610
0.171125.85015.777
0.088 -36.08014.830
0.273 -33.64014.219
0.597 -120.55014.902
0.384156.72015.145
0.200
76.25013.772
0.174 -50.95016.011
0.204 -143.15015.622
0.359179.80015.907
0.618
78.60017.068
0.705 -50.85015.714
6.667174.400
6.323101.970
6.229
26.560
6.045 -49.400
6.133 -126.150
5.959159.420
5.705
83.920
5.601
9.010
5.648 -64.980
5.624 -140.110
5.565144.780
5.774
67.790
5.665 -10.380
5.534 -86.830
5.294 -161.820
5.207122.500
5.248
44.800
5.465 -30.410
5.384 -106.690
5.449176.060
5.680
97.170
5.57014.300
5.030 -64.320
4.986 -137.590
5.554146.220
5.327
69.630
6.140 -10.430
6.515 -97.400
6.214 -176.310
6.032
96.880
6.15011.950
5.514 -72.680
5.140 -150.300
5.561134.360
5.717
43.150
4.882 -35.700
6.318 -120.610
6.041147.660
6.243
58.030
7.135 -38.810
6.105 -151.620
-51.615
-60.865
-54.525
-50.773
-49.843
-46.321
-43.909
-42.439
-41.144
-39.341
-39.078
-38.247
-37.729
-37.172
-36.737
-36.010
-35.110
-34.558
-33.641
-32.688
-31.995
-30.988
-30.770
-30.052
-30.344
-29.491
-28.633
-28.601
-28.074
-28.302
-27.638
-27.784
-28.440
-28.513
-30.177
-31.432
-28.308
-28.977
-30.175
-26.925
-26.470
-27.959
-39.098
-26.428
-19.381
-15.352
-12.753
-12.234
-13.687
-17.208
-32.601
-22.939
-25.802
-22.851
-15.068
-12.603
-11.888
-13.870
-19.273
-18.342
-14.080
-12.706
-13.899
-14.245
-12.565
-12.021
-15.400
-30.816
-13.237
-7.465
-7.579
-18.770
-8.175
-7.147
-9.731
-18.714
-10.162
-7.894
-6.915
-10.529
-12.977
-19.244
Ang
Note:
1) S-parameters are measured on R&D Evaluation Board with 50 Ohm traces at input and output. Effects of connectors and board traces are
included in results.
AMMP-5024 Typical Performance
20
0
10
-20
ISOLATION (dB)
GAIN (dB)
(Over Temperature, Vdd = 7V, Idd = 200mA, Zin = Zo = 50Ohm)
0
S21/25°C
S21/-40°C
S21/85°C
-10
-20
0
5
10
15
20
25
30
35
-40
-60
-80
40
S12/25°C
S12/-40°C
S12/85°C
0
5
10
FREQUENCY (GHz)
-10
-10
RETURN LOSS (dB)
RETURN LOSS (dB)
0
-20
5
10
15
20
25
35
40
30
35
-40
40
S22/25°C
S22/-40°C
S22/85°C
0
5
10
FREQUENCY (GHz)
15
20
25
30
35
40
FREQUENCY (GHz)
Figure 13. Input Return Loss and Temperature.
Figure 14. Output Return Loss and Temperature.
10
30
NF/25°C
NF/-40°C
NF/85°C
8
25
20
6
P1dB (dBm)
NF (dB)
30
-20
-30
S11/25°C
S11/-40°C
S11/85°C
0
25
Figure 12. Isolation and Temperature.
0
-40
20
FREQUENCY (GHz)
Figure 11. Gain and Temperature.
-30
15
4
15
10
2
0
0
5
10
15
20
25
30
FREQUENCY (GHz)
Figure 15. Noise Figure and Temperature.
P1dB/25°C
P1dB/-40°C
P1dB/85°C
5
35
40
0
0
5
10
15
20
25
FREQUENCY (GHz)
Figure 16. P1dB and Temperature.
30
35
40
Biasing and Operation
Recommended SMT Attachment
AMMP-5024 is biased with a single positive drain supply
(Vdd) a negative gate supply (Vg1) and has a positive
control gate supply (Vg2). For best overall performance
the recommended bias condition for the AMMP-5024 is
Vdd =7V and Idd = 200 mA. To achieve this drain current
level, Vg1 is typically between –2.5 to –3.5V. Typically, DC
current flow for Vg1 is –10 mA. Open circuit is the default
setting for Vg2 when not utilizing gain control.
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes. The
PCB material and mounting pattern, as defined in the
data sheet, optimizes RF performance and is strongly
recommended. An electronic drawing of the land pattern
is available upon request from Avago Sales & Application
Engineering.
Using the simplest form of assembly, the device is capable
of delivering flat gain over a 2–40 GHz range. However,
this device is designed with DC coupled RF I/O ports, and
operation may be extended to lower frequencies (<2
GHz) through the use of off-chip low-frequency extension
circuitry and proper external biasing components. With
low frequency bias extension it may be used in a variety
of time domain applications (through 40 Gb/s).
When bypass capacitors are connected to the AUX pads,
the low frequency limit is extended down to the corner
frequency determined by the bypass capacitor and the
combination of the on-chip 50 ohm load and small dequeing resistor. At this frequency the small signal gain
will increase in magnitude and stay at this elevated level
down to the point where the Caux bypass capacitor
acts as an open circuit, effectively rolling off the gain
completely. The low frequency limit can be approximated
from the following equation:
fCaux =
1
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder
paste. Please see recommended solder reflow profile.
Conductive epoxy is not recommended. Hand
soldering is not recommended.
4. Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temperature to avoid
damage due to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
2pCaux (Ro + RDEQ)
where:
Ro is the 50Ω gate or drain line termination resistor.
RDEQ is the small series dequeing resistor and 10Ω.
Caux is the capacitance of the bypass capacitor connected
to the AUX Drain and AUX Gate pad in farads.
With the external bypass capacitors connected to the
AUX gate and AUX drain pads, gain will show a slight
increase between 1.0 and 1.5 GHz. This is due to a series
combination of Caux and the on-chip resistance but
is exaggerated by the parasitic inductance (Lc) of the
bypass capacitor and the inductance of the bond wire
(Ld).
Input and output RF ports are DC coupled; therefore, DC
decoupling capacitors are required if there are DC paths.
(Do not attempt to apply bias to these pads.)
Manual Assembly
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout
is shown in Figure 19. The stencil has a solder paste
deposition opening approximately 70% to 90% of the PCB
pad. Reducing stencil opening can potentially generate
more voids underneath. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads. Considering
the fact that solder paste thickness will directly affect the
quality of the solder joint, a good choice is to use a laser
cut stencil composed of 0.127 mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline.
The combined PCB and stencil layout is shown in Figure 20.
Outline Drawing
1
2
0.011 [0.28]
0.018 [0.46]
3
0.114 [2.9]
0.014 [0.365]
3 2 1
0.016 [0.40]
A
8
AMMP
XXXX
YWWDNN
0.126 [3.2]
4
4
0.059 [1.5]
8
0.100 [2.54]
0.012 [0.30]
0.029 [0.75]
7
6 5
A
B
0.100 [2.54]
Front View
Side View
0.016 [0.40]
Symbol
Min
Max
A
0.198 (5.03)
0.213 (5.4)
B
0.0685 (1.74)
0.088 (2.25)
5
6
7
0.028 [0.70]
0.093 [2.36]
Back View
Dimensional tolerance for back view: 0.002" [0.05 mm]
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
Figure 17. Outline Drawing
Figure 18. Suggested PCB Material and Land Pattern
Figure 19. Stencil Outline Drawing (mm)
Figure 20. Combined PCB and Stencil Layouts
Carrier Tape and Pocket Dimensions
Device Orientation (Top View)
Part Number Ordering Information
Part Number
Devices per Container
AMMP-5024-BLKG10
AMMP-5024-TR1G100
AMMP-5024-TR2G
500
10
Container
Antistatic Bag
7” Reel
7” Reel
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The part names and contents of the hazardous substances in the electronic information products as shown below.
Names and Contents of the Toxic and Hazardous Substances or Elements in the Products
ѻકЁ᳝↦᳝ᆇ⠽䋼៪‫ܗ‬㋴ⱘৡ⿄ঞ৿䞣
Part Name
䚼ӊৡ⿄
100pF capacitor
Lead
(Pb) 䪙
(Pb)
Mercury
(Hg) ∲
˄Hg˅
Toxic and Hazardous Substances or Elements
᳝↦᳝ᆇ⠽䋼៪‫ܗ‬㋴
Cadmium
Hexavalent
Polybrominated
(Cd) 䬝
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biphenyl (PBB) ໮
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²
|
|
|
|
Polybrominated
diphenylether (PBDE)
໮⒈Ѡ㣃䝮˄PBDE˅
|
|:
indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ/T 11363-2006.
²: indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part
exceeds the concentration limit requirement as described in SJ/T 11363-2006.
(The enterprise may further explain the technical reasons for the “x” indicated portion in the table in accordance with
the actual situations.)
SJ/T 11363-2006 ᷛ‫ޚ‬㾘ᅮⱘ䰤䞣㽕∖ҹϟDŽ
SJ/T 11363-2006 ᷛ‫ޚ‬㾘ᅮⱘ䰤䞣㽕∖DŽ
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Note: EU RoHS compliant under exemption clause of “lead in electronic ceramic parts (e.g. piezoelectronic devices)”
For product availability and compliance information, please contact Avago distributors or Avago Sales & Marketing via
[email protected] For product technical information (termination finish, temperature profile, product
substance content etc.) please contact: [email protected]
This document further certifies that the materials declaration provided above by Avago Technologies is accurate.
AVAGO Technologies Product Stewardship
Malaysian Contact: Chan Gum Meng
Bayan Lepas FIZ Phase 3, 11900 Penang, Malaysia
E-mail: [email protected]
Malaysian contact: 604-610-5615
The information presented in this document is believed accurate and reliable. Data is the most current available to Avago Technologies at the time of preparation
and is issued as a matter of information only. No warranty as to accuracy or completeness is expressed or implied. The information in this document is subject to
change without notice. © Copyright Avago Technologies, 2005. Reproduction, adaptation, or translation without prior written permission is prohibited except as
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Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0465EN - August 29, 2007
Format Rev 5, 5 July 2007