APDS-9008 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet Description Features The APDS-9008 is a low cost analog-output ambient light photo sensor in miniature chipLED lead-free surface mount package. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as show in figure 2. The APDS-9008 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly. • Excellent responsivity Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS-9008 ambient light photo sensor module. You can contact them through your local sales representatives for additional details. - Close responsivity to the human eye • Miniature ChipLED Leadfree surface-mount package Height – 0.55 mm Width – 1.60 mm Depth – 1.50 mm • Low sensitivity variation across various light sources • Operating temperature : -40°C to 85°C • Vcc supply 1.6 to 5.5V • Lead-free package, RoHS compliance • Output linearity across wide illumination range • High output saturation voltage Applications • Detection of ambient light to control display backlighting Mobile devices – Mobile phones, PDAs Computing devices – Notebooks, Webpads Consumer devices – TVs, Video Cameras, Digital Still Camera • Automatic Residential and Commercial Lighting Management • Electronic Signs and Signals Ordering Information Part Number Packaging Type Package Quantity APDS-9008-020 Tape and Reel 6-pins Chipled package 2500 Typical Application Circuit VCC [1] APDS-9008 OUT [6] I/O Pins Configuration Table GND [4] LOAD Figure 1. Typical application circuit for APDS-9008 Pin Symbol Description 1 VCC VCC 2 NC No Connect 3 NC No Connect 4 GND Ground 5 NC No Connect 6 Iout Out Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50 °C /W Parameter Symbol Min. Max. Units Storage Temperature TS -40 85 °C Supply Voltage VCC 0 6 V Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA -40 85 °C Supply Voltage VCC 1.6 5.5 V CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 2 Conditions Electrical & Optical Specifications (Ta=25°C) Parameter Symbol Min. Typ. Max. Supply Current ICC Photo Current (I) I_PH1 Photo Current (II) I_PH2 44 Dark Current I_DARK 300 Light Current Ratio I_PH2/I_PH1 1.1 Rise Time Tr 5 ms Rl = 1Kohm, Lux = 100 Fall Time Tf 5 ms R1 = 1Kohm, Lux=100 Settling Time Tset 10 ms R1=2.4Kohm,Lux=100 Peak sensitivity wavelength λ 565 nm Propagation delay Td 5 ms Rl = 1Kohm, Lux = 100 Storage delay Ts 5 ms R1 = 1Kohm, Lux=100 Saturation voltage Vsat V R1 = 100Kohm, Lux = 100, Vcc=1.8V 42 28 40 52 Units Conditions µA Vcc =1.8V, Lux = 100 (2) µA Vcc =1.8V, Lux = 100 (2) µA Vcc =1.8V, Lux = 100 (1) nA Vcc =1.8V, Lux = 0 Incandescent light / Fluorescent light 1.5 Notes : 1. Illuminance by CIE standard light source (Incandescent lamp) 2. Fluorescence light is used as light source, however, white LED is substituted in a mass production process. Light Measurement Circuit and Waveforms Pin 1:Vcc I_pulse Pin 2,3,5: NC APDS-9008 I_pulse Pin 6:Iout Pin 4: GND Vout Tf Tr Td Ts Vcc pulse from pulse generator Vcc t Sensor output at load Vout 90 % t Tset 3 Tset 450.0E-6 1 9008 Spectral response Eye Response 400.0E-6 350.0E-6 Output Current [A] Relative response 0.8 0.6 0.4 300.0E-6 250.0E-6 200.0E-6 150.0E-6 100.0E-6 0.2 0 300 50.0E-6 400 500 600 700 Wavelength in nm 800 900 1000 1.40 1.20 1.20 1.10 1.00 1.00 0.80 0.90 0.60 0.70 0.20 0.60 -20 0 20 40 60 Temperature in Degrees 80 2.8 3.3 3.8 4.3 4.8 5.3 VCC Figure 5. Relative Iout Vs Vcc (T=25°C, 100 Lux) 1.20 1.00 REL AVG-ICC Relative Iout response 2.3 1.40 0.80 0.60 0.40 0.20 -90 -70 -50 -30 -10 10 30 Angle in Degrees Figure 6. Relative Iout Vs Angle ( Vcc=1.8V, T=25°C) 4 0.50 1.8 100 Figure 4. Relative Iout Vs Temp (Vcc=1.8v, 100 Lux) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 100 200 300 400 500 600 700 800 900 1000 LUX 0.80 0.40 0.00 -40 0 Figure 3. Average Iout Vs Lux (Vcc=1.8v, T=25°C, White LED source) Rel IOUT Relative Iout Figure 2. Relative Spectral Response Vs Wavelength 000.0E+0 50 70 90 0.00 -40 REL Avg-ICC Vs TEMP at 100LUX -20 0 20 40 60 Temperature in Degrees 80 Figure 7. Relative Average Icc Vs Temp ( Vcc=1.8V, T=25°C, 100 Lux) 100 1.40E-06 1.10 1.20E-06 1.00 1.00E-06 0.90 8.00E-07 IDark Rel ICC 1.20 0.80 0.70 4.00E-07 0.60 2.00E-07 0.50 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 VCC Figure 8. Relative average Icc Vs Vcc (T=25°C, 100 Lux) Vout (V) R=12k 1.6 R=10k 1.2 R=8.2k 0.8 R=6.8k R=4.7k 0.4 R=1k 0.0 0 200 400 600 800 LUX Figure 10. General Luminance Vs Typical Output Voltage (Vcc=1.8V, T=25°C, Light Source = White LED) 0.00E+00 -40 -20 0 20 40 Temp in Degrees Figure 9. Dark Current Vs Temp (Vcc=1.8V) 2.0 5 6.00E-07 1000 60 80 100 APDS-9008 Package Outline 6 APDS-9008 Tape and Reel Dimension 7 Moisture Proof Packaging UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) NO PARTS ARE NOT RECOMMENDED TO BE USED ENVIRONMENT LESS THAN 30 °C AND LESS THAN 60%RH YES PACKAGE IS OPENED LESS THAN 168 HOURS YES NO BAKING IS NECESSARY NO NO PACKAGE IS OPENED LESS THAN 15 DAYS YES PERFORM RECOMMENDED BAKING CONDITIONS All APDS-9008 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking Conditions: Recommended Storage Conditions: Storage Temperature 100°C to 300°C Relative Humidity below 60% RH Package Temperature Time Time from unsealing to soldering: In Reel 60°C 48 hours In Bulk 100°C 6 hours After removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. If times longer than 168 hours are needed, the parts must be stored in a dry box. * Baking should only be done once. 8 Recommended Reflow Profile MAX 260°C T - TEMPERATURE (°C) 255 R3 230 217 200 180 150 120 R2 R4 60 sec to 90 sec Above 217°C R5 R1 80 25 0 P1 HEAT UP 50 100 150 P2 SOLDER PASTE DRY 250 P4 COOL DOWN 300 t-TIME (SECONDS) Process Zone Symbol ∆T Maximum ∆T/∆time or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 P3, R4 P4, R5 200°C to 260°C 260°C to 200°C 200°C to 25°C 3°C/s -6°C/s -6°C/s Time maintained above liquidus point , 217°C > 217°C 60s to 120s Peak Temperature 260°C - Time within 5°C of actual Peak Temperature >255°C 20s to 40s Time 25°C to Peak Temperature 25°C to 260°C 8mins Cool Down The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different ∆T/∆time temperature change rates or duration. The ∆T/∆time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. Process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of 9 200 P3 SOLDER REFLOW solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 120 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. Appendix A. SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Aperture 1.2 Recommended Metal Solder Stencil Aperture Metal Stencil For Solder Paste Printing Stencil Aperture Land Pattern Solder Mask It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting. Aperture Opening 0.11 PCBA 1.6 1.7 Unit: mm Figure A1. Stencil and PCBA Figure A3. Solder Stencil Aperture 1.1 Recommended Land Pattern 1.3 Adjacent Land Keepout and Solder Mask Areas CL Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. 0.4 0.3 The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. 0.45 2.6 0.9 0.4 0.2 Mounting Center 2.7 0.4 Figure A2. Recommended Land Pattern Unit: mm 0.2 MIN. Figure A4. Adjacent Land Keepout and Solder Mask Areas 10 Appendix B. Optical Window Design for APDS-9008 1.0 Optical Window Dimensions To ensure that the performance of the APDS-9008 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9008. This minimum dimension that is recommended will ensure at least a ±35° light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. Table 1 and Figure B3 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585. D1 T WD Flat D2 D1 L The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure B1 and B2 illustrate the two types of window that we have recommended which could either be a flat window or a flat window with light pipe. Top View Z APDS-9008 Light Receving Area Figure B3. Recommended Window Dimensions WD: Working Distance between window front panel & APDS-9008 D1: Window Diameter T: Thickness L: Length of Light Pipe D2: Light Pipe Diameter Z: Distance between window rear panel and APDS-9008 Table 1. Recommended dimension for optical window All dimensions are in mm Figure B1. Window Size Determination for Flat Window WD (T+L+Z) Flat Window (L=0.0) Flat window with Light Pipe (D2=1.5; Z =0.5) Z D1 D1 L 1.5 0.5 2.25 - - 2.0 1.0 3.25 - - 2.5 1.5 4.25 - - 3.0 2.0 5.00 2.5 1.5 The window should be placed directly on top of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5mm to optimize the performance of APDS-9008. Figure B2. Window Design of Flat Window with Light Guide 11 2.1 Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. Table 2. Recommended Plastic Materials Material number Visible light transmission Refractive index Makrolon LQ2647 87% 1.587 Makrolon LQ3147 87% 1.587 Makrolon LQ3187 85% 1.587 Appendix C . General Application Guide for APDS-9008 The APDS-9008 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. APDS-9008 consists of a photo sensor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9008 can easily be integrated into systems that use ADC input which is available for sampling of the external source, as shown in figure C1 below. The amount of converted voltage, Vout, is mainly dependant proportionally on the photo current which generated For product information and a complete list of distributors, please go to our web site: by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increase the output voltage. Brightness is measured as “LUX” unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for “LUX” measurement. Light sources with the same LUX level appear at the same brightness to the human eyes. Vcc Light Source 1 APDS-9003 2,3,4,5 6 Vout C RL A/D microcontroller NC Figure C1: Configuration of APDS-9008 Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. Light source e.g. fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10uF, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. AV02-1169EN - June 15, 2008