BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation The Back Contact Resistor (BCR) series single-value back-contact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space. • Resistor material: Tantalum nitride, self-passivating • Moisture resistant The BCRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The BCRs are 100 % electrically tested and visually inspected to MIL-STD-883. APPLICATIONS Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.) TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 5% 2% 1% 0.5 % 0.2 % CLASS H* CLASS K* ± 25 ppm/°C 010 056 ± 50 ppm/°C 002 061 027 059 008 052 ± 100 ppm/°C ± 250 ppm/°C 10 Ω 20 Ω 50 Ω PROCESS CODE 0.1 % 360 kΩ 1 MΩ 200 kΩ 620 kΩ 100 Ω 200 Ω 1 kΩ *MIL-PRF-38534 inspection criteria STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 100 Ω - 250 kΩ < 100 Ω or > 251 kΩ - 35 dB typ. - 20 dB typ. Moisture resistance, MIL-STD-202 Method 106 ± 0.5 % max. ΔR/R Stability, 1000 h, + 125 °C, 125 mW ± 1.0 % max. ΔR/R Operating Temperature Range - 55 °C to + 125 °C Thermal Shock, MIL-STD-202, Method 107, Test Condition F ± 0.25 % max. ΔR/R High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R Dielectric Voltage Breakdown 200 V Insulation Resistance 1012 min. Operating Voltage 75 V max. DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 5 x Rated Power Short-Time Overload, + 25 °C, 5 s www.vishay.com 54 For technical questions, contact: [email protected] 250 mW ± 0.25 % max. ΔR/R Document Number: 61023 Revision: 12-Mar-08 BCR Thin Film, Back-Contact Resistor Vishay Electro-Films CHIP RESISTORS DIMENSIONS in inches 0.020 0.016 0.020 0.004 TYPICAL RANGE 10 Ω - 23 Ω TYPICAL RANGE 24 Ω - 220 Ω TYPICAL RANGE 1.6 kΩ - 1 MΩ TYPICAL RANGE 180 Ω - 2.2 kΩ Note: • Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection. SCHEMATIC Bond Pad Back of Chip MECHANICAL SPECIFICATIONS in inches PARAMETER Chip Size 0.020 x 0.020 ± 0.002 (0.50 x 0.50 ± 0.05 mm) Chip Thickness 0.010 ± 0.003 (0.253 ± 0.05 mm) Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO2 Resistor Material Tantalum nitride, self-passivating Bonding Pad Size 0.004 x 0.004 (0.100 x 0.100 mm) Number of Pads 1 Pad Material 10 kÅ minimum aluminum Backing 3 kÅ minimum gold Recommended Attachment Method Options: Eutectic or conductive epoxy Gold bonding pads, 15 kÅ minimum thickness Consult Applications Engineer ORDERING INFORMATION Example: 100 % visual, 16 kΩ, ± 1 %, ± 250 ppm/°C TCR, aluminum pads, class H visual inspection W INSPECTION/ PACKAGING W = 100 % visually inspected parts in matrix tray per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4 % AQL) Document Number: 61023 Revision: 12-Mar-08 BCR PRODUCT FAMILY 008 PROCESS CODE See Process Code table 1600 RESISTANCE VALUE Use first 4 digits significant digits of the resistance For technical questions, contact: [email protected] 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 F TOLERANCE CODE B = 0.1 % C = 0.2 % D = 0.5 % F = 1.0 % G = 2.0 % H = 2.5 % J = 5.0 % K = 10 % www.vishay.com 55 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1