ASMT-QxB2-Fxxxx Super 0.5 W Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5 W Power PLCC-4 SMT LED is an extension of Power PLCC-4 SMT LEDs. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. • Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9 mm) • High reliability LED package due to enhanced silicone resin material • Mid-power intensity brightness with optimum flux performance using AllnGaP chip technologies • Available in Red, Red Orange and Amber colors • High optical efficiency • Available in 8 mm carrier tape and 7 inch reel • Low thermal resistance • Super wide viewing angle at 120 degrees • Longer life time with minimum degradation due to enhanced Silicone resin material • JEDEC MSL 2a The Super 0.5 W Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. These LEDs are compatible with the IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. Super 0.5 W Power PLCC-4 SMT LED is available in red, red orange and amber colors. Applications 1. Exterior automotive • Turn signals • Side repeaters • CHSML • Rear combination lamp • Side markers • Truck clearance lamp 2. Electronic signs and signals • Channel lettering • Contour lighting • Indoor variable message sign 3. Office automation, home appliances, industrial equipment • Front panel backlighting • Push button backlighting • Display backlighting CAUTION: ASMT-QxB2-Fxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Drawing 1.9 ± 0.2 2.8 ± 0.2 0.8 ± 0.1 2.2 ± 0.2 C 0.15 (TYP.) ∅ 2.40 C 1.15 ± 0.05 3.6 ± 0.2 3.2 ± 0.2 0.41 (TYP.) 0.56 (TYP.) 0.8 ± 0.3 A A ANODE MARKING NOTES: 1. 2. 3. 4. 0.5 ± 0.1 2.30 ± 0.05 0.7 ± 0.1 ALL DIMENSIONS IN MILLIMETERS. LEAD POLARITY AS SHOWN IN FIGURE 12. TERMINAL FINISH: Ag PLATING. ENCAPSULATION MATERIAL: SILICONE RESIN. Figure 1. Package drawing Table 1. Device Selection Guide Luminous Flux, FV[1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Amber ASMT-QAB2-FDE0E 9.0 11.4 15.0 150 Dice Technology AlInGaP Red Orange ASMT-QHB2-FEF0E 11.5 14.0 19.5 150 AlInGaP Red ASMT-QRB2-FCD0E 7.0 9.8 11.5 150 AlInGaP Notes: 1. FV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = ±12%. Part Numbering System A S M T – Q X1 B 2 – F X2 X3 X4 X5 Packaging Option Color Bin Selection Max. Flux Bin Min. Flux Bin LED Chip Color Table 2. Absolute Maximum Ratings (TA = 25°C) Parameters ASMT-QxB2-Fxxxx DC Forward Current[1] 150 mA Peak Forward Current[2] 200 mA Power Dissipation 470 mW Reverse Voltage 5V Junction Temperature 125°C Operating Temperature -40°C to +110°C Storage Temperature -40°C to +110°C Notes: 1. Derate l inearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz. Table 3. Optical Characteristics (TA = 25°C) Dominant Viewing Luminous Luminous Wavelength Angle 2q1/2[2] Efficacy hV[3] Efficiency lD[1] (nm) (Degrees) (lm/W) he(lm/W) Dice Technology Typ. Color Part Number Amber ASMT-QAB2-Fxxxx AlInGaP Luminous Intensity /Total Flux[4,5] IV (mcd) / ΦV Fn (lm) Typ. Typ. Typ. Typ. 594.5 120 450 28 0.30 Red Orange ASMT-QHB2-Fxxxx AlInGaP 617.0 120 210 35 0.30 Red 624.0 120 170 21 0.30 ASMT-QRB2-Fxxxx AlInGaP Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = IV/hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 4. Fn is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions. Table 4. Electrical Characteristics (TA = 25°C) Forward Voltage VF (Volts) @ IF = 150 mA Reverse Voltage VR @ 100 µA Part Number Typ. Max. Min. ASMT-QAB2-Fxxxx 2.70 3.25 5 60 ASMT-QHB2-Fxxxx 2.70 3.25 5 60 ASMT-QRB2-Fxxxx 3.10 3.55 5 60 Thermal Resistance RqJ-P (°C/W) 1.0 AlInGaP RED-ORANGE 0.9 AlInGaP AMBER RELATIVE INTENSITY 0.8 AlInGaP RED 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480 530 580 630 680 730 780 WAVELENGTH – nm Figure 2. Relative intensity vs. wavelength 200 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 150 mA) FORWARD CURRENT – mA 1.2 AlInGaP AMBER 180 160 140 120 100 80 60 AlInGaP RED 40 AlInGaP RED-ORANGE 20 0 0 1 2 3 1.0 AMBER 0.8 0.6 RED/RED-ORANGE 0.4 0.2 0 4 0 50 FORWARD VOLTAGE – V 160 MAXIMUM FORWARD CURRENT – mA 2.0 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 25 °C) 200 Figure 4. Relative intensity vs. forward current 2.2 AMBER 1.8 RED-ORANGE 1.6 1.4 1.2 1.0 0.8 RED 0.6 0.4 0.2 -25 0 25 50 75 100 JUNCTION TEMPERATURE – °C Figure 5. Relative intensity vs. temperature 150 DC FORWARD CURRENT – mA Figure 3. Forward current vs. forward voltage 0 -50 100 125 RθJA = 80°C/W 140 RθJA = 100°C/W 120 RθJA = 110°C/W 100 RθJA = 130°C/W 80 60 40 20 0 0 20 40 60 80 100 120 AMBIENT TEMPERATURE – °C Figure 6a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C, RqJ-A = 130°C/W, 110°C/W, 100°C/W and 80°C/W. 630 160 AlInGaP RED RθJP = 60°C/W 120 CURRENT – mA DOMINANT WAVELENGTH – nm 140 100 80 60 40 20 0 0 20 40 60 80 100 620 AlInGaP RED-ORANGE 610 600 AlInGaP AMBER 590 580 120 0 Figure 6b. Maximum forward current vs. solder point temperature. Derated based on TJMAX = 125°C, RJP = 60°C/W. 100 150 200 Figure 7. Dominant wavelength vs. forward current – AlInGaP devices 0.15 1.0 0.9 0.10 NORMALIZED INTENSITY FORWARD VOLTAGE SHIFT (V) 50 FORWARD CURRENT – mA TEMPERATURE – °C 0.05 0 -0.05 -0.10 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -0.15 -50 -25 0 25 50 75 0 -90 100 TJ – JUNCTION TEMPERATURE – °C Figure 8. Forward voltage shift vs. temperature -60 -30 0 30 60 ANGULAR DISPLACEMENT – DEGREES Figure 9. Radiation pattern 10 - 30 SEC. D TEMPERATURE 255 - 260 °C 217 °C 200 °C 3 °C/SEC. MAX. -6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. TIME (Acc. to J-STD-020C) Note: Diameter "D" should be smaller than 2.2mm Figure 11. Recommended Pb-free reflow soldering profile Figure10. Recommended pick and place nozzle size Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. 90 2.4 0.6 0.9 X 6 1.3 x 6 C C C 0.4 C 1.4 A A A 4.6 A A A 0.3 ANODE MARKING SOLDER MASK A ANODE C CATHODE ANODE MARKING MINIMUM 55 mm2 OF ANODE PAD FOR IMPROVED HEAT DISSIPATION Figure 12. Recommended soldering pad pattern TRAILER 200 mm MIN. FOR ∅180 REEL. 200 mm MIN. FOR ∅330 REEL. COMPONENT LEADER 480 mm MIN. FOR ∅180 REEL. 960 mm MIN. FOR ∅330 REEL. C A USER FEED DIRECTION Figure 13. Tape leader and trailer dimensions ∅1.5 + 0.1 –0 4 ± 0.1 2 ± 0.05 3.6 ± 0.1 1.75 ± 0.1 B A A 5.5 ± 0.05 12 C C A A + 0.3 – 0.1 3.8 ± 0.1 8 ± 0.1 ∅1 + 0.1 –0 B 0.229 ± 0.01 VIEW B-B 3.45 ± 0.1 VIEW A-A ALL DIMENSIONS IN mm. Figure 14. Tape dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 15. Reeling orientation Device Color (X1) Color Bin Select (X4) A Amber Individual reel will contain parts from one full bin only. H Red Orange X4 R Red 0 Full Distribution A 1 and 2 only B 2 and 3 only C 3 and 4 only Individual reel will contain parts from one bin only. D 4 and 5 only X2 Min Flux Bin E 5 and 6 only Max Flux Bin G 1, 2 and 3 only H 2, 3 and 4 only J 3, 4 and 5 only K 4, 5 and 6 only M 1, 2, 3 and 4 only N 2, 3, 4 and 5 only P 3, 4, 5 and 6 only R 1, 2, 3, 4 and 5 only S 2, 3, 4, 5 and 6 only Z Special Color Bin Flux Bin Select (X2X3) X3 Flux Bin Limits Bin ID Min. (lm) Max. (lm) A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 D 9.00 11.50 E 11.50 15.00 F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 I 33.00 43.00 J 43.00 56.00 K 56.00 73.00 Tolerance of each bin limit = ±12%. Color Bin Limits Amber/Yellow Min. (nm) Max. (nm) 2 583.0 586.0 3 586.0 589.0 4 589.0 592.0 5 592.0 595.0 6 595.0 598.0 Red Orange Min. (nm) Max. (nm) 1 611.0 616.0 2 616.0 620.0 3 620.0 625.0 Red Min. (nm) Max. (nm) Full Distribution 620.0 635.0 Tolerance of each bin limit = ±1 nm. VF Binning Moisture Sensitivity Bin Min. Max. 2D 2.35 2.50 2E 2.50 2.65 2F 2.65 2.80 2G 2.80 2.95 2H 2.95 3.10 2J 3.10 3.25 2K 3.25 3.40 2L 3.40 3.55 This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. Tolerance of each bin = ±0.1 V. Packaging Option (X5 ) Option Test Current Package Type Reel Size E 150 mA Top Mount 7 Inch Handling Precaution The encapsulation of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. This might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detailed information. For product information and a complete list of distributors, please go to our website: A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C/60%RH at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours. C. Control for unfinished reel - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB needs to be stored in sealed MBB with desiccant or desiccator at <5% RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - “10%” or “15%” HIC indicator turns pink. - The LEDs are exposed to condition of >30°C/60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60 ± 5°C for 20 hours. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0232EN - July 3, 2007