ASMT-QWB2-Nxxxx Super 0.5W White Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5W White Power PLCC-4 SMT LED is first white mid-Power PLCC-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. • Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm) • High reliability LED package due to enhanced silicone resin material • Mid-Power intensity brightness with optimum flux performance using InGaN chip technologies • Available in Cool White • High optical efficiency 30lm/W • Available in 8mm carrier tape and 7 inch reel • Low Thermal Resistance 60 °C/W • Super wide viewing angle at 120° The Super 0.5W White Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. These LEDs are compatible with the IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-thewave soldering process. • JEDEC MSL 2a Applications 1. Interior automotive a. Instrument panel backlighting b. Central console backlighting c. Navigation and audio system backlighting d. Dome/Map lighting e. Push button backlighting f. Puddle lamp g. Glove compartment illumination 2. Exterior automotive a. Number plate illumination b. Rear reverse lamp indicator 3. Electronic signs and signals a. Decorative lighting 4. Office automation, home appliances, industrial equipment a. Panel/button backlighting b. Display backlighting CAUTION: ASMT-QWB2-Nxxxx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Drawing Note: 1. All Dimensions in millimeters. 2. Lead Polarity as shown in Figure 11. 3. Terminal Finish: Ag plating 4. Encapsulation material: Silicone resin Figure 1. Package Drawing Table 1. Device Selection Guide Luminous Flux, FV [1] (lm) Color Part Number White ASMT-QWB2-NEF0E 11.5 Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology 17.0 19.5 150 InGaN Notes: 1. FV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = ±12% Part Numbering System A S M T – Q X1 B 2 – N X2 X3 X4 X5 Packaging Option Colour Bin Selection Max. Flux Bin Min. Flux Bin LED Chip Color Table 2. Absolute Maximum Ratings (TA = 25 °C) Parameters ASMT-QWB2-Nxxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 513 mW Reverse Voltage Not Recommended for Reverse Bias Junction Temperature 125 °C Operating Temperature -40 °C to +110 °C Storage Temperature -40 °C to +110 °C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TA = 25 °C) Dice Technology Color Part Number White ASMT-QWB2-Nxxxx InGaN Typical Chromaticity Coordinates[1] Viewing Angle 2l½[2] (Degrees) Luminous Efficacy hV[3] (lm/W) Luminous Efficiency he (lm/W) Luminous Intensity / Total Flux IV (cd) / fV (lm) x y Typ. Typ. Typ. Typ. 0.31 0.31 120 289 30 0.35 Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens / watt. 4. φV is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions. Table 4. Electrical Characteristics (TA = 25 °C) Forward Voltage VF (Volts) @ IF = 150 mA Part Number Typ. Max. Thermal Resistance RqJ-P (°C/W) ASMT-QWB2-Nxxxx 3.6 4.1 60 1.0 350 0.9 300 FORWARD CURRENT - mA RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 380 400 420 440 460 480 500 520 540 560 580 600 620 640 660 680 700 720 740 760 780 WAVELENGTH - nm Figure 2. Relative Intensity Vs. Wavelength 200 150 100 50 0.1 0.0 250 0 0 1 2 3 4 FORWARD VOLTAGE - V Figure 3. Forward Current Vs. Forward Voltage. 5 1.4 1.2 1.2 NORMALIZED LUMINOUS INTENSITY RELATIVE LUMINOUS FLUX (NORMALIZATION AT 150mA) 1 0.8 0.6 0.4 0.2 0 25 50 75 100 DC FORWARD CURRENT - mA 125 150 -25 0 25 50 75 100 125 160 140 Rθ JA = 90°C/W 120 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 0.2 Figure 5. Relative Intensity Vs. Temperature Rθ JA = 110°C/W 100 80 60 40 120 Rθ JP = 60°C/W 100 80 60 40 20 20 0 20 40 60 80 AMBIENT TEMPERATURE - °C 100 0 120 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 125°C, RqJ-A = 90°C/W and 110 °C/W. 40 60 80 SOLDER POINT TEMPERATURE - °C 100 120 0.9 0.1 0.05 0 25 50 -0.05 -0.1 -0.15 JUNCTION TEMPERATURE - °C Figure 7. Forward Voltage Shift Vs. Temperature. 75 100 NORMALIZED INTENSITY 0.8 0.15 -25 20 1 0.2 0 0 Figure 6b. Maximum forward current vs. solder point temperature. Derated Based on TJMAX = 125°C, RqJP=60°C/W 0.25 FORWARD VOLTAGE SHIFT - V 0.4 JUNCTION TEMPERATURE - °C 140 0.6 -50 160 -50 0.8 0 0 Figure 4. Relative Flux vs. Forward Current 0 1 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation Pattern 60 90 D Figure 10. Recommended Pb-free Reflow Soldering Profile. Note: Diameter "D" should be smaller than 2.2mm Figure 9. Recommended Pick and Place Nozzle Size Figure 11. Recommended Soldering Pad Pattern. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components Figure 12. Tape Leader and Trailer Dimensions. Figure 13. Tape Dimensions. Figure 14. Reeling Orientation. This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - “10%” or “15%” HIC indicator turns pink. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60±5°C for 20 hours. Device Color (X1) W White Flux Bin Select (X2X3) Individual reel will contain parts from one bin only X2 Min Flux Bin X3 Max Flux Bin Flux Bin Limits Bin ID Min. (lm) Max. (lm) A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 D 9.00 11.50 E 11.50 15.00 F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 I 33.00 43.00 J 43.00 56.00 K 56.00 73.00 Tolerance of each bin limit = ± 12% Color Bin Select (X4) Individual reel will contain parts from one full bin only. 0 Full Distribution A 1 and 2 only B 2 and 3 only C 3 and 4 only D 4 and 5 only E 5 and 6 only G 1, 2 and 3 only H 2, 3 and 4 only J 3, 4 and 5 only K 4, 5 and 6 only M 1, 2, 3 and 4 only N 2, 3, 4 and 5 only P 3, 4, 5 and 6 only R 1, 2, 3, 4 and 5 only S 2, 3, 4, 5 and 6 only Z Special Color Bin Color Bin Limits VF Bin Limits Bin ID 1 2 3 4 5 6 7 8 Limits (Chromaticity Coordinates) Bin ID Min. Max. x 0.296 0.291 0.310 0.313 S5 3.20 3.50 y 0.259 0.268 0.297 0.284 S6 3.50 3.80 S7 3.80 4.10 x 0.291 0.285 0.307 0.310 y 0.268 0.279 0.312 0.297 x 0.313 0.310 0.330 0.330 y 0.284 0.297 0.330 0.310 x 0.310 0.307 0.330 0.330 Option Test Current Package Type Reel Size y 0.297 0.312 0.347 0.330 E 150mA Top Mount 7 Inch x 0.330 0.330 0.338 0.352 y 0.310 0.330 0.342 0.344 x 0.330 0.330 0.347 0.345 y 0.330 0.347 0.371 0.352 x 0.352 0.338 0.364 0.360 y 0.344 0.342 0.380 0.357 x 0.345 0.347 0.367 0.364 y 0.352 0.371 0.401 0.380 Tolerance of each bin limit = ±0.1V Packaging Option (X5) Y - COORDINATE Tolerance of each bin limit = ±0.02. X - COORDINATE Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should b e held on the body only. Please refer to Avago Application Note AN 5288 for detail information. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0209EN - July 3, 2007