HDJD-S722-QR999 Color Sensor Data Sheet Description Features Avago Technologies’ color sensor is a high performance, small in size, cost effective light to voltage converting sensor. The sensor combines a photodiode array and three trans-impedance amplifiers in a single monolithic CMOS IC solution. With a Red (R), Green (G) and Blue (B) color filters coated over the photodiode array, the sensor converts R, G, B light to analog voltage outputs, denoted by VROUT, VGOUT and VBOUT, respectively. The sensor is packaged in a 5x5x1 (mm) surface mount QFN-16 package. • Convert light to R, G, B voltage output • Monolithic CMOS IC solution with integrated R, G, B color filter, photodiode array, trans-impedance amplifier in one chip • 3 sets of 3x3 photodiode array design minimize the effect of contamination and optical aperture misalignment • Small in size 5x 5x1 mm • Independent gain selection options for each R, G, B channel Applications Avago Technologies’ color sensor is ideal for open-loop color identification and closed-loop color point control. The sensor is designed for low illuminance applications including color detection, environmental lighting, industrial process, etc. With R, G, B photo-sensor and amplifier integrated in a single 5x5x1 (mm) package, Avago Technologies’ color sensor provides a high performance, small in size and cost effective solution to color sensing. ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge. AVAGO TECHNOLOGIES’ PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. Package Dimension 5 6 Part Numbering System 7 8 HDJD-S 7 X X-X X X X X 4 9 3 10 2 11 1 12 16 15 14 13 BOTTOM VIEW 16L QFN 5X5 (0.8) Gain Selection (GS) Option 999: GS 00,01 or 10 Packaging Type R: Tape and Reel Product Packaging Q: QFN Product ID 22: Component without IR Filter (0.3) (3.2) 5.0 ± 0.15 (3.2) 5.0 ± 0.15 1.0 ± 0.15 NOTE: DIMENSIONS ARE IN MILLIMETERS (mm) Pin Out for HDJD-S722-QR999 Pin Pin Name Normal Operation Pin 1 VBOUT Analog output voltage for BLUE Pin 2 VGOUT Analog output voltage for GREEN Pin 3 VROUT Analog output voltage for RED Pin 4 VDD 5 V DC Supply Pin 5 GND Ground Pin 6 GSGRN1 Gain Selection Green bit 1 Pin 7 GND Ground Pin 8 GSRED1 Gain Selection Red bit 1 Pin 9 GSRED0 Gain Selection Red bit 0 Pin 10 NC No connection Pin 11 NC No connection Pin 12 GSBLUE0 Gain Selection Blue bit 0 Pin 13 GSBLUE1 Gain Selection Blue bit 1 Pin 14 GND Ground Pin 15 GSGRN0 Gain Selection Green bit 0 Pin 16 GND Ground Theory of Operation Sensor IC Block Diagram The integral R, G, B color filters on the photodiode array detect the R, G, B components of the light falling on the sensor. The photodiode converts the R, G, B light components into photocurrents. The integrated transimpedence amplifiers for R, G, B components then convert the photocurrent to analog voltage outputs. The voltage output of each R, G, B channel increases linearly with increasing light intensity. GS (1:0) RF CF VDD5 – + GND VROUT TRANSIMPEDANCE AMP GS (1:0) RF CF RED GAIN SELECTION GSRED (1:0) GREEN GAIN SELECTION GSGRN (1:0) – + VGOUT TRANSIMPEDANCE AMP GS (1:0) RF CF BLUE GAIN SELECTION GSBLUE (1:0) – + VBOUT TRANSIMPEDANCE AMP Absolute Maximum Ratings[1,2] Parameter Supply Voltage Storage Temperature Operating Temperature Human Body Model ESD Rating Symbol VDD TS TA ESDHBM Min. 4.5 -40 -40 Max. 5.5 100 85 1 Unit V °C °C kV Notes Notes: 1. Subjecting the part to stresses beyond those listed under this section may cause permanent damage to the device. These are stress ratings only and do not imply that the devices will function beyond these ratings. Exposure to the extremes of these conditions for extended periods may affect device reliability. 2. Unless otherwise specified, voltages are referenced to ground. Recommended Operating Conditions Parameter Symbol Operating Temperature TA Supply Voltage VDD Min. 0 4.5 Typ. 25 5.0 Max. 70 5.5 Units °C V Notes A decoupling capacitor of 100 nF between VDD and ground is recommended. Operating Conditions and Electrical Requirements Electrical Characteristics at VDD = 5 V, TA = 25°C, RL = 68 kΩ Parameter Symbol Remark Min. Dark Voltage VD Ee = 0 Max. Output Voltage Swing VOMAX Supply Current IDD Ee = 0 Irradiance Responsivity GS:10, lP = 460 nm[1] (Blue Channel) Re GS:10, lP = 542 nm[2] (Green Channel) GS:10, lP = 645 nm[3] (Red Channel) Irradiance Responsivity GS:01, lP = 460 nm[1] (Blue Channel) Re GS:01, lP = 542 nm[2] (Green Channel) GS:01, lP = 645 nm[3] (Red Channel) Irradiance Responsivity GS:00, lP = 460 nm[1] (Blue Channel) Re GS:00, lP = 542 nm[2] (Green Channel) GS:00, lP = 645 nm[3] (Red Channel) Saturation Irradiance[4] GS:10, lP = 460 nm[1] (Blue Channel) GS:10, lP = 542 nm[2] (Green Channel) GS:10, lP = 645 nm[3] (Red Channel) [4] Saturation Irradiance GS:01, lP = 460 nm[1] (Blue Channel) GS:01, lP = 542 nm[2] (Green Channel) GS:01, lP = 645 nm[3] (Red Channel) Saturation Irradiance[4] GS:00, lP = 460 nm[1] (Blue Channel) GS:00, lP = 542 nm[2] (Green Channel) GS:00, lP = 645 nm[3] (Red Channel) Output Rise Time tr GS:00 to GS01; Test Condition[5] (min Vo = 0V, peak Vo = 2V) GS:10; Test Condition[5] (min Vo = 0V, peak Vo = 2V) Output Fall Time tf GS:00 to GS01; Test Condition[5] (min Vo = 0V, peak Vo = 2V) GS:10; Test Condition[5] (min Vo = 0V, peak Vo = 2V) Typ. Max. Unit 15 mV 4.8 V 2.5 mA 15 19 V/(mW/cm2) 27 9 11 V/(mW/cm2) 16 5 6 V/(mW/cm2) 9 0.32 0.25 mW/cm2 0.18 0.53 0.44 mW/cm2 0.30 0.96 0.80 mW/cm2 0.53 45 µs 220 50 µs 240 Notes: 1. Test condition: using blue diffuse light of peak wavelength (lP) 460 nm and spectral half width (Dl1/2) 25 nm as light source. 2. Test condition: using green diffuse light of peak wavelength (lP) 542 nm and spectral half width (Dl1/2) 35 nm as light source. 3. Test condition: using red diffuse light of peak wavelength (lP) 645 nm and spectral half width (Dl1/2) 20 nm as light source. 4. Saturation irradiance = (Max. output voltage swing)/(Irradiance responsivity). 5. Test condition: The rise and fall time is measured with RC lowpass filter added to sensor output: Gain Selection Rext Cext GS:00 to GS:01 15 kΩ 1 nF GS:10 15 kΩ 6.8 nF RED CHANNEL R C RED CHANNEL SIGNAL GENERATOR – + + – VRout Vout Rext Cext LED RC LOWPASS FILTER TEST CIRCUIT FOR ILLUSTRATION PURPOSE, ONLY RED CHANNEL IS SHOWN. THE SAME CIRCUIT APPLIES TO GREEN AND BLUE CHANNELS. Gain Selection Feedback Resistor Table GS: Bit 1 Bit 0 0 0 0 1 1 0 Feedback Resistor, RF 4 MΩ 7 MΩ 12 MΩ Notes: 1. Gains selections, GS: Bit 1 Bit 0 are applicable for each Red, Green and Blue Channel. 2. Gain selections for each channel can be selected independently of each other. 3. Feedback resistor value is proportional to responsivity. Refer to block diagram below. 4. 0 indicates that the pin is connected to ground. 1 indicates no connection. GS (1:0) RF CF – + TRANSIMPEDANCE AMP Typical Characteristics 1.2 NORMALIZED SENSITIVITY 1.0 RED 0.8 0.6 0.4 GREEN BLUE 0.2 0 350 450 550 650 750 WAVELENGTH (nm) Figure 1. Spectral responsivity. Note: Test condition is when Gain Selection Jumpers are set to GSBLUE1=0 GSGRN1=0 GSRED1=0 GSBLUE0=1 GSGRN0=1 GSRED0=1 in which 0 = connect to Ground, 1 = no connection. Refer to Gain Selection Feedback Resistor Table. 4.8 4.4 0.025 4.0 3.6 3.2 VOLTAGE OUTPUT – VO (V) VD – DARK VOLTAGE (V) 0.03 0.02 0.015 0.01 0.005 0 -40 -20 0 20 40 60 80 GS:10 2.4 2.0 1.6 1.2 0.8 0.4 0 0 4.8 4.4 GS:00 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 0 0.2 0.4 0.6 0.8 1.0 IRRADIANCE – Ee (mW/cm2) Figure 4. Voltage output of Green Channel vs. irradiance (lp = 542 nm). 0.4 0.6 0.8 1.0 Figure 3. Voltage output of Blue Channel vs. irradiance (lp = 460 nm). VOLTAGE OUTPUT – VO (V) VOLTAGE OUTPUT – VO (V) GS:10 GS:01 0.2 IRRADIANCE – Ee (mW/cm2) Figure 2. Dark voltage vs. operating temperature. 4.0 3.6 3.2 GS:00 2.8 TA – OPERATING TEMPERATURE (°C) 4.8 4.4 GS:01 GS:10 4.0 3.6 GS:01 GS:00 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 0 0.2 0.4 0.6 IRRADIANCE – Ee (mW/cm2) Figure 5. Voltage output of Red Channel vs. irradiance (lp = 645 nm). Recommended Reflow Profile It is recommended that Henkel Pb- free solder paste LF310 be used for soldering HDJD-S722-QR999. Below is the recommended reflow profile. T-peak T-reflow 230 ± 5°C 218°C DELTA-FLUX = 2°C/sec. max. TEMPERATURE T-max. T-min. DELTA-COOLING = 2°C/sec. max. 160°C 120°C DELTA-RAMP = 1°C/sec. max. 40-60 sec. max. 20-40 sec. max. t-pre t-reflow TIME Figure 6. Recommended reflow soldering profile. 16 Lead QFN Recommended PCB Land Pad Design IPC-SM-782 is used as the standard for the PCB land-pad design. Recommended PCB finishing is gold plated. 0.8 mm 0.4 mm Recommendations for Handling and Storage of HDJDS722-QR999 This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling Of Moisture Sensitive Surface Mount Devices for details. A. Storage before use • Unopened moisture barrier bag (MBB) can be stored at 30°C and 90%RH or less for maximum 1 year 3.19 mm 5.5 mm • It is not recommended to open the MBB prior to assembly (e.g. for IQC) • It should also be sealed with a moisture absorbent material (Silica Gel) and an indicator card (cobalt chloride) to indicate the moisture within the bag B. Control after opening the MBB • The humidity indicator card (HIC) shall be read immediately upon opening of MBB 3.9 mm • The components must be kept at <30°C/60%RH at 5.5 mm all time and all high temperature related process including soldering, curing or rework need to be Figure 7. completed within 72hrs C. Control for unfinished reel • For any unused components, they need to be stored 16 Lead QFN Recommended Stencil Design in sealed MBB with desiccant or desiccator at <5%RH A stencil thickness of 2.18 mm (6 mils) for this QFN D. Control of assembled boards package is recommended. • If the PCB soldered with the components is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or 0.8 mm desiccator at <5%RH to ensure no components have exceeded their floor life of 72hrs E. Baking is required if: 0.4 mm 0.8 mm • “10%” or “15%” HIC indicator turns pink • The components are exposed to condition of >30°C/60%RH at any time. • The components floor life exceeded 72hrs • Recommended baking condition (in component form): 125°C for 24hrs 0.8 mm 3.19 mm 2.18 mm Figure 8. Package Tape and Reel Dimensions 4.00 ± 0.10 SEE NOTE #2 ∅1.55 ± 0.05 2.00 ± 0.05 SEE NOTE #2 B R 0.50 TYP. 1.75 ± .10 5.50 ± 0.05 12.00 ± 0.10 Bo A Ko A 8.00 ± 0.10 B ∅1.50 (MIN.) SECTION B-B Ao A o: B o: K o: PITCH: WIDTH: 0.30 ± 0.05 SECTION A-A 5.30 5.30 2.20 8.00 12.00 NOTES: 1. Ao AND Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET. 2. 10 PITCHES CUMULATIVE TOLERANCE IS ± 0.2 mm. 3. DIMENSIONS ARE IN MILLIMETERS (mm). Reel Dimensions 65° +1.5* 12.4 –0.0 45° R10.65 R5.2 ∅55.0 ± 0.5 45° ∅178.0 ± 0.5 ∅176.0 EMBOSSED RIBS RAISED: 0.25 mm WIDTH: 1.25 mm BACK VIEW NOTES: 1. *MEASURED AT HUB AREA. 2. ALL FLANGE EDGES TO BE ROUNDED. ∅512 18.0 MAX.* ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge. AVAGO TECHNOLOGIES’ PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0136EN AV01-0686EN - January 8, 2007 10