HDJD-S822-QR999 RGB Color Sensor Data Sheet Description Features HDJD-S822-QR999 is a high performance, small in size, cost effective light to voltage converting sensor. The sensor combines a photodiode array and three transimpedance amplifiers in a single monolithic CMOS IC solution. With a Red (R), Green (G) and Blue (B) color filters coated over the photodiode array, the sensor converts RGB light to analog voltage outputs, denoted by VROUT, VGOUT and VBOUT, respectively. The sensor is packaged in a 5x5x0.75 [mm] surface mount QFN-16 package. • Convert light to R,G,B voltage output Applications • Ideal choice of for open loop and closed loop color identification • Potential applications are such as general color detection, industrial process, environmental lighting, cabin lighting, decorative lighting and etc. • Monolithic CMOS IC solution comprises of an array of photodiode coated with R,G, B color filter and integrated with trans-impedance amplifier • Independent gain selection options for each R,G,B channel • Uniform photodiode array design to minimize the effect of contamination and optical aperture misalignment • Robust package and small in size (5x 5x 0.75 mm) Package Dimensions Note: Dimensions are in millimeters (mm) Part Numbering Systems HDJD-S 8 X X - X X X X X Gain Selection (GS) Option 999: GS 00, 01, 10 or 11 Packing Type R: Tape and Reel Product Packaging Q: QFN Product ID 2: 2 Component without IR filter Pin Out for HDJD-S822-QR999 Pin Pin Name Normal Operation Pin 1 VDD5 5 V DC Supply Pin 2 GND Ground Pin 3 GSGRN0 Gain Selection Green bit 0 Pin 4 VDD3 3.3V DC output test pin. To be connected to a decoupling capacitor of 100nF to ground is recommended Pin 5 TEST_EN Tie to VDD3 via a 10kΩ pull up resistor Pin 6 GSRED1 Gain Selection Red bit 1 Pin 7 NC No connection Pin 8 GSGRN1 Gain Selection Green bit 1 Pin 9 VR OUT Analog output voltage for RED Pin 10 VG OUT Analog output voltage for GREEN Pin 11 GSBLUE0 Gain Selection Blue bit 0 Pin 12 VB OUT Analog output voltage for BLUE Pin 13 GSBLUE1 Gain Selection Blue bit 1 Pin 14 NC No connection Pin 15 NC No connection Pin 16 GSRED0 Gain Selection Red bit 0 Theory of Operation The integral R,G,B color filters on the photodiode array detect the R,G,B components of the light falling on the sensor. The photodiode convert the R,G,B light components into photocurrents. The integrated transimpedence amplifiers for R,G,B components then converts the photocurrent to analog voltage outputs. The voltage output of each R,G,B channel increases linearly with increasing light intensity. Sensor IC Block Diagram Absolute Maximum Ratings [1,2] Parameter Symbol Min Max Unit Supply Voltage VDD5 4.5 5.5 V Storage Temperature TS -20 85 °C Operating Temperature TA -20 85 °C Human Body Model ESD Rating ESD HBM 2 kV Notes Reference to JESD22-A114-B Note: 1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. Unless otherwise specified, voltages are referenced to ground. Recommended Operating Conditions Parameter Symbol. Min Typ Max Units Operating Temperature TA 0 25 70 °C Supply Voltage VDD 5.0 Note V A decoupling capacitor of 100nF between VDD and ground is recommended. Operating Conditions and Electrical Requirements Electrical Characteristics at VDD = 5V, TA = 25°C, RL = 68kW Parameter Symbol Conditions Dark voltage VD Ee = 0 Maximum output voltage swing VO MAX Supply current IDD Ee = 0 Parameter Symbol Remark Re GS:00 lP = 460 nm [1] 1.54 GS:00 lP = 542 nm [2] (Green Channel) 2.05 GS:00 lP = 645 nm [3] (Red Channel) 2.73 GS:11 lP = 460 nm [1] (Blue Channel) 0.77 GS:11 lP = 542 nm [2] (Green Channel) 1.03 GS:11 lP = 645 nm [3] (Red Channel) 1.37 GS:01 lP = 460 nm [1] (Blue Channel) 0.39 GS:01 lP = 542 nm [2] (Green Channel) 0.51 GS:01 lP = 645 nm [3] (Red Channel) 0.68 GS:10 lP = 460 nm [1] (Blue Channel) 0.21 GS:10 lP = 542 nm [2] (Green Channel) 0.27 GS:10 lP = 645 nm [3] (Red Channel) 0.36 Irradiance Responsivity Min Min Typ Max Unit 15 mV 3 V 3 mA Typ Max Unit V/(mW/cm2) (Blue Channel) Irradiance Responsivity Irradiance Responsivity Irradiance Responsivity Re Re Re V/(mW/cm2) V/(mW/cm2) V/(mW/cm2) Parameter Symbol Saturation Irradiance [4] Saturation Irradiance [4] Saturation Irradiance [4] Saturation Irradiance [4] Output Rise Time tr Output Fall Time tf Remark Min Typ GS:00 lP = 460 nm [1] (Blue Channel) 1.95 GS:00 lP = 542 nm [2] (Green Channel) 1.46 GS:00 lP = 645 nm [3] (Red Channel) 1.10 GS:11 lP = 460 nm [1] (Blue Channel) 3.90 GS:11 lP = 542 nm [2] (Green Channel) 2.93 GS:11 lP = 645 nm [3] (Red Channel) 2.20 GS:01 lP = 460 nm [1] (Blue Channel) 7.79 GS:01 lP = 542 nm [2] (Green Channel) 5.85 GS:01 lP = 645 nm [3] (Red Channel) 4.40 GS:10 lP = 460 nm [1] (Blue Channel) 14.61 GS:10 lP = 542 nm [2] (Green Channel) 10.98 GS:10 lP = 645 nm [3] (Red Channel) 8.24 GS:10 to GS11 Test Condition: Refer to note [5] 15 GS:00 Test Condition: Refer to note [5] 110 GS:10 to GS11 Test Condition: Refer to note [5] 15 GS:00 Test Condition: Refer to note [5] 120 Notes: 1. Test condition: using blue diffuse light of peak wavelength (lP) 460nm and spectral half width (Δl½) 20nm as light source. 2. Test condition: using green diffuse light of peak wavelength (lP) 542nm and spectral half width (Δl½) 35nm as light source. 3. Test condition: using red diffuse light of peak wavelength (lP) 645nm and spectral half width (Δl½) 20nm as light source. 4. Saturation irradiance = (Max output voltage swing)/(Irradiance responsivity) 5. Test condition: The rise and fall time is measured with RC lowpass filter added to sensor output: Gain Selection Rext Cext GS:01 to GS:11 3.6kΩ 1nF GS:00 36kΩ 1nF Max Unit mW/cm2 mW/cm2 mW/cm2 mW/cm2 ms ms Test Circuit RED CHANNEL R RED CHANNEL SIGNAL GENERATOR + + - C VRout Rext LED RC LOWPASS FILTER TEST CIRCUIT FOR ILLUSTRATION PURPOSE, ONLY RED CHANNEL IS SHOWN. THE SAME CIRCUIT APPLIES TO GREEN AND BLUE CHANNELS. Remarks: For illustration purpose, only red channel is shown. The same circuit applies to green and blue channel. Vout Cext Gain Selection Feedback Resistor Table GSRED1 GSRED0 GSGRN1 GSGRN0 GSBLUE1 GSBLUE0 Feedback Resistor 0 0 0 0 0 0 3.00 MΩ 0 1 0 1 0 1 0.75 MΩ 1 0 1 0 1 0 0.40 MΩ 1 1 1 1 1 1 1.50 MΩ Notes: 1. Gains selections, GS: Bit 1 Bit 0 are applicable for each Red, Green and blue Channel. 2. Gain selections for each channel can be selected independently of each other. 3. Feedback resistor value is proportional to responsivity. Refer to block diagram below. 4. 0 indicates that the pin is connected to ground. 1 indicates no connection. FEEDBACK RESISTOR GS (1:0) RF CF + TRANSIMPEDANCE AMP Typical Characteristics 1 Red RELATIVE RESPONSITIY 0.8 Green 0.6 Blue 0.4 0.2 0 400 450 500 550 600 WAVELENGTH (nm) Figure 1. Spectral Responsivity Note: Test condition is when Gain Selection Jumpers are set to GSBLUE1 = 0 GSGRN1 = 0 GSRED1 = 0 GSBLUE0 = 0 GSGRN0 = 0 GSRED0 = 0 In which 0 = connect to Ground, 1 = no connection. Refer to Gain Selection Feedback Resistor Table. 650 700 750 20 3 16 14 12 10 8 6 4 -20 0 20 40 60 TA - Operating Temperature (°C) GS:01 1.5 GS:10 1 0 80 3 3 Voltage Output - Vo (V) GS:01 1.5 GS:10 1 0.5 0 4 GS:00 2.5 GS:11 2 2 6 8 10 12 14 Figure 3. Voltage output of blue channel vs irradiance (lp = 460 nm) GS:00 2.5 0 Irradiance - Ee (mW/cm 2 ) Figure 2. Dark Voltage vs Operating Temperature Voltage Output - Vo (V) GS:11 2 0.5 2 0 GS:00 2.5 Voltage Output - Vo (V) V D - Dark Voltage (mV) 18 GS:11 GS:01 2 GS:10 1.5 1 0.5 0 2 4 6 8 10 0 12 Irradiance - Ee (mW/cm 2 ) 0 2 4 6 Irradiance - Ee (mW/cm 2 ) 8 10 Figure 5. Voltage output of red channel vs irradiance (lp = 645 nm) Figure 4. Voltage output of green channel vs irradiance (lp = 542 nm) Recommended Reflow Profile It is recommended that Henkel Pb- free solder paste LF310 be used for soldering HDJD-S822-QR999. Below is the recommended reflow profile. T-peak T-reflow 230 ± 5°C 218°C TEMPERATURE DELTA-FLUX = 2 °C/sec. max. T-max. T-min. DELTA-COOLING = 2°C/sec. max. 160°C 120°C DELTA-RAMP = 1°C/sec. max. 40-60 sec. max. 20-40 sec. max. t-pre t-reflow TIME Figure 6. Recommmended Reflow Soldering Profile 16 Lead QFN Recommended PCB Land Pad Design IPC-SM-782 is used as the standard for the PCB land pad design. Recommended PCB finishing is Gold. 0.8 mm 0.4 mm 0.8 mm 3.19 mm 5.5 mm 3.19 mm 3.9 mm 5.5 mm 16 Lead QFN Recommended Stencil Design A stencil thickness of 2.18mm (6 mils) for this QFN package is recommended. 0.8 mm 0.4 mm 0.8 mm ∅ 2.18 mm Recommendations for Handling and Storage of HDJD-S822-QR999 This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling Of Moisture Sensitive Surface Mount Devices for details. A. Storage before use • Unopened moisture barrier bag (MBB) can be stored at 30°C and 90%RH or less for maximum 1 year • It is not recommended to open the MBB prior to assembly (e.g. for IQC) • It should also be sealed with a moisture absorbent material (Silica Gel) and an indicator card (cobalt chloride) to indicate the moisture within the bag B. Control after opening the MBB • The humidity indicator card (HIC) shall be read immediately upon opening of MBB C. Control for unfinished reel • For any unused components, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH D. Control of assembled boards • If the PCB soldered with the components is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no components have exceeded their floor life of 72hrs E. Baking is required if: • “10%” or “15%” HIC indicator turns pink • The components are exposed to condition of >30°C/60%RH at any time. • The components floor life exceeded 72hrs • Recommended baking condition (in component form): 125°C for 24hrs • The components must be kept at <30°C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 72hrs Package Tape & Reel Dimensions 4.00 ± 0.10 SEE NOTE #2 ∅1.55 ± 0.05 2.00 ± 0.05 SEE NOTE #2 B R 0.50 TYP. 1.75 ± .10 5.50 ± 0.05 12.00 ± 0.10 Bo A Ko A 8.00 ± 0.10 B ∅1.50 (MIN.) SECTION B-B Ao 0.30 ± 0.05 SECTION A-A NOTES: 1. A o AND B o MEASURED AT 0.3 mm ABOVE BASE OF POCKET. 2. 10 PITCHES CUMULA TIVE TOLERANCE IS ± 0.2 mm. 3. DIMENSIONS ARE IN MILLIMETERS (mm). 10 A o: B o: Ko: PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 65° +1.5* 12.4 -0.0 45° R10.65 R5.2 45° � 55.0 ± 0.5 ∅ 178.0 ± 0.5 � 176.0 EMBOSSED RIBS RAISED: 0.25 mm WIDTH: 1.25 mm BACK VIEW ∅ 512 NOTES: 1. *MEASURED A T HUB AREA. 2. ALL FLANGE EDGES TO BE ROUNDED. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0110EN - February 27, 2007 18.0 MAX.*