HLMP-CYxx Precision Optical Performance 5mm Round Warm White LED Lamps Data Sheet Description Features These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphor to produce white. • Well defined spatial radiation pattern The typical resulting color is described by the coordinates x= 0.41, y = 0.39 using the CIE 1931 Chromaticity Diagram. These T-1¾ lamps are untinted, non-diffused, and incorporate precise optics which produce welldefined spatial radiation patterns at specific viewing cone angle. • High luminous white emission • Viewing angle: 15°, 23°, 30° and 50° • Standoff or non-standoff leads Package Dimensions Package Dimension A Package Dimension B 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) DIMENSION H 0.70 (0.028) MAX. 2.35 (0.093) MAX. 31.60 MIN. (1.244) 1.14 ± 0.20 (0.045 ± 0.008) 31.60 MIN. (1.244) CATHODE LEAD 1.00 MIN. (0.039) CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) CATHODE FLAT 8.71 ± 0.20 (0.343 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) DIMENSION H: 15°: 12.24 ± 0.25mm (0.482 ± 0.01 inches) 23°: 12.50 ± 0.25mm (0.492 ± 0.01 inches) 30°: 12.00 ± 0.25mm (0.472 ± 0.01 inches) 0.70 (0.028) MAX. 0.50 ± 0.10 (0.020 ± 0.004) SQ. TYP. 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) CATHODE FLAT 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate during handling and processing. Refer to Application Note AN-1142 for additional details. HLMP-CY46/47 Package drawing Package Dimension C Package Dimension D 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 0.70 (0.028) MAX. DIMENSION H 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 0.50 ± 0.10 (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) DIMENSION H: 50°: 11.98 ± 0.25mm (0.4715 ± 0.01 inches) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE FLAT 8.71 ± 0.20 (0.343 ± 0.008) SQ. TYP. 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) Note: 1. All dimensions are in millimeters/ inches. 2. Epoxy meniscus may extend about 1mm (0.040”) down the leads. 3. If heat sinking application is required, the terminal for heat sink is anode. Device Selection Guide Luminous Intensity (mcd) at 20mA Part Number Typical Viewing Angle (˚) Min. Max. Standoff Package Dimension HLMP-CY11-WZ0DD 15 5500 16000 No A HLMP-CY12-WZ0DD 15 5500 16000 Yes B HLMP-CY26-VY0DD 23 4200 12000 No A HLMP-CY27-VY0DD 23 4200 12000 Yes B HLMP-CY36-UX0DD 30 3200 9300 No A HLMP-CY37-UX0DD 30 3200 9300 Yes B HLMP-CY46-TW0DD 50 2500 5500 No C HLMP-CY47-TW0DD 50 2500 5500 Yes D Tolerance for each intensity limit is ± 15%. Part Numbering System HLMP - C Y xx - x x x xx Packaging Option DD: Ammopacks Color Bin Selection 0: Open distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle 11/12: 15° package 26/27: 23° package 36/37: 30° package 46/47: 50° package Color: Y: Warm White Package C: 5mm round Lamps Absolute Maximum Rating TA = 25°C Parameter White Unit DC Forward Current 30 mA Peak Forward Current 100[1] mA Power Dissipation 116 mW Reverse Voltage 5 (IR = 10 μA) V LED Junction Temperature 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 2 2. Duty Factor 10%, frequency 1kHz. Optical/ Electrical Performance at 25°C Parameter Symbol Min Typ Max Units Test Condition Forward Voltage VF 2.8 3.2 3.8 V IF = 20 mA Reverse Voltage VR 5.0 V IR = 10 µA Thermal Resistance RθJ-PIN 240 ˚C/W LED junction to anode lead Chromaticity Coordinate X y 0.41 0.39 IF = 20 mA Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA 2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 35 IF max. - MAXIMUM FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.8 0.6 0.4 0.2 0.0 380 480 580 680 30 25 20 15 10 5 0 780 0 20 WAVELENGTH - nm 1.4 0.001 1 0.8 0.6 0.4 0.2 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA -0.004 20 15 10 5 2 Figure 5. Forward current vs forward voltage 20mA 0 0.002 -0.001 10mA -0.002 -0.003 Figure 4. Chromaticity shift vs forward current 25 FORWARD VOLTAGE - V 0 X-COORDINATE 30 1 -0.002 -0.004 35 35 FORWARD CURRENT - mA -0.006 5mA Figure 3. Relative Intensity vs Forward Current 30mA 0.002 1.2 0 80 0.003 Y-COORDINATE RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.6 0 60 Figure 2. Forward current vs Ambient Temperature Figure 1. Relative Intensity vs. Wavelength 0 40 T A - AMBIENT TEMPERATURE - °C 3 4 0.004 100 1 1 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY Radiation Pattern 0.6 0.4 0.2 0 -90 -60 -30 0 30 60 0.6 0.4 0.2 0 90 -90 ANGULAR DISPLACEMENT - DEGREES 1 1 0.8 0.8 0.6 0.4 0.2 0 0 30 60 90 120 ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation pattern for HLMP-CY36/37 90 Figure 7. Radiation pattern for HLMP-CY26/27 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 6. Radiation pattern for HLMP-CY11/12 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 150 180 0.6 0.4 0.2 0 0 30 60 90 120 ANGULAR DISPLACEMENT - DEGREES Figure 9. Radiation pattern for HLMP-CY46/47 150 180 Intensity Bin Limit Table at 20mA Color bin limits Intensity (mcd) at 20 mA Rank Chromaticity Coordinates Limits Bin Min Max 1 X 0.3610 0.3988 0.3822 0.3545 0.3610 T 2500 3200 Y 0.3850 0.4116 0.3580 0.3408 0.3850 U 3200 4200 X 0.3988 0.4390 0.4129 0.3822 0.3988 V 4200 5500 Y 0.4116 0.4310 0.3725 0.3580 0.4116 W 5500 7200 X 0.4390 0.4970 0.4588 0.4129 0.4390 X 7200 9300 Y 0.4310 0.4466 0.3838 0.3725 0.4310 Y 9300 12000 Z 12000 16000 2 3 Tolerance for each bin limit is ± 0.01 Tolerance for each bin limit is ± 15% Avago Warm white binning on CIE 1931 Chromaticity Diagram 0.500 0.450 y Bin 3 Bin 2 0.400 Bin 1 0.350 Black Body 0.300 0.300 0.350 0.400 0.450 x 0.500 0.550 Precautions: Avago Technologies LED configuration Lead Forming: • The leads of an LED lamp may be performed or cut to length prior to insertion and soldering on PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the LED chip die attach and wirebond. Anode • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Soldering condition: InGaN Device • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED closer than 1.59mm might damage the LED. 1.59mm Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 30 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max • Wave soldering parameter must be set and maintain according to the recommended temperature and dwell time. Customer is advised to daily check on the soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition. • Recommended PC board plated through holes size for LED component leads. Diagonal Plated through hole diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) • Under sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Over sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. LED component lead size Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINARWAVE TURBULENTWAVE HOTAIRKNIFE 250 TEMPERATURE-°C 200 TOPSIDE OFPCBOARD BOTTOMSIDE OFPCBOARD 150 CONVEYORSPEED=1.83M/MIN(6FT/MIN) PREHEATSETTING=150°C(100°CPCB) SOLDERWAVETEMPERATURE=245°C±5˚C AIRKNIFEAIRTEMPERATURE=390°C AIRKNIFEDISTANCE=1.91mm(0.25IN.) AIRKNIFEANGLE=40 SOLDER:SN63;FLUX:RMA LEADFREESOLDER 96.5%Sn;3.0%Ag;0.5%Cu FLUXING 100 50 30 0 NOTE:ALLOWFORBOARDSTOBE SUFFICIENTLYCOOLEDBEFORE EXERTINGMECHANICALFORCE. PREHEAT 10 20 30 40 50 60 70 80 90 100 TIME-SECONDS Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.807±0.039 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 ø\C7;4.00±0.20TYP. A 12.70±0.30 0.50±0.0118 0.70±0.20 A 0.1575±0.008 VIEW A-A 0.0276±0.0079 Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0121EN - March 9, 2007